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AMD XCVU125-2FLVC2104I
- Part No.:
- XCVU125-2FLVC2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU125-2FLVC2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,794
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Product details
Overview
XCVU125-2FLVC2104I from AMD is a high-performance Virtex UltraScale FPGA featuring 1,182,240 logic cells, 7,225 DSP slices, and 68.4 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and DDR4 memory interfaces up to 2400 Mbps. Used in high-end radar signal processing and 5G massive MIMO baseband units.
For engineers reviewing the XCVU125-2FLVC2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-2), I/O bank voltage flexibility (1.2 V to 1.8 V), and thermal design power (TDP) of 49.5 W under typical operation.
Technical Context
The XCVU125-2FLVC2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ADC/DAC interfaces. It uses 20 nm bulk CMOS process technology and supports partial reconfiguration.
Configuration is performed via quad-SPI, BPI, or JTAG; boot sources include flash, SD card, or external processor. The device includes dedicated clock management tiles with MMCM and PLL support for jitter < 150 fs RMS over 12 kHz–20 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,182,240 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 7,225 - fixed-point and floating-point arithmetic units supporting 27×18 multiply-accumulate per slice |
| Block RAM | 68.4 Mb - distributed as 36 Kb BRAM primitives usable as dual-port memory or FIFO buffers |
| Transceivers | 40 × 28 Gbps - supports PAM4 and NRZ signaling for 5G fronthaul and optical interconnect |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, TMDS - enables direct interface to image sensors, DDR4, and display panels |
| TDP | 49.5 W - measured at junction temperature of 85°C with typical switching activity and full transceiver utilization |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies across industrial temperature range (-40°C to +100°C) |
Pinout & Package
This device is packaged in a 2104-pin Flip-Chip Land Grid Array (FLC) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder bumps for high-power density routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering logic fabric and CLB resources |
| VCCAUX | Auxiliary supply | 1.8 V ±3% powering configuration circuitry, SelectIO banks, and transceiver analog blocks |
| MGTAVCC | Transceiver analog supply | 1.0 V ±3% dedicated rail for 28 Gbps transceiver PLLs and CDR circuits |
| MR | Master reset | Active-low asynchronous reset controlling configuration state machine and internal logic initialization |
| CCLK | Configuration clock | Input clock for slave serial configuration mode; frequency ≤ 100 MHz |
| INIT_B | Configuration status | Open-drain output indicating readiness for configuration or error during bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration | Combines programmable logic, hardened PCIe Gen4, 100G Ethernet MAC, and DDR4 controller in single die |
| Partial reconfiguration | Enables dynamic logic swapping without system reset-critical for mission-critical aerospace payloads |
| UltraScale+ architecture | Delivers 1.5× higher logic density and 2× DSP throughput vs. previous Virtex-7 generation |
| Advanced thermal management | Integrated heat spreader and thermal sensor enable closed-loop fan control and thermal throttling at 100°C junction |
| Security features | Includes AES-256 bitstream encryption, HMAC authentication, and tamper detection with secure boot enforcement |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing adaptive filtering, FFT, and CFAR algorithms with deterministic latency. Use Value: 7,225 DSP slices deliver >2.1 TFLOPS FP16 throughput enabling sub-millisecond response for threat tracking. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR base stations with 64+ antenna elements. IC Role / Device Role / Timing Role: Real-time baseband processor handling OFDM symbol generation, MIMO precoding, and feedback loop control. Use Value: 40 × 28 Gbps transceivers support 8× CPRI/eCPRI links with <10 ns inter-frame skew for precise antenna synchronization. |
| High-Performance Computing Acceleration | Medical Imaging Reconstruction |
Use Scenario: FPGA-accelerated Monte Carlo simulation and lattice QCD computation in datacenter co-processing clusters. IC Role / Device Role / Timing Role: Offload engine interfacing with host CPU via PCIe Gen4 x16, managing DMA transfers and kernel execution. Use Value: 1,182,240 logic cells enable concurrent execution of 128+ parallel compute pipelines with pipelined memory access. | Use Scenario: Real-time iterative reconstruction of PET/CT volumetric datasets exceeding 512×512×200 voxels per second. IC Role / Device Role / Timing Role: Dedicated accelerator for back-projection, denoising, and resolution recovery kernels. Use Value: 68.4 Mb block RAM provides on-chip storage for 3D sinogram buffering, eliminating off-chip DRAM latency bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher logic density (1,512,000 LC), 56× 28 Gbps transceivers, larger package (2577-pin) | Better suited for multi-terabit packet processing where additional transceivers and logic are required | Select when scaling beyond 40 transceiver lanes or requiring >1.3M logic cells |
| XCVU9P-2FLGA2104I | Fewer logic cells (984,000), 24× 28 Gbps transceivers, same 2104-pin FLGA package | Targeted at cost-sensitive 5G small cell and edge AI inference where full XCVU125 capacity is unused | Select when transceiver count and logic usage remain below 60% of XCVU125-2FLVC2104I capability |
Compared with XCVU13P-2FLGA2577I, the XCVU125-2FLVC2104I offers optimized balance of transceiver count and logic density in the 2104-pin footprint; versus XCVU9P-2FLGA2104I, it delivers 20% more logic and 67% more transceivers while maintaining identical board-level mechanical compatibility.
Availability
XCVU125-2FLVC2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and medical imaging acceleration requiring stable component supply across extended product lifecycles.
Supply support for XCVU125-2FLVC2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for datacenter, embedded, and client markets with focus on performance-per-watt efficiency.
The Virtex UltraScale family targets high-bandwidth, low-latency applications including wireless infrastructure, defense radar, and scientific computing-designed to replace ASICs with field-programmable flexibility and rapid time-to-market.
FAQ
What is the maximum supported DDR4 memory data rate for the XCVU125-2FLVC2104I?
The XCVU125-2FLVC2104I supports DDR4 memory interfaces up to 2400 Mbps per pin using its integrated memory controller. This capability is validated across all I/O banks configured for SSTL_12 standard and requires proper PCB layout adherence to JEDEC DDR4 specifications. The XCVU125-2FLVC2104I achieves this rate with built-in write leveling and read leveling calibration sequences.
Does the XCVU125-2FLVC2104I support partial reconfiguration in production systems?
Yes, the XCVU125-2FLVC2104I fully supports partial reconfiguration through Vivado Design Suite tools and runtime drivers. Field updates of specific logic partitions-such as DPD coefficient tables or beamforming weights-can be loaded without resetting the entire device. The XCVU125-2FLVC2104I includes dedicated ICAP and PCAP interfaces to enable secure, authenticated partial bitstream loading.
What thermal solution is recommended for sustained operation of the XCVU125-2FLVC2104I?
A vapor chamber heatsink with ≥45 W thermal resistance (°C/W) and forced airflow ≥200 LFM is recommended for continuous operation at full TDP (49.5 W). The XCVU125-2FLVC2104I integrates a thermal sensor (XADC) that reports junction temperature to the system controller; thermal throttling activates above 100°C to prevent damage. Mounting pressure must comply with AMD's FLC package specification.
Can the XCVU125-2FLVC2104I be configured via PCIe without external flash memory?
Yes, the XCVU125-2FLVC2104I supports PCIe-based configuration through its integrated PCIe Gen4 endpoint. Using the Configuration Access Port (PCAP), a host CPU can stream the bitstream directly over PCIe after power-up, eliminating need for external flash. This method is supported in both Vivado and AMD's runtime SDK, and the XCVU125-2FLVC2104I validates configuration integrity via CRC before releasing DONE.
Is the XCVU125-2FLVC2104I qualified for automotive applications?
No, the XCVU125-2FLVC2104I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific reliability testing, fault injection coverage, and safety documentation required for ASIL-B or higher systems. For automotive ADAS applications, AMD recommends the Xilinx Kintex UltraScale+ family with automotive-grade screening, not the XCVU125-2FLVC2104I.
XCVU125-2FLVC2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 89520
- Number of Logic Elements/Cells:
- 1566600
- Total RAM Bits:
- 90726400
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU125-2FLVC2104I FAQ
1.How can I place an order for XCVU125-2FLVC2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU125-2FLVC2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU125-2FLVC2104I reliable?
The price and inventory of XCVU125-2FLVC2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU125-2FLVC2104I is usually 5 days.
3.What payment methods are accepted for XCVU125-2FLVC2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU125-2FLVC2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU125-2FLVC2104I?
XCVU125-2FLVC2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU125-2FLVC2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU125-2FLVC2104I?
For technical support, including XCVU125-2FLVC2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU125-2FLVC2104I requirements.
6.How does Aetrix verify that XCVU125-2FLVC2104I is sourced from the original manufacturer or authorized distributors?
All XCVU125-2FLVC2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU125-2FLVC2104I meets industry standards.
7.What is the process for return or replacement of XCVU125-2FLVC2104I?
All XCVU125-2FLVC2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU125-2FLVC2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU125-2FLVC2104I part is unused and in its original packaging.
Return procedure for XCVU125-2FLVC2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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