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AMD XCVU125-2FLVB2104I
- Part No.:
- XCVU125-2FLVB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU125-2FLVB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,090
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Product details
Overview
XCVU125-2FLVB2104I from AMD is a high-performance Virtex UltraScale FPGA featuring 1,182,240 logic cells, 7,225 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). Used in radar signal processing and high-throughput data acceleration systems.
For engineers reviewing the XCVU125-2FLVB2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, thermal envelope, I/O bank voltage support, and configuration interface compatibility.
Technical Context
The XCVU125-2FLVB2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency interconnect. Its UltraScale+ architecture uses 3D-stacked silicon interconnect (SSI) technology across multiple die.
It supports multi-voltage I/O banks (1.2 V to 1.8 V), SelectIO™ technology with SSTL/HSTL/LVCMOS standards, and dual-boot configuration via Quad-SPI or BPI. Configuration security includes AES-256 bitstream encryption and HMAC authentication.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,240 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 7,225 - dedicated arithmetic units supporting 27×18 multiply-accumulate operations per slice |
| Block RAM | 96.4 Mb - distributed memory capacity usable as FIFOs, buffers, or lookup tables |
| Transceiver Max Rate | 28 Gbps - supports PAM4 and NRZ signaling for 100G/200G/400G serial protocols |
| I/O Pins | 832 - user-configurable single-ended or differential I/O across 24 banks |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial and aerospace environments |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe hard IP, and clock management tiles |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V ±2% to high-speed SerDes analog circuitry; critical for jitter performance |
| CCLK | Configuration clock input | Drives internal configuration state machine during master SPI or JTAG programming |
| INIT_B | Configuration status output | Active-low open-drain signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration reset input | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Integrated endpoint/root port logic eliminating external bridge ICs and reducing latency by >300 ns |
| UltraScale+ Memory Controller | Native DDR4-2400 and LPDDR4-4266 support with on-die termination and write-leveling calibration |
| Multi-Tile Architecture | SSI-based interconnect enables scalable logic capacity without sacrificing timing predictability across die boundaries |
| Secure Boot | AES-256 decryption + HMAC-256 authentication ensures bitstream integrity and prevents unauthorized firmware execution |
| Dynamic Function eXchange (DFX) | Enables partial reconfiguration of logic regions while system remains operational, supporting runtime adaptation |
Applications
| Radar Signal Processing | 5G Baseband Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine performing FFT, CFAR, and STAP algorithms with deterministic sub-microsecond latency. Use Value: 28 Gbps transceivers interface directly to ADC/DAC FMC modules; 7,225 DSP slices enable concurrent multi-channel processing at 10+ GSPS aggregate throughput. | Use Scenario: Layer 1 physical layer (PHY) acceleration in massive MIMO 5G gNodeB base stations. IC Role / Device Role / Timing Role: Offloads channel coding (LDPC/Polar), OFDM modulation/demodulation, and precoding from CPU/GPU. Use Value: Native 100G Ethernet MAC and PCIe Gen4 x16 enable direct fronthaul/backhaul connectivity and host co-processing with <500 ns round-trip latency. |
| Data Center SmartNIC | High-Energy Physics Trigger |
Use Scenario: Programmable network interface card for packet filtering, TLS offload, and RDMA acceleration in cloud infrastructure. IC Role / Device Role / Timing Role: Co-processor tightly coupled to ARM-based SoC via AXI4-Stream and PCIe, handling wire-speed packet inspection. Use Value: 832 I/O pins support 4× QSFP28 interfaces; block RAM and DSP resources implement deep packet inspection engines at 100 Gbps line rate. | Use Scenario: Level-1 trigger decision system in particle collider detectors requiring nanosecond-level response. IC Role / Device Role / Timing Role: Deterministic real-time pattern matching engine analyzing raw sensor data streams from silicon trackers. Use Value: -2 speed grade guarantees sub-8 ns path delay; hardened clock networks deliver <50 ps skew across 49 mm package for synchronous multi-sensor correlation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLVB2104I | Higher logic density (1,546,240 LC), 10,560 DSP slices, same package and pinout | Better suited for multi-protocol 400G line cards requiring additional soft-core processors | Select when >1.2M LC or >8K DSP required; shares PCB footprint but needs updated timing constraints |
| XCVU9P-2FLVB2104I | Lower logic count (992,640 LC), 5,760 DSP slices, identical package and pinout | Targeted at cost-sensitive 100G/200G applications with reduced algorithm complexity | Choose for lower power and BOM cost where 7,225 DSP slices and 1.18M LC meet requirements |
Compared with XCVU13P-2FLVB2104I and XCVU9P-2FLVB2104I, the XCVU125-2FLVB2104I delivers optimal balance of DSP throughput, logic capacity, and thermal dissipation for fixed-function radar and 5G PHY workloads without over-provisioning resources.
Availability
XCVU125-2FLVB2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-energy physics instrumentation requiring stable component supply across long product lifecycles.
Supply support for XCVU125-2FLVB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, and embedded systems.
The Virtex UltraScale family targets demanding compute-intensive applications including real-time signal processing, high-speed networking, and scientific instrumentation where deterministic latency and hardware adaptability are critical.
FAQ
What is the maximum transceiver line rate supported by the XCVU125-2FLVB2104I?
The XCVU125-2FLVB2104I supports a maximum transceiver line rate of 28 Gbps using its GTY transceivers. This enables native PAM4 and NRZ signaling for protocols including 100G/200G/400G Ethernet, CPRI/eCPRI, and proprietary high-speed serial links. The 28 Gbps rating is guaranteed under industrial temperature conditions for the -2 speed grade.
Does the XCVU125-2FLVB2104I include hardened PCIe Gen4 IP?
Yes, the XCVU125-2FLVB2104I integrates hardened PCIe Gen4 x16 endpoint and root port logic. This eliminates the need for external PCIe switch or bridge ICs and reduces system latency by more than 300 ns compared to soft IP implementations. The hard IP supports full link training, ASPM, and AER reporting per PCI-SIG specifications.
What I/O standards are supported by the XCVU125-2FLVB2104I?
The XCVU125-2FLVB2104I supports SelectIO™ standards including SSTL-12/15/18, HSTL-I/II, LVCMOS, and differential standards such as LVDS, BLVDS, and RSDS across its 24 I/O banks. Each bank operates independently at voltages from 1.2 V to 1.8 V, enabling mixed-voltage interface designs without level shifters.
Is the XCVU125-2FLVB2104I qualified for industrial temperature operation?
Yes, the XCVU125-2FLVB2104I is rated for industrial temperature operation from -40°C to +100°C. This qualification covers all logic, transceivers, memory controllers, and hardened IP blocks. Thermal design must account for up to 55 W typical power dissipation using the specified 2104-pin FCBGA package with integrated thermal lid.
What configuration modes does the XCVU125-2FLVB2104I support?
The XCVU125-2FLVB2104I supports master SPI, slave SPI, JTAG, and BPI configuration modes. Quad-SPI is commonly used for fast parallel configuration from flash memory, while JTAG enables boundary-scan testing and in-system programming. Dual-boot capability allows fallback to a secondary bitstream if primary configuration fails.
XCVU125-2FLVB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89520
- Number of Logic Elements/Cells:
- 1566600
- Total RAM Bits:
- 90726400
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU125-2FLVB2104I FAQ
1.How can I place an order for XCVU125-2FLVB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU125-2FLVB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU125-2FLVB2104I reliable?
The price and inventory of XCVU125-2FLVB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU125-2FLVB2104I is usually 5 days.
3.What payment methods are accepted for XCVU125-2FLVB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU125-2FLVB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU125-2FLVB2104I?
XCVU125-2FLVB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU125-2FLVB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU125-2FLVB2104I?
For technical support, including XCVU125-2FLVB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU125-2FLVB2104I requirements.
6.How does Aetrix verify that XCVU125-2FLVB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU125-2FLVB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU125-2FLVB2104I meets industry standards.
7.What is the process for return or replacement of XCVU125-2FLVB2104I?
All XCVU125-2FLVB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU125-2FLVB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU125-2FLVB2104I part is unused and in its original packaging.
Return procedure for XCVU125-2FLVB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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