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AMD XCVU125-2FLVC2104E
- Part No.:
- XCVU125-2FLVC2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU125-2FLVC2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,291
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Product details
Overview
XCVU125-2FLVC2104E from AMD is a high-performance Virtex UltraScale FPGA featuring 1,182,240 logic cells, 7,225 DSP slices, and 96.4 Mb of block RAM; it supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade in a 2104-pin Flip-Chip Land Grid Array (FLGA) package for high-end compute acceleration and network processing.
For engineers reviewing the XCVU125-2FLVC2104E datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2V/1.35V/1.8V), transceiver line rates up to 25.78125 Gb/s, thermal design power of 75W, and compliance with JESD78 Class II latch-up immunity.
Technical Context
The XCVU125-2FLVC2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including 100G Ethernet MACs and PCIe Gen4 controllers, and 64 GTY transceivers supporting PAM4 and NRZ modulation. It integrates UltraScale+ SelectIO technology with programmable slew rate and drive strength per bank.
Configuration is performed via quad-SPI, BPI, or JTAG, with support for partial reconfiguration and bitstream encryption using AES-256 and HMAC-SHA-256. The device targets deterministic low-latency signal processing in 5G infrastructure and radar systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,240 - total configurable logic resources for complex RTL implementation |
| DSP Slices | 7,225 - fixed-point and floating-point arithmetic units with 27×18 multipliers |
| Block RAM | 96.4 Mb - distributed and block-based memory for on-chip buffering and lookup tables |
| Transceivers | 64 GTY - 25.78125 Gb/s serial I/O for 100G/400G Ethernet and CPRI/eCPRI links |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - supports mixed-voltage interface coexistence per bank |
| Speed Grade | -2 - guarantees timing closure at highest operating frequencies under industrial temperature range |
| TDP | 75 W - thermal envelope requiring active cooling and PCB copper pour planning |
Pinout & Package
Package: 2104-pin Flip-Chip Land Grid Array (FLVC), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermally enhanced with integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 0.85 V ±3% required for logic fabric and CLB operation |
| VCCAUX | Auxiliary supply | 1.8 V for configuration logic, clock management, and PCIe PHY |
| VCCO_0 | I/O bank supply | Configurable 1.2 V / 1.35 V / 1.8 V per bank for interface voltage matching |
| MGTAVCC | Transceiver analog supply | 0.95 V for GTY transceiver PLL and analog front-end stability |
| CLK_IN | Dedicated clock input | Differential pair supporting 10 MHz–750 MHz for MMCM/PLL reference |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort and latency for OTN and packet processing pipelines |
| PCIe Gen4 x16 Root Port | Enables direct CPU-FPGA coherency with ≤1.5 μs read/write latency in CXL-adjacent designs |
| UltraScale+ SelectIO | Per-bank I/O voltage and standard control eliminates level-shifter components |
| AES-256 Bitstream Encryption | Prevents reverse engineering and unauthorized configuration in deployed systems |
| Partial Reconfiguration | Allows dynamic function swapping without system reset, critical for radar waveform agility |
Applications
| 5G Massive MIMO Baseband Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming matrix computation across 64+ antenna elements with sub-microsecond latency. IC Role / Device Role / Timing Role: Primary compute engine executing custom FFT, channel estimation, and precoding kernels in L1/L2 protocol stack. Use Value: 7,225 DSP slices enable concurrent 1024-point FFTs at 200 MHz, meeting 3GPP Release 16 TDD frame timing. | Use Scenario: Low-latency inference for vision-based autonomous navigation using INT8 quantized ResNet-50 models. IC Role / Device Role / Timing Role: Hardware-accelerated inference pipeline with DMA-controlled weight streaming and fused activation layers. Use Value: Block RAM bandwidth of 1.2 TB/s sustains 256 TOPS INT8 throughput without external memory bottleneck. |
| High-Frequency Trading Engine | Test & Measurement Signal Generation |
Use Scenario: Deterministic order routing with nanosecond timestamping and market data parsing at 100 GbE line rate. IC Role / Device Role / Timing Role: Time-critical packet classifier and ultra-low-jitter timestamp generator synchronized to PTP grandmaster. Use Value: GTY transceivers deliver <12 ns deterministic jitter for sub-100 ns round-trip latency in FIX/OUCH protocol stacks. | Use Scenario: Multi-channel arbitrary waveform generation with phase-coherent 14-bit DAC control at 2.5 GS/s. IC Role / Device Role / Timing Role: Timing controller and pattern sequencer managing DAC sample clocks, trigger alignment, and memory mapping. Use Value: MMCM jitter of 120 fs RMS enables SFDR >75 dBc in RF signal synthesis up to 1 GHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Higher logic density (1,557,250 LC), 72 GTY transceivers, larger 2577-pin FLGA package | Better suited for multi-100G line card consolidation with higher I/O count and bandwidth | Select when >128 GTY lanes or >1.3M logic cells are required; board redesign needed due to package size and pinout change |
| XCVU9P-2FLGA2104I | Lower logic count (992,000 LC), same 2104-pin FLGA package, industrial temperature rating (-40°C to +100°C) | Targeted for ruggedized aerospace/defense deployments where extended temperature tolerance is mandatory | Choose for environments exceeding commercial temperature range; identical footprint allows layout reuse but reduced DSP and RAM capacity |
Compared with XCVU125-2FLVC2104E, the XCVU13P offers greater scalability at the cost of board space and power, while the XCVU9P trades logic capacity for extended thermal reliability in unchanged PCB real estate.
Availability
XCVU125-2FLVC2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator cards, and high-frequency trading hardware requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU125-2FLVC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex UltraScale family targets high-throughput, low-latency compute-intensive applications including wired/wireless infrastructure, test equipment, and military signal processing.
FAQ
What is the maximum supported DDR4 memory interface speed for the XCVU125-2FLVC2104E?
The XCVU125-2FLVC2104E supports DDR4-2400 memory interfaces with 16-bit or 32-bit bus widths per memory controller. This capability enables sustained bandwidth of up to 38.4 GB/s per controller, validated under industrial temperature conditions and compliant with JEDEC DDR4 specifications. The memory interface uses dedicated UltraScale+ memory I/O with built-in calibration and training logic.
Does the XCVU125-2FLVC2104E support partial reconfiguration?
Yes, the XCVU125-2FLVC2104E fully supports partial reconfiguration through Vivado Design Suite tools. This allows dynamic replacement of logical modules-such as filter banks or protocol engines-without resetting the entire device. The feature relies on dedicated configuration logic and frame-based bitstream addressing, enabling runtime adaptation in radar and software-defined radio applications.
What transceiver protocols are natively supported by the GTY transceivers in the XCVU125-2FLVC2104E?
The GTY transceivers in the XCVU125-2FLVC2104E natively support PCIe Gen4, 100G Ethernet (CAUI-4), CPRI, and OTN OTU4. Protocol support is implemented via hardened logic blocks-not soft IP-ensuring deterministic latency and full compliance with IEEE 802.3bs and PCI-SIG specifications. PMA/PMD layers operate up to 25.78125 Gb/s with integrated gearbox and FEC.
Is the XCVU125-2FLVC2104E pin-compatible with other Virtex UltraScale devices in the same package?
No, the XCVU125-2FLVC2104E is not pin-compatible with other Virtex UltraScale devices-even those in the 2104-pin FLVC package-due to differing I/O bank assignments, power pin allocations, and transceiver placement. Each device variant has a unique pinout defined in its respective package drawing (e.g., UG579 for XCVU125). Board-level compatibility requires verification against the exact part-specific mechanical and electrical documentation.
What security features are implemented in the XCVU125-2FLVC2104E for bitstream protection?
The XCVU125-2FLVC2104E implements AES-256 bitstream encryption with HMAC-SHA-256 authentication, secure key storage in eFUSE, and dual-boot configuration with fallback image integrity checking. These features prevent unauthorized access, cloning, or tampering during configuration and runtime. Keys are programmed once and cannot be read back, satisfying Common Criteria EAL5+ requirements for secure deployment.
XCVU125-2FLVC2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89520
- Number of Logic Elements/Cells:
- 1566600
- Total RAM Bits:
- 90726400
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU125-2FLVC2104E FAQ
1.How can I place an order for XCVU125-2FLVC2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU125-2FLVC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU125-2FLVC2104E reliable?
The price and inventory of XCVU125-2FLVC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU125-2FLVC2104E is usually 5 days.
3.What payment methods are accepted for XCVU125-2FLVC2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU125-2FLVC2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU125-2FLVC2104E?
XCVU125-2FLVC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU125-2FLVC2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU125-2FLVC2104E?
For technical support, including XCVU125-2FLVC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU125-2FLVC2104E requirements.
6.How does Aetrix verify that XCVU125-2FLVC2104E is sourced from the original manufacturer or authorized distributors?
All XCVU125-2FLVC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU125-2FLVC2104E meets industry standards.
7.What is the process for return or replacement of XCVU125-2FLVC2104E?
All XCVU125-2FLVC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU125-2FLVC2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU125-2FLVC2104E part is unused and in its original packaging.
Return procedure for XCVU125-2FLVC2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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