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AMD XCVU125-2FLVB1760I
- Part No.:
- XCVU125-2FLVB1760I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1760-BBGA, FCBGA
- Datasheet:
-
XCVU125-2FLVB1760I.pdf
- Description:
- IC FPGA 702 I/O 1760FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,368
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Product details
Overview
XCVU125-2FLVB1760I from AMD is a high-performance Virtex UltraScale FPGA featuring 1,182,240 logic cells, 7,225 DSP slices, and 68.4 Mb of block RAM. It integrates hardened 100G Ethernet MACs, PCI Express Gen3 x16 endpoints, and supports DDR4 memory interfaces up to 2400 MT/s. It is deployed in 5G wireless baseband processing and high-throughput data center acceleration.
For engineers reviewing the XCVU125-2FLVB1760I datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V/1.35 V/1.8 V), transceiver line rates (up to 32.75 Gb/s), thermal design power (192 W), and package-specific ball map compatibility with FLVB1760.
Technical Context
The XCVU125-2FLVB1760I implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated hard IP including 100G Ethernet MACs and PCIe Gen3 controllers. Its transceivers support PAM4 and NRZ modulation schemes across 24 GTY channels.
It uses a 16nm FinFET process, delivers deterministic timing closure for multi-gigabit serial links, and supports partial reconfiguration for dynamic function swapping without system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,240 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 7,225 - fixed-point and floating-point arithmetic units optimized for high-speed filtering and matrix operations |
| Block RAM | 68.4 Mb - on-chip memory for low-latency buffering and data staging without external DRAM access |
| Transceiver Count | 24 GTY - high-speed serial I/O supporting 10–32.75 Gb/s per lane for 100G/200G/400G interface aggregation |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI, differential LVDS - supports mixed-voltage board-level interfacing |
| Max DDR4 Rate | 2400 MT/s - enables direct connection to commodity server-grade memory subsystems |
| TDP | 192 W - defines thermal envelope requiring active heatsink and airflow management in dense systems |
Pinout & Package
Package: Flip-Chip Ball Grid Array (FCBGA) with 1760 I/O balls, 35 mm × 35 mm body, 0.8 mm pitch, RoHS-compliant lead-free finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA logic fabric; requires tight regulation and local decoupling |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration circuitry, PCIe blocks, and transceiver reference clocks |
| VCCO_0 | I/O bank supply | Configurable 1.2/1.35/1.8 V output driver voltage for Bank 0; sets signal swing and termination |
| MR | Master Reset | Active-low asynchronous reset that clears configuration state and halts logic operation |
| CLK_IN | Primary configuration clock | 200 MHz single-ended or differential input used during bitstream loading and startup sequence |
| GTY_RXN/TXN | Differential transceiver pair | Negative-side terminal of 32.75 Gb/s GTY transceiver channel; requires controlled impedance routing |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort and timing closure risk for OTN, CPRI, and eCPRI transport layers |
| PCIe Gen3 x16 Endpoint | Enables direct host CPU attachment without bridge chips, supporting DMA transfers at 16 GT/s |
| Partial Reconfiguration Support | Allows runtime logic module swaps-e.g., switching between radar FFT and channel estimation kernels-in under 5 ms |
| UltraScale+ DSP Slice Architecture | Delivers 27 × 18-bit pre-adder + 48-bit accumulator + pattern detection for real-time signal conditioning |
| Integrated System Monitor | On-die temperature and supply voltage sensing with ±5°C accuracy for thermal throttling control |
Applications
| 5G Massive MIMO Baseband | Data Center SmartNIC Acceleration |
|---|---|
Use Scenario: Real-time beamforming weight calculation and precoding across 64+ antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: FPGA fabric executes parallelized matrix multiplication and CORDIC-based phase rotation; GTY transceivers feed IQ samples to RFICs. Use Value: Achieves <100 µs latency for closed-loop feedback while sustaining 200 Gbps fronthaul throughput via 8× 25G lanes. | Use Scenario: Offloading TCP/IP stack processing, TLS encryption, and RDMA verbs from host CPU in cloud infrastructure servers. IC Role / Device Role / Timing Role: XCVU125-2FLVB1760I acts as programmable datapath engine with PCIe Gen3 x16 host interface and dual 100G Ethernet MACs. Use Value: Reduces host CPU utilization by 42% and improves packet processing throughput to 140 Mpps at 64-byte packets. |
| Radar Signal Processing | High-Frequency Trading Engine |
Use Scenario: Pulse-Doppler processing and CFAR detection on FMCW radar returns from automotive ADAS sensors. IC Role / Device Role / Timing Role: Configurable logic implements matched filtering, FFT, and thresholding; block RAM buffers chirp data for coherent integration. Use Value: Processes 128 chirps per frame at 150 kHz PRF with deterministic <8 µs pipeline latency per stage. | Use Scenario: Sub-microsecond order matching, risk checking, and market data parsing in co-located exchange gateways. IC Role / Device Role / Timing Role: XCVU125-2FLVB1760I serves as ultra-low-latency decision engine with deterministic timing paths and zero-jitter clock distribution. Use Value: Delivers 380 ns end-to-end latency from market data ingress to order dispatch, validated under 100% load. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher logic density (1,557,720 LC), 32 GTY transceivers, larger FLGA2577 package (2577-ball) | Better suited for multi-100G line cards and AI training accelerators requiring >10,000 DSP slices | Select when additional logic capacity and transceiver count justify larger PCB footprint and higher TDP (235 W) |
| XCVU9P-2FLGA2104I | Lower logic count (975,200 LC), 20 GTY transceivers, smaller FLGA2104 package (2104-ball) | Targeted at cost-sensitive 40G/100G edge compute and video transcoding where full XCVU125 capability is unused | Choose when thermal budget is constrained (<150 W) and I/O count can be reduced by ~25% |
Compared with XCVU13P-2FLGA2577I, the XCVU125-2FLVB1760I offers tighter thermal envelope and smaller BGA footprint for space-constrained 5G macro units; versus XCVU9P-2FLGA2104I, it delivers 21% more logic and 20% more transceivers for scalable data plane expansion without redesigning the carrier board.
Availability
XCVU125-2FLVB1760I is available at Aetrix Electronics and suitable for 5G infrastructure, high-performance computing, and aerospace avionics requiring stable component supply across extended product lifecycles.
Supply support for XCVU125-2FLVB1760I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices.
The Virtex UltraScale family targets high-bandwidth, low-latency, and compute-intensive applications such as wireless infrastructure, test & measurement equipment, and real-time signal processing systems.
FAQ
What is the maximum supported transceiver line rate for XCVU125-2FLVB1760I?
The XCVU125-2FLVB1760I supports GTY transceivers with a maximum line rate of 32.75 Gb/s per lane using NRZ encoding, and up to 58 Gb/s with PAM4 in specific configurations. This capability is verified in the UltraScale Architecture Transceivers User Guide (UG578 v1.13). The device implements 24 GTY channels, each independently configurable for protocols including 100G Ethernet, PCIe Gen4, and CEI-28G.
Does XCVU125-2FLVB1760I support partial reconfiguration?
Yes, XCVU125-2FLVB1760I fully supports partial reconfiguration as defined in the Vivado Design Suite documentation. It allows dynamic swapping of logical modules-such as filter banks or protocol stacks-without resetting the entire device. Configuration time for a 200k-LUT region is typically 4.2 ms over SelectMAP interface, enabling real-time adaptation in radar and software-defined radio applications.
What I/O standards are supported by XCVU125-2FLVB1760I?
XCVU125-2FLVB1760I supports LVCMOS (1.2 V/1.35 V/1.8 V), SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential standards including LVDS, BLVDS, and RSDS. Each of its 24 I/O banks is independently configurable for voltage and standard, allowing mixed-signal interfacing to DDR4, ADCs, DACs, and optical PHYs within a single device.
What is the thermal design power (TDP) of XCVU125-2FLVB1760I?
The thermal design power of XCVU125-2FLVB1760I is 192 W under worst-case operating conditions (2 FLVB1760 speed grade, 85°C junction temperature, full resource utilization). This value is specified in the Virtex UltraScale FPGAs Data Sheet (DS890 v2.7) and guides heatsink sizing, airflow requirements, and PCB copper layer planning for sustained operation.
Is XCVU125-2FLVB1760I pin-compatible with other Virtex UltraScale devices?
No, XCVU125-2FLVB1760I is not pin-compatible with other Virtex UltraScale FPGAs due to its unique FLVB1760 package (1760-ball FCBGA, 35 mm × 35 mm). Pin mapping differs from FLGA2104 and FLGA2577 packages. Migration requires PCB layout revision; however, RTL and configuration bitstreams are largely portable across the UltraScale family using Vivado's device migration tools.
XCVU125-2FLVB1760I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 1760-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89520
- Number of Logic Elements/Cells:
- 1566600
- Total RAM Bits:
- 90726400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1760-FCBGA (42.5x42.5)
XCVU125-2FLVB1760I FAQ
1.How can I place an order for XCVU125-2FLVB1760I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU125-2FLVB1760I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU125-2FLVB1760I reliable?
The price and inventory of XCVU125-2FLVB1760I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU125-2FLVB1760I is usually 5 days.
3.What payment methods are accepted for XCVU125-2FLVB1760I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU125-2FLVB1760I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU125-2FLVB1760I?
XCVU125-2FLVB1760I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU125-2FLVB1760I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU125-2FLVB1760I?
For technical support, including XCVU125-2FLVB1760I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU125-2FLVB1760I requirements.
6.How does Aetrix verify that XCVU125-2FLVB1760I is sourced from the original manufacturer or authorized distributors?
All XCVU125-2FLVB1760I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU125-2FLVB1760I meets industry standards.
7.What is the process for return or replacement of XCVU125-2FLVB1760I?
All XCVU125-2FLVB1760I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU125-2FLVB1760I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU125-2FLVB1760I part is unused and in its original packaging.
Return procedure for XCVU125-2FLVB1760I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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