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AMD XCVU13P-1FHGA2104I
- Part No.:
- XCVU13P-1FHGA2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-1FHGA2104I.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,025
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Product details
Overview
XCVU13P-1FHGA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.2 Gb/s transceiver bandwidth with 25.8 Gb/s GTY transceivers. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in 5G wireless infrastructure baseband processing.
For engineers reviewing the XCVU13P-1FHGA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count, on-die memory bandwidth, PCIe Gen4 support, and thermal design power for air-cooled 5G RU deployments.
Technical Context
The XCVU13P-1FHGA2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4), and multi-rate GTY transceivers supporting protocols from 1.6 to 25.8 Gb/s. It uses 16nm FinFET process technology and supports partial reconfiguration.
Configuration is performed via quad-SPI, BPI, or JTAG; boot sources include flash memory or configuration PROMs. The device supports IEEE 1149.1/1149.6 boundary-scan and includes integrated system monitoring (voltage, temperature, current).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - total configurable LUT-based resources for complex digital logic implementation |
| DSP Slices | 7,520 - fixed-point and floating-point arithmetic units optimized for high-throughput signal processing |
| GTY Transceivers | 40 × 25.8 Gb/s - multi-protocol serial I/O supporting PCIe Gen4, CPRI, and OTN |
| Memory Bandwidth | 96.2 Gb/s - aggregate bandwidth across 16 DDR4 interfaces (up to 2400 MT/s) |
| PCIe Interface | Gen4 x16 hard IP - full-duplex 32 GT/s link with integrated root port and endpoint functionality |
| Thermal Design Power | 55 W - maximum steady-state power dissipation under typical 5G baseband workload conditions |
Pinout & Package
Package: 2104-pin FCBGA (Fine-Pitch Chip Scale Ball Grid Array), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:53] | Multiplexed I/O | 54 dedicated pins for PS-side peripherals including UART, SPI, I2C, SDIO, and GPIO |
| HP[0:63] | High-Performance I/O Bank | 64 pins per bank supporting 1.8 V/1.5 V/1.35 V LVDS, SSTL, HSTL, and MIPI D-PHY |
| GTYTXn/GTYRXn | Transceiver Lane | 20 differential pairs per GTY quad; each pair supports up to 25.8 Gb/s raw data rate |
| VCCINT/VCCAUX | Power Supply | Separate 0.85 V core and 1.8 V auxiliary rails with dedicated decoupling requirements |
| CONFIG_MODE | Configuration Mode Select | Defines boot source: 00=JTAG, 01=SPIx4, 10=BPIx16, 11=Master SelectMAP |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 | Reduces RTL integration effort and timing closure risk for host interface subsystems |
| 100G Ethernet MAC + RS-FEC | Enables line-rate 100GbE processing without external PHY or FEC offload IC |
| Partial Reconfiguration Support | Allows dynamic logic swapping during operation for multi-standard radio waveform adaptation |
| Integrated System Monitor | Provides real-time voltage, temperature, and current telemetry via I2C or AXI interface |
| UltraScale+ Memory Controller | Supports dual-rank DDR4-2400 with ECC, reducing external memory controller complexity |
Applications
| 5G Massive MIMO Baseband | AI Accelerator Co-Processor |
|---|---|
Use Scenario: Real-time beamforming matrix computation and channel estimation in active antenna systems. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling Layer 1 PHY functions with deterministic latency. Use Value: GTY transceivers interface directly to RFICs at 24.33 Gb/s CPRI-equivalent rates; 7,520 DSP slices enable concurrent FFT/IFFT and MIMO detection. | Use Scenario: Offloading convolution and quantization operations from CPU/GPU in edge inference servers. IC Role / Device Role / Timing Role: Heterogeneous compute accelerator tightly coupled to host via PCIe Gen4 x16. Use Value: 1,122K logic cells implement custom INT8/FP16 pipelines; hardened PCIe avoids DMA bottlenecks in low-latency inference loops. |
| Optical Transport Line Card | Radar Signal Processor |
Use Scenario: OTN mapping/demapping and forward error correction for 100G/200G coherent DWDM links. IC Role / Device Role / Timing Role: Line-side packet processing engine with deterministic jitter performance for SONET/SDH alignment. Use Value: 96.2 Gb/s memory bandwidth sustains 100G line-rate packet buffering; RS-FEC IP meets ITU-T G.709.1 BER requirements. | Use Scenario: Pulse-Doppler processing and synthetic aperture radar (SAR) image formation in airborne platforms. IC Role / Device Role / Timing Role: Real-time DSP engine synchronizing ADC sampling, pulse compression, and range-Doppler FFTs. Use Value: 25.8 Gb/s GTY lanes connect to high-speed ADCs/DACs; partial reconfiguration adapts algorithms per mission profile. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGA2104E | Higher speed grade (-2), 10% higher max clock frequency, 15% higher TDP (63 W) | Better suited for worst-case timing closure in ultra-low-latency radar processing | Select when meeting <5 ns setup/hold margins at 600 MHz system clocks is required |
| XCVU9P-1FHGA2104I | Fewer logic cells (925K), reduced GTY count (32), lower memory bandwidth (76.8 Gb/s) | Targeted at cost-optimized 5G small cell and enterprise OTN edge nodes | Choose when full XCVU13P capacity is not utilized and BOM cost reduction is critical |
Compared with XCVU13P-2FHGA2104E, the XCVU13P-1FHGA2104I trades peak performance for thermal headroom in convection-cooled enclosures; versus XCVU9P-1FHGA2104I, it delivers 21% more logic and 25% higher transceiver bandwidth for macro-cell baseband consolidation.
Availability
XCVU13P-1FHGA2104I is available at Aetrix Electronics and suitable for 5G wireless infrastructure, AI edge accelerators, and optical transport equipment requiring stable component supply across multi-year production cycles.
Supply support for XCVU13P-1FHGA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data center, embedded, and client applications.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and thermally constrained systems such as 5G RUs, AI inference engines, and coherent optical modules.
FAQ
What is the maximum supported data rate for GTY transceivers in XCVU13P-1FHGA2104I?
The XCVU13P-1FHGA2104I supports GTY transceivers operating up to 25.8 Gb/s per lane, validated for protocols including PCIe Gen4, CPRI, and OTN. This rate is achievable across all 40 GTY transceivers under specified voltage and temperature conditions per AMD UG578 v1.13.1.
Does XCVU13P-1FHGA2104I include hardened 100G Ethernet MAC functionality?
Yes, the XCVU13P-1FHGA2104I integrates a hardened 100G Ethernet MAC with RS-FEC compliant to IEEE 802.3cd, enabling direct connection to 100G optical modules without external PHY or FEC ICs. This block operates at 102.4 Gb/s line rate with sub-100 ns latency.
What configuration modes are supported by XCVU13P-1FHGA2104I?
XCVU13P-1FHGA2104I supports four primary configuration modes: JTAG, Quad-SPI, BPI x16, and Master SelectMAP. Mode selection is controlled by the CONFIG_MODE pins (MIO[12:11]), and all modes support secure bitstream encryption using AES-256 keys stored in eFUSE.
Is partial reconfiguration supported on XCVU13P-1FHGA2104I?
Yes, XCVU13P-1FHGA2104I fully supports partial reconfiguration through Vivado Design Suite v2022.2+, allowing dynamic swapping of logical partitions while the rest of the design remains operational. This capability is used in 5G radios to switch between TDD/FDD waveforms without system reset.
What is the thermal design power (TDP) rating for XCVU13P-1FHGA2104I?
The XCVU13P-1FHGA2104I has a thermal design power (TDP) of 55 W under typical 5G baseband processing workloads, measured at junction temperature of 100°C and ambient 85°C. This value assumes full utilization of GTY transceivers and 70% logic resource loading per AMD AR71520.
XCVU13P-1FHGA2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-1FHGA2104I FAQ
1.How can I place an order for XCVU13P-1FHGA2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-1FHGA2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-1FHGA2104I reliable?
The price and inventory of XCVU13P-1FHGA2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-1FHGA2104I is usually 5 days.
3.What payment methods are accepted for XCVU13P-1FHGA2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-1FHGA2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-1FHGA2104I?
XCVU13P-1FHGA2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-1FHGA2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-1FHGA2104I?
For technical support, including XCVU13P-1FHGA2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-1FHGA2104I requirements.
6.How does Aetrix verify that XCVU13P-1FHGA2104I is sourced from the original manufacturer or authorized distributors?
All XCVU13P-1FHGA2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-1FHGA2104I meets industry standards.
7.What is the process for return or replacement of XCVU13P-1FHGA2104I?
All XCVU13P-1FHGA2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-1FHGA2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-1FHGA2104I part is unused and in its original packaging.
Return procedure for XCVU13P-1FHGA2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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