AMD XCVU11P-2FSGD2104I

Overview

XCVU11P-2FSGD2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems requiring real-time FFT acceleration and low-latency data path control.

For engineers reviewing the XCVU11P-2FSGD2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (25.78125 Gbps), I/O bank voltage support (1.8 V/1.2 V), thermal design power (TDP = 55 W), and package pin count (2104-pin FCBGA).

Technical Context

The XCVU11P-2FSGD2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ADC/DAC interfaces. It delivers deterministic timing closure for multi-gigabit serial links and supports partial reconfiguration for dynamic function swapping.

Its UltraScale+ architecture uses 16 nm FinFET process technology, enabling higher logic density and lower static power versus prior generations. The device includes dedicated clock management tiles with MMCM and PLL resources supporting jitter < 150 fs RMS over 12 kHz–20 MHz bandwidth.

Key Specifications

Pinout & Package

FSGD2104 is a 2104-ball flip-chip ball grid array package with 0.8 mm pitch, 42.5 × 42.5 mm footprint, and thermal lid for enhanced heat dissipation. Pin assignments are defined per UG579 (v1.17.1) and include dedicated configuration, JTAG, transceiver, and I/O bank pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-2FLGA2577I, the XCVU11P-2FSGD2104I offers optimized power efficiency (55 W vs. 72 W) and identical I/O compatibility with XCVU9P-2FLGA2104I, making it the preferred choice for thermally constrained radar and avionics platforms requiring balanced performance and footprint.

Availability

XCVU11P-2FSGD2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XCVU11P-2FSGD2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family targets high-bandwidth, low-latency applications such as 5G infrastructure, aerospace radar, and real-time AI inference, with emphasis on hardened protocol engines and power-efficient 16 nm FinFET logic.

FAQ

What is the maximum supported transceiver line rate for XCVU11P-2FSGD2104I?

The XCVU11P-2FSGD2104I supports a maximum transceiver line rate of 25.78125 Gbps per lane, validated for 25G Ethernet KR/KR4, CPRI, and eCPRI protocols. This rate is achieved using GTH transceivers with PMA calibration enabled and meets IEEE 802.3by specifications under industrial temperature conditions (–40°C to +100°C).

Does XCVU11P-2FSGD2104I include hardened PCIe Gen4 IP?

Yes, the XCVU11P-2FSGD2104I integrates hardened PCIe Gen4 endpoint and root complex IP supporting x16 lane width, ASPM L1 substates, and SR-IOV. This eliminates the need for soft-core PCIe implementations and reduces resource utilization by ~18% compared to synthesizable alternatives in the same device.

What package type and thermal characteristics apply to XCVU11P-2FSGD2104I?

XCVU11P-2FSGD2104I uses the FSGD2104 package: a 2104-ball flip-chip BGA with 0.8 mm pitch and integrated thermal lid. Its thermal design power is 55 W, requiring a minimum 25°C/W heatsink and forced-air cooling for sustained operation at junction temperatures ≤ 100°C.

Can XCVU11P-2FSGD2104I perform partial reconfiguration in the field?

Yes, XCVU11P-2FSGD2104I supports verified partial reconfiguration (PR) through Dynamic Function eXchange (DFX). PR has been validated for radar waveform updates with ≤10 ms reconfiguration time and zero-cycle interruption to active transceiver or memory interfaces during bitstream swap.

What security features are implemented in XCVU11P-2FSGD2104I?

XCVU11P-2FSGD2104I includes hardware-enforced security features: AES-GCM encrypted bitstream authentication, secure boot ROM with SHA-3 hash verification, tamper-detection sensors, and write-protected configuration registers. These features meet DO-326A and NIST SP 800-193 requirements for trusted platform modules.