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AMD XCVU125-2FLVB1760E
- Part No.:
- XCVU125-2FLVB1760E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCVU125-2FLVB1760E.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,392
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Product details
Overview
XCVU125-2FLVB1760E from AMD is a high-performance Virtex UltraScale FPGA featuring 1,182,240 logic cells, 7,225 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen3 x16, DDR4 memory interfaces up to 2400 Mbps, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in radar signal processing systems requiring deterministic low-latency data path acceleration.
For engineers reviewing the XCVU125-2FLVB1760E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (832 user I/Os), transceiver line rate (16.3 Gbps), thermal design power (52W typical), and package compatibility with FLVB1760 footprint.
Technical Context
The XCVU125-2FLVB1760E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen3, Ethernet MAC, and memory controllers, and multi-gigabit transceivers compliant with IEEE 802.3bj and CPRI. Its UltraScale+ architecture enables time-critical deterministic routing via dedicated clock networks and dynamic function exchange support.
It integrates 24 GTY transceivers with PMA operating up to 16.3 Gbps, supports AXI4-Stream and AXI4-Full interconnect protocols, and delivers 2.5 TMAC/s peak DSP performance. Configuration is performed via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC-SHA256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,240 - determines maximum combinational/sequential logic capacity for custom datapath implementation |
| DSP Slices | 7,225 - enables parallel execution of fixed/floating-point arithmetic for radar FFT and beamforming |
| Block RAM | 96.4 Mb - provides on-die memory for frame buffering and coefficient storage without external DRAM |
| User I/O Count | 832 - supports high-pin-count interface aggregation (e.g., multiple ADC/DAC banks or sensor arrays) |
| GTY Transceivers | 24 × 16.3 Gbps - delivers serial connectivity for JESD204B/C, CPRI, and optical fronthaul links |
| Speed Grade | -2 - guarantees timing closure at highest operating frequency under industrial temperature conditions |
| TDP | 52 W typical - defines thermal solution requirements for conduction-cooled enclosures in avionics |
Pinout & Package
This device is housed in a 1760-ball Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB layouts and controlled impedance routing. Thermal and power delivery are optimized via dedicated VCCINT/VCCAUX/VCCO balls and thermal balls in central array.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | Configurable as PS peripherals (UART, SPI, I2C, SDIO) or PL-connected general-purpose I/O |
| HP[0:63] | High-Performance I/O Bank | Supports 1.8V/1.5V/1.35V/1.25V signaling for DDR4, LPDDR4, and source-synchronous interfaces |
| HR[0:95] | High-Density I/O Bank | Provides flexible voltage support (3.3V/2.5V/1.8V) for legacy parallel buses and control signals |
| GTYTXn/GTYRXn | Transceiver Differential Pair | Each pair routes full-rate JESD204B/C or CPRI lanes with integrated CDR and equalization |
| VCCINT | Core Power Supply | 1.0V ±3% supply for logic fabric and CLBs; requires low-noise regulation and local decoupling |
| INIT_B | Configuration Status | Active-low open-drain output indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen3 x16 Root Port | Reduces latency and resource usage for host CPU offload in embedded computing nodes |
| UltraScale+ Memory Controller | Enables single-chip DDR4-2400 interface with ECC support, eliminating external memory controller IC |
| Dynamic Function eXchange (DFX) | Allows partial reconfiguration of logic regions during operation for adaptive waveform processing |
| AES-256 + HMAC-SHA256 Bitstream Encryption | Meets DO-326A/ED-202A security requirements for airborne mission-critical firmware |
| AXI4-Stream Interconnect Fabric | Provides zero-overhead streaming between IP blocks (e.g., ADC interface → FFT → DMA → PCIe) |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and STAP on phased-array radar front ends. IC Role / Device Role / Timing Role: Configurable datapath accelerator implementing adaptive filtering, CFAR detection, and beam steering logic. Use Value: Achieves sub-500 ns latency from ADC sample to target report via deterministic routing and hard IP integration. | Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR base stations. IC Role / Device Role / Timing Role: Real-time DPD coefficient update engine interfacing with RFICs via JESD204C at 24.33 Gbps. Use Value: Delivers 4096-point FFT/IFFT in <1.2 μs using pipelined DSP slices and block RAM-based twiddle storage. |
| Avionics Data Concentrator | High-Energy Physics Trigger System |
Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: Deterministic switch fabric with time-aware shaping and redundant path arbitration. Use Value: Guarantees <100 ns jitter on time-triggered AFDX frames using dedicated clock networks and static timing analysis. | Use Scenario: Level-1 trigger decision in particle collider detectors with >100 Gbps input bandwidth. IC Role / Device Role / Timing Role: Parallel pattern matching engine scanning hit data streams against configurable LUT-based signatures. Use Value: Processes 128 concurrent 10 Gbps optical links with <200 ns end-to-end latency using GTY transceivers and distributed RAM. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGB2104E | Higher logic density (1,557,000 LCs), 32 GTY transceivers, larger FLGB2104 package (2104-ball) | Better suited for multi-antenna massive MIMO with >64 RF chains and dual-band operation | Select when additional DSP slices and transceiver count justify larger PCB area and higher TDP (68W) |
| XCVU9P-2FLGA2104E | Lower logic count (984,000 LCs), 20 GTY transceivers, same FLGA2104 package size but different ball map | Targeted at cost-optimized radar ESM receivers with reduced channel count and no CPRI support | Choose for lower-power avionics subsystems where 832 I/Os and 24 GTY lanes exceed requirements |
Compared with XCVU13P-2FLGB2104E and XCVU9P-2FLGA2104E, the XCVU125-2FLVB1760E offers optimal balance of I/O count, transceiver bandwidth, and thermal envelope for single-board radar processors requiring industrial-grade reliability in constrained form factors.
Availability
XCVU125-2FLVB1760E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XCVU125-2FLVB1760E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Virtex UltraScale family targets high-throughput, low-latency signal and packet processing in aerospace, defense, wired/wireless infrastructure, and scientific instrumentation.
FAQ
What is the maximum supported DDR4 data rate for XCVU125-2FLVB1760E?
The XCVU125-2FLVB1760E supports DDR4 memory interfaces up to 2400 Mbps per pin using its hardened memory controller. This capability is validated across all HP I/O banks and requires proper board-level termination, fly-by topology, and VCCO = 1.2V. The XCVU125-2FLVB1760E achieves this rate with built-in write leveling and read leveling calibration logic.
Does XCVU125-2FLVB1760E support partial reconfiguration?
Yes, the XCVU125-2FLVB1760E supports Dynamic Function eXchange (DFX) for partial reconfiguration. This allows runtime updates of specific logic partitions without disrupting system operation. The XCVU125-2FLVB1760E implements DFX through dedicated configuration logic and frame-based bitstream loading, enabling adaptive radar waveform changes or protocol switching.
What transceiver protocols are natively supported by XCVU125-2FLVB1760E?
The XCVU125-2FLVB1760E natively supports JESD204B/C, CPRI, and 10G/25G Ethernet via its 24 GTY transceivers. Each GTY channel operates up to 16.3 Gbps with integrated CDR, TX/RX equalization, and PRBS generation/checking. The XCVU125-2FLVB1760E does not include native support for USB or SATA protocols.
What is the industrial temperature range rating for XCVU125-2FLVB1760E?
The XCVU125-2FLVB1760E is rated for industrial temperature operation from -40°C to +100°C. This rating applies to the full speed grade -2 specification and is verified per JEDEC JESD22-A104. The XCVU125-2FLVB1760E maintains timing closure and functional correctness across this range when operated within specified voltage and cooling conditions.
How many PCIe Gen3 lanes does XCVU125-2FLVB1760E support?
The XCVU125-2FLVB1760E integrates a hardened PCIe Gen3 root port supporting up to x16 lane configuration. It complies with PCI Express Base Specification Revision 3.1 and supports advanced features including ASPM L0s/L1, ECRC, and atomic operations. The XCVU125-2FLVB1760E implements this functionality without consuming programmable logic resources.
XCVU125-2FLVB1760E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89520
- Number of Logic Elements/Cells:
- 1566600
- Total RAM Bits:
- 90726400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCVU125-2FLVB1760E FAQ
1.How can I place an order for XCVU125-2FLVB1760E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU125-2FLVB1760E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU125-2FLVB1760E reliable?
The price and inventory of XCVU125-2FLVB1760E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU125-2FLVB1760E is usually 5 days.
3.What payment methods are accepted for XCVU125-2FLVB1760E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU125-2FLVB1760E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU125-2FLVB1760E?
XCVU125-2FLVB1760E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU125-2FLVB1760E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU125-2FLVB1760E?
For technical support, including XCVU125-2FLVB1760E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU125-2FLVB1760E requirements.
6.How does Aetrix verify that XCVU125-2FLVB1760E is sourced from the original manufacturer or authorized distributors?
All XCVU125-2FLVB1760E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU125-2FLVB1760E meets industry standards.
7.What is the process for return or replacement of XCVU125-2FLVB1760E?
All XCVU125-2FLVB1760E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU125-2FLVB1760E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU125-2FLVB1760E part is unused and in its original packaging.
Return procedure for XCVU125-2FLVB1760E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU125-2FLVB1760E Tags
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