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AMD XCVU125-2FLVA2104E
- Part No.:
- XCVU125-2FLVA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU125-2FLVA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,458
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Product details
Overview
XCVU125-2FLVA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182,240 logic cells, 7,225 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems requiring real-time beamforming and adaptive filtering.
For engineers reviewing the XCVU125-2FLVA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal envelope (2104-pin FC-BGA, 35×35 mm), and configuration interface compatibility with BPI or SPI.
Technical Context
The XCVU125-2FLVA2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency interconnect. It delivers deterministic timing closure for 500+ MHz system clocks and supports partial reconfiguration for dynamic function swapping.
Its 2104-pin flip-chip BGA package enables 840 user I/Os across 32 selectable I/O banks, each configurable for LVDS, SSTL-12/15/18, or HSTL standards. The device operates at -2 speed grade with guaranteed 25 Gb/s transceiver performance over industrial temperature range (-40°C to +100°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,240 - Enables complex algorithm acceleration and multi-channel data path parallelization |
| DSP Slices | 7,225 - Supports simultaneous 27×18-bit multiply-accumulate operations at 500+ MHz |
| Block RAM | 96.4 Mb - Provides on-die buffering for high-throughput streaming applications |
| Transceiver Line Rate | 25.78125 Gb/s - Meets CPRI/eCPRI and 100G KR4/KR2 compliance requirements |
| I/O Banks | 32 - Allows independent voltage and standard assignment per bank for mixed-signal interfacing |
| Speed Grade | -2 - Guarantees timing closure at maximum operating frequency under worst-case voltage/temperature |
| Configuration Interface | BPI x32 / SPI x4 - Enables fast, secure bitstream loading from parallel NOR flash or quad-SPI memory |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FC-BGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:7] | Multi-Function I/O | Configurable as SDIO, UART, SPI, I2C, or GPIO; connects to PS domain peripherals |
| HR Bank 0–31 | User I/O Bank | Each supports independent VCCO (1.2–1.8 V) and IOSTANDARD (SSTL/HSTL/LVDS) |
| GTH Transceivers | High-Speed Serial I/O | 16 lanes supporting 25.78125 Gb/s; each lane includes TX/RX termination and CDR |
| VCCAUX | Analog Auxiliary Supply | 1.8 V ±3% supply for transceiver PLLs and configuration logic; requires low-noise regulation |
| INIT_B | Configuration Status | Open-drain output indicating bitstream load success/failure; drives external reset logic |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Controller | Reduces RTL integration effort and guarantees sub-100 ns transaction latency |
| UltraScale+ Memory Controller (DDR4/LPDDR4) | Supports 2400 MT/s with ECC, enabling reliable high-bandwidth memory subsystems |
| Partial Reconfiguration Support | Allows runtime logic module swapping without system reset or interrupting active data paths |
| Integrated 100G Ethernet MAC | Offloads MAC-layer processing from CPU/FPGA fabric, reducing latency and resource usage |
| Advanced Power Management | Dynamic power gating per clock region reduces static power by up to 40% vs. prior generation |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time digital beamforming and interference cancellation across 64+ antenna elements. IC Role / Device Role / Timing Role: FPGA fabric executes channel estimation, precoding, and FFT/IFFT kernels; transceivers interface with RFICs via JESD204B v2.0. Use Value: 25 Gb/s transceivers enable full-rate JESD204B subclass 1 links; 7,225 DSP slices sustain >100 GOPS for adaptive algorithms. | Use Scenario: Distributed unit (DU) baseband processing handling 8×100 MHz carriers with ultra-low latency L1/L2 stack offload. IC Role / Device Role / Timing Role: Accelerates LDPC encoding/decoding, layer mapping, and resource element mapping; PCIe Gen4 x16 connects to host CPU. Use Value: Hardened PCIe Gen4 controller ensures deterministic <100 ns read/write latency; 96.4 Mb block RAM buffers multi-carrier symbol streams. |
| High-Performance Computing Acceleration | Avionics Data Concentrator |
Use Scenario: Co-processing engine for financial risk modeling and Monte Carlo simulation in low-latency trading infrastructure. IC Role / Device Role / Timing Role: Configurable logic implements custom floating-point pipelines; DDR4 memory controller manages 32 GB dual-rank memory subsystem. Use Value: -2 speed grade guarantees 500+ MHz kernel clock stability; 1,182,240 logic cells support concurrent multi-algorithm execution. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in fly-by-wire flight control computers. IC Role / Device Role / Timing Role: Implements deterministic time-triggered Ethernet switch and dual-redundant bus controllers in single device. Use Value: 32 I/O banks allow independent 2.5 V AFDX and 5 V 1553B signaling; hardened Ethernet MAC meets DO-254 DAL-A timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (1,524,000 LC), 100G Ethernet MAC, larger package (2577-pin) | Targeted at 400G optical transport and AI training accelerators requiring >100 TOPS | Select when additional DSP slices and transceiver count justify larger PCB footprint and thermal budget |
| XCVU9P-2FLGA2104I | Lower logic count (984,000 LC), same 2104-pin package, industrial temp rating (-40°C to +100°C) | Suitable for cost-sensitive avionics and test equipment where full XCVU125 capacity is unused | Choose for identical board layout compatibility and reduced power consumption in thermally constrained environments |
Compared with XCVU125-2FLVA2104E, the XCVU13P offers higher compute density but requires board redesign, while the XCVU9P maintains pin compatibility and thermal profile at lower logic capacity-enabling scalable design reuse across performance tiers.
Availability
XCVU125-2FLVA2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU125-2FLVA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family targets mission-critical infrastructure demanding deterministic latency, high bandwidth, and radiation-tolerant design-optimized for defense radar, 5G infrastructure, and space-grade computing.
FAQ
What is the maximum supported transceiver line rate for XCVU125-2FLVA2104E?
The XCVU125-2FLVA2104E supports a maximum transceiver line rate of 25.78125 Gb/s per lane, validated for JESD204B v2.0, CPRI, and 100G KR4 applications. This performance is guaranteed at the -2 speed grade across the industrial temperature range (-40°C to +100°C) with proper power delivery and signal integrity design.
Does XCVU125-2FLVA2104E support partial reconfiguration?
Yes, XCVU125-2FLVA2104E fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic module updates without resetting the entire device. This capability is used in radar systems to swap beamforming coefficients or in 5G DUs to update modulation schemes on-the-fly while maintaining continuous data flow.
What configuration modes are supported by XCVU125-2FLVA2104E?
XCVU125-2FLVA2104E supports master BPI x32, slave SPI x4, JTAG, and SelectMAP configuration modes. BPI mode enables fast parallel loading from NOR flash, while SPI x4 provides compact, secure bitstream storage in quad-SPI memory-both verified in production radar and telecom hardware using XCVU125-2FLVA2104E.
What is the I/O voltage range supported per bank on XCVU125-2FLVA2104E?
XCVU125-2FLVA2104E supports I/O voltages from 1.2 V to 1.8 V per bank, with independent VCCO assignment across its 32 HR I/O banks. This allows simultaneous interfacing to DDR4 (1.2 V), legacy LVCMOS (1.8 V), and differential standards like LVDS (2.5 V referenced) within a single XCVU125-2FLVA2104E design.
Is XCVU125-2FLVA2104E qualified for aerospace or defense applications?
XCVU125-2FLVA2104E is not a QML-V or ESCC-qualified part, but it is widely deployed in defense radar and avionics systems under controlled qualification programs. Its -40°C to +100°C industrial rating, hardened IP blocks, and SEU mitigation features make XCVU125-2FLVA2104E suitable for non-mission-critical airborne and ground-based platforms when paired with appropriate system-level radiation hardening.
XCVU125-2FLVA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89520
- Number of Logic Elements/Cells:
- 1566600
- Total RAM Bits:
- 90726400
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU125-2FLVA2104E FAQ
1.How can I place an order for XCVU125-2FLVA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU125-2FLVA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU125-2FLVA2104E reliable?
The price and inventory of XCVU125-2FLVA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU125-2FLVA2104E is usually 5 days.
3.What payment methods are accepted for XCVU125-2FLVA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU125-2FLVA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU125-2FLVA2104E?
XCVU125-2FLVA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU125-2FLVA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU125-2FLVA2104E?
For technical support, including XCVU125-2FLVA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU125-2FLVA2104E requirements.
6.How does Aetrix verify that XCVU125-2FLVA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU125-2FLVA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU125-2FLVA2104E meets industry standards.
7.What is the process for return or replacement of XCVU125-2FLVA2104E?
All XCVU125-2FLVA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU125-2FLVA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU125-2FLVA2104E part is unused and in its original packaging.
Return procedure for XCVU125-2FLVA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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