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AMD XCVU13P-1FHGA2104E
- Part No.:
- XCVU13P-1FHGA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-1FHGA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,004
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Product details
Overview
XCVU13P-1FHGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM; it supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces for advanced acceleration in data center and HPC applications.
For engineers reviewing the XCVU13P-1FHGA2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (25G × 64), I/O voltage support (1.8 V / 1.2 V / 1.0 V), thermal design power (TDP = 75 W), and package footprint (FPGA FHGA2104).
Technical Context
The XCVU13P-1FHGA2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and ultra-low-latency memory controllers. It integrates 64 GTY transceivers operating up to 25.78125 Gb/s and supports AXI4-Stream and AXI4-Full interconnect protocols.
Configuration is performed via quad-SPI or BPI flash, JTAG, or SelectMAP; partial reconfiguration is supported. The device uses AMD's 16FF+ process and includes integrated system monitoring (voltage, temperature, current) with I²C interface.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic capacity for custom accelerator kernels |
| DSP Slices | 7,520 - enables high-throughput fixed/floating-point computation for AI inference or signal processing |
| Block RAM | 96.4 Mb - provides on-die memory for buffering, FIFOs, or lookup tables without external DRAM latency |
| GTY Transceivers | 64 × 25.78125 Gb/s - supports 100G Ethernet, PCIe Gen4 x16, or custom serial protocols with forward error correction |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, 1.0/1.2/1.8 V - allows direct interfacing to DDR4, sensors, ADCs, and high-speed serdes PHYs |
| TDP | 75 W - defines thermal envelope requiring active cooling and PCB copper pour planning |
| Package | FHGA2104 - 2104-ball flip-chip BGA, 35 mm × 35 mm, 0.8 mm pitch, with dedicated power/ground ball map |
Pinout & Package
FHGA2104 is a 35 mm × 35 mm flip-chip BGA package with 2104 I/O balls arranged in a 47 × 47 array (excluding corner blanks). Power delivery uses distributed VCCINT/VCCAUX/VCCO banks with dedicated ground balls adjacent to each supply group.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT_00 | Core power supply | Supplies 0.85 V to PL logic; requires low-noise regulation and local decoupling near bank 0 |
| MGTAVCC_00 | Analog transceiver power | Provides 0.92 V to GTY analog circuitry; must be isolated from digital supplies |
| IO_L1P_T0_00 | Programmable I/O bank 0 | Supports 1.0/1.2/1.8 V single-ended or differential standards; configurable per bank |
| SRCLK_00 | Configuration clock input | Drives internal configuration state machine during master SPI or SelectMAP boot |
| INIT_B | Configuration status output | Active-low open-drain signal indicating successful bitstream load or CRC error |
| PROGRAM_B | Configuration reset input | Pulse-low initiates full reconfiguration; asynchronous to all clocks |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous integration | Combines programmable logic, hardened PCIe Gen4, 100G Ethernet, and DMA engines-reduces off-chip interconnect latency and board area |
| Partial reconfiguration | Enables dynamic function swapping without full FPGA reboot-critical for multi-mode radar or adaptive compute workloads |
| UltraScale+ architecture | Delivers 1.5× higher logic density and 2× more DSP throughput vs. previous Virtex-7 generation at same power |
| System monitoring | On-die sensors report real-time die temperature, supply voltages, and current draw via I²C-enables closed-loop thermal management |
| Security features | Includes AES-256 bitstream encryption, HMAC authentication, and secure boot-prevents IP theft and unauthorized firmware loading |
Applications
| AI Acceleration | Data Center Networking |
|---|---|
Use Scenario: Real-time inference for vision-based autonomous systems using INT8 quantized CNN models. IC Role / Device Role / Timing Role: Programmable hardware accelerator executing convolution, pooling, and activation layers with deterministic sub-microsecond latency. Use Value: Achieves >12 TOPS/W efficiency by bypassing GPU memory bottlenecks and leveraging 7,520 DSP slices for parallel MAC operations. | Use Scenario: Smart NIC offloading for RDMA, TLS termination, and packet filtering in cloud servers. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint implementing hardware-accelerated network stack with 100G Ethernet MAC and DMA engines. Use Value: Reduces CPU utilization by 40% and cuts packet processing latency to <500 ns versus software-only implementations. |
| HPC Compute Offload | Radar Signal Processing |
Use Scenario: FPGA-accelerated FFT and beamforming in weather radar simulation clusters. IC Role / Device Role / Timing Role: High-bandwidth data mover interfacing dual DDR4-2400 channels and 64 GTY transceivers for real-time I/Q sample streaming. Use Value: Sustains 200 GB/s aggregate memory bandwidth and 1.6 Tbps serial I/O throughput-enabling real-time 4D Doppler processing. | Use Scenario: Multi-channel phased-array radar front-end with adaptive beam steering and clutter suppression. IC Role / Device Role / Timing Role: Time-critical signal processor running pulse compression, CFAR detection, and STAP algorithms on 96.4 Mb block RAM-resident radar waveforms. Use Value: Delivers <100 ns timing jitter on ADC sampling triggers and supports 12-bit ENOB ADC interfaces at 1.25 GSPS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGA2104E | Higher speed grade (-2): 30% faster timing closure margin, 10% higher TDP (82.5 W) | Better suited for max-frequency designs like 25G line-rate packet parsing or 400G Ethernet MAC | Select if meeting -1 timing constraints requires excessive effort or when targeting worst-case 125°C junction temp |
| XCVU9P-1FHGA2104E | Smaller fabric: 920K logic cells, 5,440 DSP slices, 64 GTY lanes, lower TDP (58 W) | Targeted at cost-optimized 100G NICs or mid-tier AI inference where 7,520 DSPs are not required | Choose when full XCVU13P resources are unused and thermal/power budgets are tighter |
Compared with XCVU13P-1FHGA2104E, the -2 variant trades higher power for timing headroom in frequency-critical paths, while the XCVU9P offers 18% lower logic density and 28% fewer DSPs at reduced thermal and cost overhead-enabling tiered deployment across performance bands.
Availability
XCVU13P-1FHGA2104E is available at Aetrix Electronics and suitable for AI acceleration, data center networking, and HPC compute offload applications requiring stable component supply and long-term roadmap alignment.
Supply support for XCVU13P-1FHGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Virtex UltraScale+ family delivers high-bandwidth, low-latency programmable logic for infrastructure acceleration-targeting workloads where ASIC-level performance meets FPGA flexibility.
FAQ
What is the maximum supported transceiver data rate for XCVU13P-1FHGA2104E?
The XCVU13P-1FHGA2104E supports GTY transceivers operating up to 25.78125 Gb/s per lane. This enables compliance with PCIe Gen4, 100G Ethernet (4×25G), and proprietary high-speed serial protocols. Rate selection is configured per transceiver quad and depends on reference clock stability and board signal integrity.
Does XCVU13P-1FHGA2104E support partial reconfiguration?
Yes, XCVU13P-1FHGA2104E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules-such as switching between different radar waveform generators or AI model partitions-without resetting the entire device or halting I/O operations.
What configuration modes are supported by XCVU13P-1FHGA2104E?
XCVU13P-1FHGA2104E supports master SPI, slave SPI, BPI, SelectMAP, and JTAG configuration modes. Master SPI is commonly used for single-flash boot; SelectMAP enables high-speed parallel configuration from external processors. Configuration mode is selected via mode pins at power-up.
What is the I/O voltage range supported by XCVU13P-1FHGA2104E?
XCVU13P-1FHGA2104E supports I/O banks configurable for 1.0 V, 1.2 V, or 1.8 V operation, compatible with LVCMOS, SSTL, HSTL, and MIPI standards. Each bank's VCCO is independently supplied, enabling mixed-voltage interfaces-for example, DDR4 (1.2 V) and legacy peripherals (1.8 V) on the same device.
Is XCVU13P-1FHGA2104E qualified for industrial temperature operation?
Yes, XCVU13P-1FHGA2104E is rated for industrial temperature range (–40°C to +100°C case temperature). Its thermal design power of 75 W and integrated on-die temperature sensor enable robust thermal management in uncontrolled environments such as outdoor base stations or factory-floor edge servers.
XCVU13P-1FHGA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-1FHGA2104E FAQ
1.How can I place an order for XCVU13P-1FHGA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-1FHGA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-1FHGA2104E reliable?
The price and inventory of XCVU13P-1FHGA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-1FHGA2104E is usually 5 days.
3.What payment methods are accepted for XCVU13P-1FHGA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-1FHGA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-1FHGA2104E?
XCVU13P-1FHGA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-1FHGA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-1FHGA2104E?
For technical support, including XCVU13P-1FHGA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-1FHGA2104E requirements.
6.How does Aetrix verify that XCVU13P-1FHGA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-1FHGA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-1FHGA2104E meets industry standards.
7.What is the process for return or replacement of XCVU13P-1FHGA2104E?
All XCVU13P-1FHGA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-1FHGA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-1FHGA2104E part is unused and in its original packaging.
Return procedure for XCVU13P-1FHGA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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