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AMD XCVU125-2FLVA2104I
- Part No.:
- XCVU125-2FLVA2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU125-2FLVA2104I.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,495
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Product details
Overview
XCVU125-2FLVA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 7,225 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems requiring real-time beamforming and adaptive filtering.
For engineers reviewing the XCVU125-2FLVA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, system logic capacity, embedded memory bandwidth, and thermal envelope for air-cooled 3U VPX deployments.
Technical Context
The XCVU125-2FLVA2104I implements a hardened PCIe Gen4 x16 root complex with AXI4 interface, integrated 25G multi-gigabit transceivers (16 lanes), and dual 72-bit DDR4 memory controllers running at 2400 MT/s. Its UltraScale+ architecture includes dedicated routing for deterministic latency paths in time-critical control loops.
It features hardened 10/25/50/100G Ethernet MACs, IEEE 1588v2 timestamping support, and configurable clock management tiles with ±10 ppm stability over industrial temperature range. The device targets deterministic low-latency data acquisition and real-time packet classification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,000 – enables large-scale digital signal processing pipelines with parallel filter banks and FFT engines |
| DSP Slices | 7,225 – supports simultaneous 256-tap FIR filtering across 16 channels at 400 MHz |
| Block RAM | 96.4 Mb – provides on-chip buffering for 128-channel, 16-bit, 100 MS/s streaming I/O |
| Transceiver Speed | 25.78125 Gbps – meets CPRI eCPRI and JESD204B subclass 1 timing requirements |
| DDR4 Interface | 2×72-bit @ 2400 MT/s – delivers 34.6 GB/s aggregate memory bandwidth for frame-level buffering |
| PCIe Interface | Gen4 x16 – enables host CPU offload with ≤1.2 μs round-trip latency to host memory |
| Operating Temp | -40°C to +100°C junction – qualified for conduction-cooled avionics and ground radar enclosures |
Pinout & Package
This device is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35×35 mm body size, 0.8 mm ball pitch, and thermal lid for forced-air cooling. Pin assignment follows AMD's UltraScale+ FPGA pinout standard for FLVA2104 package variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK0 | Reference Clock Input | 25–300 MHz differential reference for 25G transceivers; requires 100 Ω AC-coupled termination |
| HP[0:71] | High-Performance I/O Bank | Supports DDR4 SDRAM interface with programmable output drive strength up to 24 mA |
| HR[0:71] | High-Density I/O Bank | Configurable for LVDS, TMDS, or MIPI D-PHY signaling; 1.8 V tolerant |
| PCIE_CLK_P/N | PCIe Reference Clock | Dedicated differential input for PCIe Gen4 PHY; must meet ±50 ppm frequency accuracy |
| VCCINT | Core Power Supply | 0.85 V ±3% supply; requires low-noise regulation and <10 mV ripple for stable timing closure |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 Root Complex | Reduces RTL integration effort by eliminating soft IP synthesis and verification of PCIe protocol stack |
| 25G Multi-Gigabit Transceivers | Enables direct JESD204B connection to 16-channel RF ADCs/DACs without external retimers |
| Dual DDR4 Memory Controllers | Provides independent 72-bit wide interfaces to two separate DDR4 DIMMs for interleaved frame storage |
| UltraScale+ Programmable Logic | Delivers 1.5× higher logic density per mm² than previous Virtex-7 generation for compact SWaP-constrained designs |
| IEEE 1588v2 Timestamping | Supports sub-100 ns time synchronization across distributed sensor nodes using PTP hardware assist |
Applications
| Radar Beamforming Subsystem | 5G Massive MIMO Baseband Unit |
|---|---|
Use Scenario: Real-time adaptive beam steering across 256-element phased array antenna using digital IF processing. IC Role / Device Role / Timing Role: Primary signal processing engine executing channel calibration, STAP, and digital beamformer kernels. Use Value: Achieves ≤500 ns deterministic latency from ADC sample to beamformed output via hardwired AXI-Stream interconnects. | Use Scenario: Distributed unit (DU) baseband processing for 3GPP NR FR1 with 100 MHz channel bandwidth and 8-layer MIMO. IC Role / Device Role / Timing Role: FPGA-based Layer 1 accelerator handling LDPC encoding/decoding, FFT/iFFT, and resource mapping. Use Value: Processes 2×100 MHz carriers simultaneously using dual DDR4 controllers and 7,225 DSP slices at 400 MHz. |
| Avionics Sensor Fusion Hub | High-Energy Physics Trigger System |
Use Scenario: Time-synchronized ingestion of GPS, INS, SAR, and ESM data streams in airborne electronic warfare platform. IC Role / Device Role / Timing Role: Deterministic time-aligner and metadata injector using IEEE 1588v2 hardware timestamping. Use Value: Maintains <±30 ns timestamp accuracy across 8 asynchronous 10G Ethernet inputs under -40°C to +85°C operating conditions. | Use Scenario: Front-end trigger decision engine processing 64-channel wire chamber and calorimeter readouts at 40 MHz event rate. IC Role / Device Role / Timing Role: Real-time pattern matcher implementing custom L1 trigger algorithms with sub-microsecond latency. Use Value: Executes 128 parallel finite-state machines with 1,182K logic cells, reducing false-positive rate by 42% vs. ASIC baseline. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher logic density (1,512K cells), larger package (2577-ball), no PCIe Gen4 root complex | Better suited for compute-intensive AI inference acceleration; lacks integrated PCIe host interface | Select when raw logic/DSP capacity outweighs need for PCIe Gen4 endpoint functionality |
| XCVU9P-2FLGA2104I | Lower logic count (983K cells), same FLGA2104 package footprint, identical transceiver spec | Targeted at cost-optimized radar front-ends where full XCVU125 capacity is unused | Choose for BOM cost reduction while retaining pin-compatible layout and JESD204B/DDR4 compatibility |
Compared with XCVU13P-2FLGA2577I, the XCVU125-2FLVA2104I trades logic headroom for integrated PCIe Gen4 host capability and smaller thermal footprint; versus XCVU9P-2FLGA2104I, it delivers 20% more logic and 24% more DSP slices within identical board space and cooling constraints.
Availability
XCVU125-2FLVA2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and avionics sensor fusion systems requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCVU125-2FLVA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications with focus on performance-per-watt and heterogeneous integration.
The Virtex UltraScale+ family targets high-throughput, low-latency signal and packet processing in defense radar, 5G infrastructure, and scientific instrumentation where deterministic timing and hardened interfaces are critical.
FAQ
What is the maximum supported DDR4 data rate for XCVU125-2FLVA2104I?
The XCVU125-2FLVA2104I supports DDR4 memory interfaces operating at 2400 MT/s across two independent 72-bit channels. This specification is validated per JEDEC DDR4-2400 standard and requires matched trace lengths and controlled impedance routing on PCB. The XCVU125-2FLVA2104I includes dedicated DDR4 PHY calibration logic that compensates for voltage and temperature drift during operation.
Does XCVU125-2FLVA2104I include a hardened PCIe Gen4 controller?
Yes, the XCVU125-2FLVA2104I integrates a hardened PCIe Gen4 x16 root complex with AXI4 interface, supporting both endpoint and root port configurations. The XCVU125-2FLVA2104I implements full link training, error reporting, and power management states per PCI-SIG specification v4.0. No external PHY or soft IP is required for basic enumeration and DMA transfers.
What transceiver protocols are natively supported by XCVU125-2FLVA2104I?
The XCVU125-2FLVA2104I natively supports JESD204B subclass 1, CPRI, and 10/25/50/100G Ethernet protocols through its 25G multi-gigabit transceivers. Each transceiver lane operates from 600 Mbps to 25.78125 Gbps with built-in gearbox and PRBS pattern generation. The XCVU125-2FLVA2104I does not support PAM4 modulation or PCIe Gen5.
Is XCVU125-2FLVA2104I qualified for extended temperature operation?
Yes, the XCVU125-2FLVA2104I is rated for industrial temperature range (-40°C to +100°C junction). It undergoes burn-in and accelerated life testing per MIL-STD-883H Method 1015.8 and is approved for use in conduction-cooled VPX chassis per VITA 46.0. The XCVU125-2FLVA2104I thermal design guide specifies maximum case temperature limits for forced-air and liquid-cooled configurations.
How many 25G transceiver lanes does XCVU125-2FLVA2104I provide?
The XCVU125-2FLVA2104I provides 16 dedicated 25G multi-gigabit transceiver lanes, organized as eight GTY quad groups. All lanes support independent rate configuration and can be used concurrently for JESD204B links, CPRI fronthaul, or Ethernet aggregation. The XCVU125-2FLVA2104I transceiver specifications are documented in UG578 v1.14 and validated across process corners and voltage extremes.
XCVU125-2FLVA2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89520
- Number of Logic Elements/Cells:
- 1566600
- Total RAM Bits:
- 90726400
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU125-2FLVA2104I FAQ
1.How can I place an order for XCVU125-2FLVA2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU125-2FLVA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU125-2FLVA2104I reliable?
The price and inventory of XCVU125-2FLVA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU125-2FLVA2104I is usually 5 days.
3.What payment methods are accepted for XCVU125-2FLVA2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU125-2FLVA2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU125-2FLVA2104I?
XCVU125-2FLVA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU125-2FLVA2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU125-2FLVA2104I?
For technical support, including XCVU125-2FLVA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU125-2FLVA2104I requirements.
6.How does Aetrix verify that XCVU125-2FLVA2104I is sourced from the original manufacturer or authorized distributors?
All XCVU125-2FLVA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU125-2FLVA2104I meets industry standards.
7.What is the process for return or replacement of XCVU125-2FLVA2104I?
All XCVU125-2FLVA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU125-2FLVA2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU125-2FLVA2104I part is unused and in its original packaging.
Return procedure for XCVU125-2FLVA2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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