AMD XCVU13P-1FHGB2104E

Overview

XCVU13P-1FHGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces; deployed in AI acceleration, high-end radar processing, and 5G baseband subsystems.

For engineers reviewing the XCVU13P-1FHGB2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 25G operation, and configuration security options including AES-256 bitstream encryption.

Technical Context

The XCVU13P-1FHGB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and UltraScale+ routing interconnect. It integrates dual ARM Cortex-A53 processors for system management and real-time control tasks.

Configuration occurs via quad-SPI, BPI, or JTAG; bitstream authentication uses HMAC-SHA-256 and decryption employs AES-256. The device supports partial reconfiguration and dynamic function exchange for runtime hardware adaptation.

Key Specifications

Pinout & Package

FHGB2104 is a 2104-ball flip-chip BGA package with integrated thermal lid, designed for high-power FPGA applications requiring efficient heat dissipation and signal integrity up to 25.78 Gb/s. Ball pitch is 0.8 mm; body size is 35 mm × 35 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-1FHGB2104E, the -2 variant offers tighter timing margins for aggressive clocking, while the XCVU9P-1 provides ~18% lower logic density and ~28% fewer DSPs at lower static/dynamic power-enabling trade-offs between performance headroom and cost efficiency.

Availability

XCVU13P-1FHGB2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and defense electronics requiring stable component supply across long production cycles.

Supply support for XCVU13P-1FHGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions including FPGAs, adaptive SoCs, and AI accelerators for data center, communications, and embedded markets.

The Virtex UltraScale+ family targets high-bandwidth, high-compute applications such as 5G wireless infrastructure, aerospace radar, and AI inference acceleration-designed for deterministic performance, security, and scalability.

FAQ

What is the maximum supported transceiver data rate for XCVU13P-1FHGB2104E?

The XCVU13P-1FHGB2104E supports transceiver data rates up to 25.78 Gb/s per lane using its GTH transceivers. This enables compliance with PCIe Gen4, 100G Ethernet (4×25G), and CPRI/eCPRI protocols. Operation at this rate requires proper PCB stack-up, AC coupling, and reference clock jitter below 500 fs RMS.

Does XCVU13P-1FHGB2104E include hardened processor cores?

Yes, XCVU13P-1FHGB2104E integrates a dual-core ARM Cortex-A53 application processor subsystem running at up to 1.5 GHz. These cores support Linux, FreeRTOS, and bare-metal execution, and manage configuration, security, and real-time system control independent of the programmable logic fabric.

What configuration modes does XCVU13P-1FHGB2104E support?

XCVU13P-1FHGB2104E supports multiple configuration modes: quad-SPI flash, BPI parallel NOR flash, JTAG boundary-scan, and SelectMAP. Configuration bitstream authentication uses HMAC-SHA-256, and decryption applies AES-256, ensuring secure boot and field updates.

Is partial reconfiguration supported on XCVU13P-1FHGB2104E?

Yes, XCVU13P-1FHGB2104E fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic swapping of logic modules during operation-used in adaptive radar, software-defined radio, and real-time protocol translation without system reset or downtime.

What thermal management is required for XCVU13P-1FHGB2104E in sustained operation?

XCVU13P-1FHGB2104E requires active thermal management under full utilization due to its 50–75 W typical power envelope. The FHGB2104 package includes a metal thermal lid compatible with standard heatsink mounting; junction temperature must be maintained ≤100°C per AMD DS922 specification.