AMD XCVU11P-L2FLGF1924E

Overview

XCVU11P-L2FLGF1924E from Xilinx is a high-performance Virtex UltraScale+ FPGA featuring 3.6M system logic cells, 38 TOP/s DSP compute performance, and 48×58 Gb/s PAM4 transceivers - enabling multi-terabit packet processing in 100G+ data center interconnects and waveform-intensive radar systems.

For engineers reviewing the XCVU11P-L2FLGF1924E datasheet, pinout, applications, or equivalent options, key selection considerations include HBM2 integration capability, PCIe Gen3 x16 block support, KR4-FEC Ethernet MAC, SmartConnect interconnect optimization, and 16nm FinFET+ power efficiency for thermally constrained deployments.

Technical Context

The XCVU11P-L2FLGF1924E implements the ASIC-class UltraScale+ architecture with monolithic 16nm FinFET+ process, delivering 1.6× fabric performance over Virtex-7 and supporting VCXO + fractional PLL clocking for jitter-sensitive timing paths. It integrates hardened 100G Ethernet MAC with KR4-FEC and 150G Interlaken cores - eliminating soft IP resource overhead and reducing dynamic power by up to 90% versus RTL implementations.

This device includes SmartConnect IP interconnect optimization for AXI-based subsystems, automatic interface bridging, and registered inter-die routing lines enabling >600 MHz operation in 3D IC configurations. Its HBM2 controller supports up to 8 GB in-package DRAM at 460 GB/s bandwidth, with 10× higher memory bandwidth than discrete DDR4 channels.

Key Specifications

Pinout & Package

Package: Flip-Chip BGA (FCBGA), 1924-pin, 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant. Thermal solution requires active cooling for sustained 38 TOP/s operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCVU11P-L2FLGF1924E, the XCVU13P offers headroom for future scalability but increases PCB area and cooling requirements, while the XCVU9P reduces footprint and power at the expense of transceiver count and HBM capacity - making XCVU11P-L2FLGF1924E the balanced choice for 100G–400G mid-tier systems.

Availability

XCVU11P-L2FLGF1924E is available at Aetrix Electronics and suitable for data center acceleration, coherent optical transport, radar signal processing, and edge AI inference requiring stable component supply across multi-year production cycles.

Supply support for XCVU11P-L2FLGF1924E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx (now part of AMD) is a pioneer in programmable logic, delivering FPGA, adaptive SoC, and ACAP technologies since 1984. Its devices serve high-performance computing, communications, and aerospace markets globally.

The Virtex UltraScale+ family targets systems demanding massive bandwidth, ultra-low latency, and hardware adaptability - including cloud infrastructure, 5G infrastructure, and defense electronics where ASIC-level performance must coexist with field-upgradable functionality.

FAQ

What is the maximum supported HBM2 bandwidth for XCVU11P-L2FLGF1924E?

The XCVU11P-L2FLGF1924E supports up to 460 GB/s HBM2 bandwidth via its integrated 8 GB HBM2 stack. This bandwidth is achieved using a 1024-bit wide interface operating at 450 MHz, and it is fully accessible to both fabric logic and hardened IP blocks such as the 100G Ethernet MAC and PCIe Gen3 x16 controller. The XCVU11P-L2FLGF1924E does not require external memory controllers or PHYs to utilize this bandwidth.

Does XCVU11P-L2FLGF1924E include hardened PCI Express Gen3 x16 support?

Yes, XCVU11P-L2FLGF1924E includes a fully integrated, hardened PCI Express Gen3 x16 block capable of 128 Gb/s bidirectional throughput. It supports endpoint and root complex configurations, includes cache-coherent CCIX ports for CPU-FPGA data sharing, and features expanded virtualization capabilities for data center workloads. The XCVU11P-L2FLGF1924E does not require soft IP or additional licensing to implement this interface.

What transceiver speeds and modulation schemes does XCVU11P-L2FLGF1924E support?

XCVU11P-L2FLGF1924E supports 48 transceivers configurable for NRZ up to 32.75 Gb/s or PAM4 up to 58 Gb/s. It includes optional KP4-FEC for PAM4 optics and backplanes, and all transceivers share common reference clocks with sub-100 fs RMS jitter. The XCVU11P-L2FLGF1924E transceiver architecture is optimized for chip-to-optics and chip-to-chip links in 400G ZR/ZR+ modules and high-speed interconnects.

Is SmartConnect technology enabled by default in XCVU11P-L2FLGF1924E designs?

Yes, SmartConnect interconnect optimization is automatically applied during Vivado synthesis and implementation for AXI-based subsystems in XCVU11P-L2FLGF1924E projects. It performs automatic interface bridging, bandwidth matching, and topology selection - delivering up to 30% better performance-per-watt and reducing manual interconnect design effort. No additional license or configuration is required to use SmartConnect with XCVU11P-L2FLGF1924E.

What security features are implemented in the XCVU11P-L2FLGF1924E configuration flow?

XCVU11P-L2FLGF1924E implements AES-GCM decryption for encrypted bitstreams, RSA-2048 authentication for signed configuration images, DPA countermeasures against side-channel attacks, and permanent tamper penalty locking upon unauthorized access attempts. These features operate at power-on and are enforced before any user logic executes - ensuring that XCVU11P-L2FLGF1924E remains secure throughout its operational lifecycle in cloud or defense environments.