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AMD XCVU13P-1FHGB2104I
- Part No.:
- XCVU13P-1FHGB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-1FHGB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,368
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Product details
Overview
XCVU13P-1FHGB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar systems.
For engineers reviewing the XCVU13P-1FHGB2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed, on-chip memory bandwidth, logic density, and thermal design power (TDP) in heterogeneous compute platforms.
Technical Context
The XCVU13P-1FHGB2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency interconnect. It supports multi-die integration via AMD's 2.5D stacked silicon interconnect (SSI) technology using silicon interposer.
This device uses 16nm FinFET process technology, operates at -40°C to +100°C junction temperature, and requires dual-supply voltage rails: 0.85 V core (VCCINT), 0.9 V transceiver (VCCAUX), and 1.8 V I/O (VCCO).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic capacity for custom datapaths and control units |
| DSP Slices | 7,520 - enables parallel fixed/floating-point computation for AI inference and signal processing kernels |
| Block RAM | 96.4 Mb - provides on-chip memory for buffering, FIFOs, and coefficient storage without external DRAM latency |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - supports 100G/200G/400G Ethernet, CPRI/eCPRI, and JESD204B/C interfaces |
| I/O Pins | 1,048 user-configurable - supports multiple high-speed interface standards including LVDS, SSTL, HSTL, and MIPI |
| Thermal Design Power | 55 W (typical) - defines heatsink and airflow requirements for sustained operation in dense compute modules |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 49.0 mm × 49.0 mm, 0.8 mm pitch, RoHS-compliant, with thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to programmable logic and CLBs; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | Provides 0.9 V to configuration logic, PCIe hard IP, and transceiver reference circuits |
| VCCO | I/O bank power | Configurable per-bank (1.2–1.8 V); sets output swing and input threshold for interfacing with external memory or PHYs |
| MGTAVCC | GTY analog supply | 2.5 V analog rail for GTY transceiver PLLs and serializers; sensitive to ripple and noise |
| CLK_IN | Dedicated clock input | Accepts differential reference clocks (e.g., 100–300 MHz) for transceiver and fabric clocking domains |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Multi-Die Architecture | Integrates four FPGA dies on single interposer, enabling >1M logic cells while maintaining timing closure across die boundaries |
| Hardened PCIe Gen4 x16 Controller | Reduces RTL footprint and latency vs. soft IP; supports SR-IOV and ATS for virtualized host communication |
| UltraScale+ Memory Interface | Supports DDR4-2400, LPDDR4-4266, and RLDRAM3-2133 with integrated calibration and error correction |
| Partial Reconfiguration Support | Enables dynamic logic swapping in runtime-critical applications such as adaptive radio or real-time protocol switching |
| Security Boot with AES-GCM | Ensures authenticated and encrypted bitstream loading from external flash; prevents cloning and tampering |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems operating at X-band and Ku-band. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFTs and CFAR algorithms; GTY transceivers interface with ADC/DAC FMC modules at 5–10 GSPS. Use Value: On-chip DSP slices and block RAM eliminate off-chip memory bottlenecks, reducing latency to <100 ns for closed-loop tracking. | Use Scenario: Low-latency inference engine for vision-based autonomous navigation in edge robotics and UAVs. IC Role / Device Role / Timing Role: Configurable logic implements sparse CNN accelerators; PCIe Gen4 x16 connects to host CPU for rapid model update and telemetry streaming. Use Value: 7,520 DSP slices enable >20 TOPS INT8 throughput at <55 W TDP, avoiding GPU-level cooling complexity. |
| 5G Massive MIMO Baseband | High-Speed Test Equipment |
Use Scenario: Digital pre-distortion (DPD) and uplink channel estimation in 5G NR macro base stations supporting 64T64R antenna arrays. IC Role / Device Role / Timing Role: Hardened 100G Ethernet MAC handles fronthaul traffic; GTY transceivers link to RFICs via JESD204C at 24.33 Gb/s. Use Value: Deterministic latency (<2 μs) and sub-picosecond jitter meet 3GPP TR 38.803 synchronization requirements. | Use Scenario: High-fidelity pattern generation and analysis in automated test equipment for SerDes compliance validation. IC Role / Device Role / Timing Role: Programmable logic generates PRBS31, eye diagrams, and jitter stress patterns; GTY receivers capture error-free data at 25.8 Gb/s. Use Value: On-die clock multiplication and phase alignment ensure <150 fs RMS jitter for accurate BER testing down to 1e-12. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGB2104E | Higher speed grade (-2): 25% faster timing closure margin; 10–15% higher TDP (63 W) | Better suited for worst-case timing paths in 5G fronthaul with full 64-lane GTY utilization | Select when meeting setup/hold slack at 25.8 Gb/s across all lanes is critical and thermal budget allows |
| XCVU9P-1FHGB2104I | Lower logic density (983K LC), fewer GTY lanes (48), reduced block RAM (72.2 Mb) | Targeted at cost-sensitive 25G/50G test equipment and mid-tier radar subsystems | Choose when full XCVU13P capacity is unused and BOM cost reduction is prioritized over future scalability |
Compared with XCVU13P-2FHGB2104E, the XCVU13P-1FHGB2104I trades timing margin for lower power and thermal envelope; versus XCVU9P-1FHGB2104I, it delivers 14% more logic, 33% more GTY lanes, and 34% more block RAM-enabling full 400G Ethernet line cards without external memory expansion.
Availability
XCVU13P-1FHGB2104I is available at Aetrix Electronics and suitable for AI accelerator modules, 5G massive MIMO radios, and high-resolution radar systems requiring stable component supply across multi-year production cycles.
Supply support for XCVU13P-1FHGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and client markets.
The Virtex UltraScale+ family targets demanding infrastructure applications requiring hardware adaptability, deterministic latency, and multi-protocol I/O-especially where ASIC-level performance must be balanced with post-deployment reconfigurability.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU13P-1FHGB2104I?
The XCVU13P-1FHGB2104I supports GTY transceivers operating up to 25.8 Gb/s per lane. This rate is validated for protocols including 100G/400G Ethernet (using PAM4), JESD204C, and CPRI. Operation at this speed requires proper PCB stackup, controlled impedance routing, and compliant power delivery per AMD UG578.
Does the XCVU13P-1FHGB2104I support partial reconfiguration?
Yes, the XCVU13P-1FHGB2104I fully supports partial reconfiguration through Vivado Design Suite. This capability allows dynamic swapping of logic modules during operation-critical for applications like adaptive waveform generation in software-defined radio or real-time protocol translation in test equipment.
What I/O standards are supported by the XCVU13P-1FHGB2104I?
The XCVU13P-1FHGB2104I supports LVDS, BLVDS, RSDS, mini-LVDS, TMDS, SSTL, HSTL, POD, and MIPI D-PHY across its 1,048 user I/O pins. Each bank is independently configurable for voltage (1.2–1.8 V) and standard, enabling mixed-interface designs such as DDR4 memory + MIPI camera + Gigabit Ethernet on a single device.
Is the XCVU13P-1FHGB2104I qualified for extended temperature operation?
Yes, the XCVU13P-1FHGB2104I is rated for industrial temperature range: –40°C to +100°C junction temperature. This qualification applies to the "I" speed grade and is documented in AMD DS923, making it suitable for outdoor 5G base stations and airborne radar systems without derating.
What security features does the XCVU13P-1FHGB2104I include?
The XCVU13P-1FHGB2104I includes AES-256 bitstream encryption with GCM mode, HMAC-SHA-256 authentication, and secure boot with eFUSE-based key storage. These features prevent unauthorized configuration and ensure trusted execution-essential for defense, aerospace, and financial infrastructure deployments.
XCVU13P-1FHGB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-1FHGB2104I FAQ
1.How can I place an order for XCVU13P-1FHGB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-1FHGB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-1FHGB2104I reliable?
The price and inventory of XCVU13P-1FHGB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-1FHGB2104I is usually 5 days.
3.What payment methods are accepted for XCVU13P-1FHGB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-1FHGB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-1FHGB2104I?
XCVU13P-1FHGB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-1FHGB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-1FHGB2104I?
For technical support, including XCVU13P-1FHGB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-1FHGB2104I requirements.
6.How does Aetrix verify that XCVU13P-1FHGB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU13P-1FHGB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-1FHGB2104I meets industry standards.
7.What is the process for return or replacement of XCVU13P-1FHGB2104I?
All XCVU13P-1FHGB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-1FHGB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-1FHGB2104I part is unused and in its original packaging.
Return procedure for XCVU13P-1FHGB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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