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AMD XCVU11P-L2FLGB2104E

Part No.:
XCVU11P-L2FLGB2104E
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
2104-BBGA, FCBGA
Datasheet:
AetrixXCVU11P-L2FLGB2104E.pdf
Description:
IC FPGA 572 I/O 2104FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,575

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Product details

Overview

XCVU11P-L2FLGB2104E from Xilinx is a high-end Virtex UltraScale+ FPGA featuring 3.6M system logic cells, 38 TOP/s DSP compute performance, and support for 58 Gb/s PAM4 transceivers. It integrates up to 8 GB HBM2 memory with 460 GB/s bandwidth and delivers ASIC-class programmable logic for 1+ Tb/s data center networking, waveform processing, and multi-100G packet infrastructure.

For engineers reviewing the XCVU11P-L2FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include HBM2 integration, 58 Gb/s PAM4 transceiver count (48 lanes), DDR4-2666 memory interface, SmartConnect interconnect optimization, and CCIX-enabled cache-coherent acceleration for AI/ML inference pipelines.

Technical Context

The XCVU11P-L2FLGB2104E implements the UltraScale+ architecture on TSMC's 16nm FinFET+ process, incorporating 3D IC stacking for HBM2 integration and ASIC-like clocking with low-skew global networks. It supports dual-mode transceivers (NRZ up to 32.75 Gb/s or PAM4 up to 58 Gb/s) and includes hardened 100G Ethernet MAC with KR4-FEC and 150G Interlaken cores.

SmartConnect IP dynamically optimizes AXI interconnect topology and bridges protocol mismatches, while VCXO and fractional PLL blocks reduce external clock component count. The device enables virtual-monolithic design via registered inter-die routing lines operating above 600 MHz.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells3.6 million system logic cells - enables large-scale packet processing engines or multi-core AI accelerators in single-device implementation
HBM2 CapacityUp to 8 GB integrated HBM2 - eliminates discrete DRAM layout complexity and provides 460 GB/s memory bandwidth for streaming workloads
Transceivers48 × 58 Gb/s PAM4 or 128 × 32.75 Gb/s NRZ - supports multi-terabit switch fabrics and optical line cards without retiming or gearbox ICs
DSP Performance38 TOP/s (21.2 TeraMACs) - delivers fixed- and floating-point compute for real-time radar signal processing or ML inference kernels
Memory InterfaceDDR4-2666 + server-class DIMM support - enables direct attachment of high-capacity memory modules for buffering and caching in network appliances
Hard IP BlocksPCIe Gen3 x16, 100G Ethernet MAC w/KR4-FEC, 150G Interlaken, CCIX ports - reduces soft IP resource usage and latency for data center acceleration
Process Node16nm FinFET+ - achieves >2× performance-per-watt over 7-series FPGAs with static/dynamic power optimizations across fabric, transceivers, and memory

Pinout & Package

Package: Flip-Chip BGA (FCBGA), 2104-pin FLGB package with 0.8 mm pitch, thermally enhanced with integrated heat spreader and HBM2 die stack.

Pin/TerminalCircuit RoleDesign Meaning
VCCINT / VCCAUX / VCCBRAMCore, auxiliary, and BRAM supply railsMultiple isolated voltage domains enable independent power gating and dynamic voltage scaling per logic region
HR I/O Banks (e.g., HR[0]–HR[3])High-performance I/O banksSupport 1.8V/1.5V/1.35V/1.2V signaling with programmable drive strength and termination for DDR4 and SerDes interfaces
GTH/GTY Transceiver BanksMulti-gigabit serial I/OEach bank hosts 4–8 transceivers with dedicated reference clocks, enabling 58 Gb/s PAM4 operation with built-in KR4/PAM4 FEC
HBM2 Interface Pins (CK, DQ, CA)HBM2 memory interfaceDedicated 1024-bit wide bus with embedded PHY and ECC - no external controller required; supports full 460 GB/s bandwidth
PCIe/CCIX/Interlaken Hard IP PinsHardened protocol interfacesDirect connection to PCIe root complex or CCIX host without soft logic; enables cache-coherent accelerator designs

Key Features

FeatureDesign Value
Integrated HBM2 (8 GB)Eliminates PCB-level memory routing congestion and reduces signal integrity risk by integrating DRAM die vertically stacked with FPGA logic die
SmartConnect InterconnectAutomatically selects optimal AXI interconnect topology and inserts protocol bridges - reduces manual integration effort and improves timing closure
VCXO + Fractional PLLReplaces external clock synthesizers and jitter cleaners; enables fine-grained frequency synthesis for PAM4 and Ethernet applications
Hardened 100G Ethernet MACSaves ~60K–100K logic cells per port and cuts dynamic power by up to 90% versus soft MAC implementations
CCIX Cache-Coherent PortsEnables direct CPU–FPGA memory sharing without software-managed DMA, accelerating heterogeneous compute in AI training clusters

Applications

Data Center Acceleration5G Wireless Baseband Processing

Use Scenario: Offloading AI inference, encryption, and packet classification in cloud servers using PCIe-connected FPGA accelerators.

IC Role / Device Role / Timing Role: Programmable co-processor with CCIX-enabled cache coherence and hardened 100G Ethernet MAC for low-latency host interaction.

Use Value: Delivers 38 TOP/s DSP throughput and 460 GB/s HBM2 bandwidth to sustain real-time model execution without off-chip memory bottlenecks.

Use Scenario: Real-time massive MIMO precoding and channel estimation in 5G gNodeB baseband units.

IC Role / Device Role / Timing Role: High-throughput signal processor implementing FFT, filter banks, and beamforming engines with deterministic latency.

Use Value: Leverages 3.6M logic cells and 21.2 TeraMACs to execute multi-layer matrix operations at sub-100 µs latency using on-chip UltraRAM and HBM2.

Optical Transport NetworkingRadar & EW Signal Processing

Use Scenario: Line-side 400G/800G coherent optical module control and forward error correction in DWDM systems.

IC Role / Device Role / Timing Role: Protocol-aware transceiver controller with integrated 58 Gb/s PAM4 SerDes and KP4-FEC for optics backplanes.

Use Value: Achieves 4× serial bandwidth vs. Virtex-7 using 48 × 58 Gb/s lanes, eliminating need for external gearbox ICs and reducing power by 60%.

Use Scenario: Wideband electronic warfare receiver performing real-time spectral analysis and jamming waveform generation.

IC Role / Device Role / Timing Role: High-speed digitizer and waveform synthesizer with 128 × 32.75 Gb/s transceivers and 100G MAC for sensor fusion I/O.

Use Value: Uses hardened Interlaken cores and SmartConnect to route 150G aggregated sensor data streams with sub-cycle determinism across DSP slices and memory banks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-bandwidth FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU13P-L2FLGA2577EHigher logic density (4.4M cells), larger FLGA2577 package (2577 pins), same HBM2 and PAM4 capabilityTargets larger-scale switch fabrics and AI training clusters requiring more parallel compute resourcesSelect when additional logic capacity or I/O count is required beyond XCVU11P-L2FLGB2104E's 2104-pin footprint
XCVU9P-L2FLGA2104ESame 2104-pin FLGA package, lower logic count (2.5M cells), no HBM2, reduced transceiver count (64 NRZ only)Suitable for cost-sensitive 100G–400G transport where HBM2 and PAM4 are not requiredChoose for applications needing PCIe Gen3 x16 and DDR4-2666 but without HBM2 bandwidth or 58 Gb/s PAM4 demands

Compared with XCVU11P-L2FLGB2104E, the XCVU13P offers higher scalability for next-gen AI clusters, while the XCVU9P trades HBM2 and PAM4 for lower cost and power-making XCVU11P-L2FLGB2104E the optimal balance of bandwidth, logic, and integration for 1+ Tb/s infrastructure.

Availability

XCVU11P-L2FLGB2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G baseband processing, and optical transport networking requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCVU11P-L2FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in adaptive computing, delivering FPGA, adaptive SoC, and ACAP technologies for high-performance, power-efficient systems.

The Virtex UltraScale+ product line targets infrastructure applications demanding ASIC-level performance with FPGA flexibility-specifically optimized for 1+ Tb/s networking, AI acceleration, and real-time signal processing.

FAQ

What is the maximum HBM2 bandwidth supported by XCVU11P-L2FLGB2104E?

XCVU11P-L2FLGB2104E supports up to 460 GB/s HBM2 bandwidth via its integrated 8 GB HBM2 stack. This bandwidth is achieved using a dedicated 1024-bit wide interface with on-die PHY and ECC, eliminating external memory controllers and PCB routing constraints. The HBM2 interface operates independently of the logic fabric clock domain and is accessible through AXI4-HM master interfaces in Vivado.

Does XCVU11P-L2FLGB2104E support PCIe Gen4?

No, XCVU11P-L2FLGB2104E integrates hardened PCIe Gen3 x16 blocks only. It does not support PCIe Gen4 signaling or protocol features. For Gen4 compatibility, designers must implement soft PCIe controllers or select newer AMD Versal ACAP devices. The XCVU11P-L2FLGB2104E's PCIe Gen3 blocks include full configuration space, MSI-X, and DMA engine support, validated for use in data center accelerator cards.

How many 58 Gb/s PAM4 transceivers does XCVU11P-L2FLGB2104E include?

XCVU11P-L2FLGB2104E includes 48 transceiver quads capable of 58 Gb/s PAM4 operation, totaling 48 individual 58 Gb/s lanes. Each quad shares reference clocks and power rails, and all PAM4 lanes support KP4-FEC for optical backplane compliance. These transceivers are distinct from the 128 NRZ-capable lanes operating up to 32.75 Gb/s.

Is SmartConnect included in the XCVU11P-L2FLGB2104E silicon or implemented in Vivado?

SmartConnect is a Vivado Design Suite feature that generates optimized AXI interconnect logic during synthesis and implementation-it is not a hardened block in XCVU11P-L2FLGB2104E silicon. The tool automatically selects appropriate interconnect topologies (crossbar, mux, FIFO), inserts protocol bridges (AXI-to-APB, AXI4-Lite), and applies clock domain crossing logic based on user-defined interface requirements and timing constraints.

What security features are implemented in hardware on XCVU11P-L2FLGB2104E?

XCVU11P-L2FLGB2104E includes AES-GCM decryption, RSA-2048 authentication, differential power analysis (DPA) countermeasures, permanent tamper penalty, and improved SEU mitigation. These features are implemented in dedicated on-die hardware blocks-not soft logic-ensuring secure bitstream loading, runtime IP protection, and resistance to physical side-channel attacks during operation.

XCVU11P-L2FLGB2104E Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex® UltraScale+™
Package/Case:
2104-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
162000
Number of Logic Elements/Cells:
2835000
Total RAM Bits:
396150400
Number of I/O:
572
Number of Gates:
-
Voltage - Supply:
0.698V ~ 0.876V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
2104-FCBGA (47.5x47.5)

XCVU11P-L2FLGB2104E FAQ

1.How can I place an order for XCVU11P-L2FLGB2104E through Aetrix?

Please submit a Request for Quotation (RFQ) for XCVU11P-L2FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCVU11P-L2FLGB2104E reliable?

The price and inventory of XCVU11P-L2FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU11P-L2FLGB2104E is usually 5 days.

3.What payment methods are accepted for XCVU11P-L2FLGB2104E?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU11P-L2FLGB2104E transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCVU11P-L2FLGB2104E?

XCVU11P-L2FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCVU11P-L2FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCVU11P-L2FLGB2104E?

For technical support, including XCVU11P-L2FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU11P-L2FLGB2104E requirements.

6.How does Aetrix verify that XCVU11P-L2FLGB2104E is sourced from the original manufacturer or authorized distributors?

All XCVU11P-L2FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU11P-L2FLGB2104E meets industry standards.

7.What is the process for return or replacement of XCVU11P-L2FLGB2104E?

All XCVU11P-L2FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU11P-L2FLGB2104E, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCVU11P-L2FLGB2104E part is unused and in its original packaging.

Return procedure for XCVU11P-L2FLGB2104E:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCVU11P-L2FLGB2104E Tags

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