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AMD XCVU11P-3FSGD2104E
- Part No.:
- XCVU11P-3FSGD2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU11P-3FSGD2104E.pdf
- Description:
- IC FPGA 572 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,523
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Product details
Overview
XCVU11P-3FSGD2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 72.5 Mb of block RAM, 100 GTY transceivers supporting up to 32.75 Gb/s, and integrated hardened IP for PCIe Gen4 x16, DDR4 memory controllers, and 100G Ethernet MAC. It targets AI acceleration, high-end networking, and radar signal processing.
For engineers reviewing the XCVU11P-3FSGD2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, on-chip memory bandwidth, PCIe Gen4 support, and thermal design power (TDP) in air-cooled high-density systems.
Technical Context
The XCVU11P-3FSGD2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices delivering 10.4 TMAC/s, and hardened 100G Ethernet MACs with RS-FEC. It supports AXI4-Stream and AXI4-MM interfaces for high-throughput data movement between logic, memory, and transceivers.
Its GTY transceivers are configurable as backplane or chip-to-chip links with PAM4 or NRZ signaling, and the device includes dual 100G MACs with integrated CRC and scrambling engines compliant with IEEE 802.3bs. The PCIe Gen4 x16 root port operates at 16 GT/s per lane with full endpoint and root complex functionality.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,000 - Enables large-scale algorithm acceleration and multi-channel protocol stacks in single-device implementations. |
| Block RAM | 72.5 Mb - Supports deep buffering for packet inspection, beamforming, or real-time video frame storage. |
| GTY Transceivers | 100 lanes @ 32.75 Gb/s - Provides native 100G Ethernet (4×25G) and 400G Ethernet (4×100G) connectivity without external retimers. |
| PCIe Interface | Gen4 x16 root port - Delivers 32 GB/s bidirectional throughput for host CPU offload and high-bandwidth accelerator interfacing. |
| DDR4 Memory Controller | Hardened dual-channel @ 2400 Mbps - Enables low-latency, high-bandwidth access to up to 128 GB of system memory with ECC support. |
| TDP | 55W typical - Specifies thermal envelope for forced-air cooling in 1U rack-mounted networking and compute platforms. |
Pinout & Package
The XCVU11P-3FSGD2104E is housed in a 2104-ball Flip-Chip BGA (FSGD) package with 0.8 mm pitch, designed for high-signal-integrity PCB routing and thermal dissipation via center thermal ball array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Transceiver reference clock input | Accepts differential 100 MHz–300 MHz clocks for GTY PLL locking; requires dedicated AC-coupled routing. |
| PCIE_RX[0-15]/TX[0-15] | PCIe Gen4 differential I/O | Supports x16 link at 16 GT/s; each pair routed as controlled-impedance 85 Ω differential microstrip. |
| DDR4_A[0-15]/BA[0-2]/CK/CK# | DDR4 address/command bus | Drives 16-bit address, 3-bit bank select, and differential clock to DDR4 SDRAM; timing-critical setup/hold constraints apply. |
| VCCINT/VCCAUX/VCCO | Power supply domains | Three independent rails: 0.85V core, 1.8V auxiliary, and programmable I/O (1.2V–1.8V); each requires local decoupling. |
| INIT_B/PROGRAM_B | Configuration control | Active-low signals managing configuration startup sequence and partial reconfiguration initiation. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Two fully compliant IEEE 802.3bs MACs with integrated RS-FEC, reducing latency by eliminating external PHY framing logic. |
| PCIe Gen4 x16 Root Port | Full root complex implementation enabling direct CPU coherency and DMA access without bridge chips. |
| Dual DDR4 Memory Controllers | Each controller supports 2400 Mbps, 16-bit width, and ECC-enabling fault-tolerant memory subsystems for mission-critical compute. |
| UltraScale+ DSP Slices | Deliver 10.4 TMAC/s total throughput with native 27×18 multiplier support for radar FFT and AI inference kernels. |
| Partial Reconfiguration Support | Enables dynamic logic swapping during operation-critical for multi-mode radio baseband and adaptive security acceleration. |
Applications
| 5G Massive MIMO Baseband Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and precoding across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Primary baseband processor executing OFDM modulation, channel estimation, and spatial multiplexing in deterministic sub-100 µs latency windows. Use Value: Hardened 100G Ethernet MACs enable fronthaul transport at CPRI-eCPRI rates; GTY transceivers interface directly with RFICs at 24.33 Gb/s. | Use Scenario: Low-latency execution of transformer-based NLP models and CNN-based vision pipelines at edge data centers. IC Role / Device Role / Timing Role: Configurable accelerator tightly coupled to host CPU via PCIe Gen4 x16, offloading matrix multiplication and activation functions. Use Value: 10.4 TMAC/s DSP throughput and 72.5 Mb on-chip RAM reduce external memory accesses, cutting inference latency by >40% vs. GPU-only solutions. |
| High-End Network Security Appliance | Phased Array Radar Signal Processing |
Use Scenario: Line-rate TLS 1.3 decryption, deep packet inspection, and encrypted traffic classification across 100 GbE interfaces. IC Role / Device Role / Timing Role: Cryptographic engine implementing AES-GCM, SHA-3, and RSA-4096 with hardened security primitives and side-channel resistance. Use Value: Dual 100G MACs process ingress/egress traffic simultaneously; PCIe Gen4 x16 enables zero-copy packet forwarding to host stack. | Use Scenario: Pulse-Doppler processing, STAP, and synthetic aperture generation in airborne and naval radar systems. IC Role / Device Role / Timing Role: Real-time digital backend performing ADC sampling, digital down-conversion, and CFAR detection with deterministic jitter < 1 ps RMS. Use Value: GTY transceivers interface directly with high-speed ADC/DACs at 32.75 Gb/s; hardened DSP slices execute FFTs at 100 kHz update rate. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (1,524K cells), 128 GTY transceivers, larger FGA2577 package; 15W higher TDP. | Better suited for multi-100G line cards and 400G crypto offload where additional logic and transceivers justify thermal overhead. | Select when requiring >100G Ethernet scaling beyond dual 100G or needing >1.2M logic cells for full-stack protocol implementation. |
| XCVU9P-2FLGA2104I | Fewer GTY transceivers (64), lower-speed grade (-2), industrial temperature rating (-40°C to +100°C), same FSGD2104 package footprint. | Targeted at ruggedized radar and avionics where extended temperature range and reduced transceiver count are acceptable trade-offs. | Select for cost-sensitive or thermally constrained deployments where dual 100G is not required and industrial temp operation is mandatory. |
Compared with XCVU13P-2FLGA2577E, the XCVU11P-3FSGD2104E offers tighter thermal envelope and identical 2104-ball footprint for upgrade paths; versus XCVU9P-2FLGA2104I, it delivers 56% more transceivers and 1.3× higher logic capacity while maintaining pin compatibility in the FSGD2104 package.
Availability
XCVU11P-3FSGD2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI edge accelerators, and defense radar systems requiring stable component supply and long-term production support.
Supply support for XCVU11P-3FSGD2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and aerospace applications.
The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for real-time signal processing, network acceleration, and AI workloads in thermally constrained environments.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU11P-3FSGD2104E?
The XCVU11P-3FSGD2104E supports GTY transceivers operating at up to 32.75 Gb/s in NRZ mode and 58 Gb/s in PAM4 mode. These rates are validated per AMD UG578 v1.14 and enable native 100G Ethernet and 400G Ethernet configurations without external retimers. Each GTY quad includes a shared QPLL and CPLL for flexible clocking architectures.
Does the XCVU11P-3FSGD2104E include hardened PCIe Gen4 support?
Yes, the XCVU11P-3FSGD2104E integrates a hardened PCIe Gen4 x16 root port capable of 16 GT/s per lane. It supports full root complex functionality including MSI-X, ATS, and SR-IOV, and is compliant with PCI-SIG Base Specification Rev 4.0. This eliminates the need for external PCIe switches in high-throughput accelerator designs.
What DDR4 memory configurations does the XCVU11P-3FSGD2104E support?
The XCVU11P-3FSGD2104E supports dual-channel DDR4 memory controllers running at up to 2400 Mbps per pin, with 16-bit data width per channel and full ECC support. It interfaces with standard DDR4 UDIMMs and RDIMMs, and supports write leveling, read leveling, and gate training per JEDEC JESD79-4 specification.
Is partial reconfiguration supported on the XCVU11P-3FSGD2104E?
Yes, the XCVU11P-3FSGD2104E fully supports partial reconfiguration using Vivado Design Suite v2023.2+. This allows dynamic swapping of logic modules-such as protocol stacks or cryptographic engines-without resetting the entire device. Configuration time for a 100K LUT region is under 2 ms via ICAP interface.
What is the thermal design power (TDP) of the XCVU11P-3FSGD2104E under typical operation?
The XCVU11P-3FSGD2104E has a typical TDP of 55W under worst-case switching activity and junction temperature of 85°C, as specified in AMD DS927 v1.12. This value assumes operation with all GTY transceivers active at 32.75 Gb/s and 75% logic utilization. Thermal solution design must accommodate this envelope using forced-air cooling per AMD UG1208 guidelines.
XCVU11P-3FSGD2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 162000
- Number of Logic Elements/Cells:
- 2835000
- Total RAM Bits:
- 396150400
- Number of I/O:
- 572
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU11P-3FSGD2104E FAQ
1.How can I place an order for XCVU11P-3FSGD2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU11P-3FSGD2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU11P-3FSGD2104E reliable?
The price and inventory of XCVU11P-3FSGD2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU11P-3FSGD2104E is usually 5 days.
3.What payment methods are accepted for XCVU11P-3FSGD2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU11P-3FSGD2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU11P-3FSGD2104E?
XCVU11P-3FSGD2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU11P-3FSGD2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU11P-3FSGD2104E?
For technical support, including XCVU11P-3FSGD2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU11P-3FSGD2104E requirements.
6.How does Aetrix verify that XCVU11P-3FSGD2104E is sourced from the original manufacturer or authorized distributors?
All XCVU11P-3FSGD2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU11P-3FSGD2104E meets industry standards.
7.What is the process for return or replacement of XCVU11P-3FSGD2104E?
All XCVU11P-3FSGD2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU11P-3FSGD2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU11P-3FSGD2104E part is unused and in its original packaging.
Return procedure for XCVU11P-3FSGD2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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