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AMD XCVU13P-1FLGA2577E
- Part No.:
- XCVU13P-1FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU13P-1FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,605
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Product details
Overview
XCVU13P-1FLGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 9,024 DSP slices, and 84.2 Mb of total on-chip memory. It supports PCIe Gen4 x16, 25G/28G/58G transceivers, and DDR4 memory interfaces up to 2400 MT/s, deployed in high-end radar signal processing systems.
For engineers reviewing the XCVU13P-1FLGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 28G operation, and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCVU13P-1FLGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting PAM4 and NRZ modulation. It integrates dual ARM Cortex-A53 MPCore processors for real-time control and system management.
Configuration occurs via quad-SPI, BPI, or JTAG; bitstream authentication uses HMAC-SHA-256 and decryption employs AES-256-GCM. Power delivery supports dynamic voltage and frequency scaling across multiple rail domains (VCCINT, VCCAUX, VCCO, VRP).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational and sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 9,024 - enables parallel execution of high-throughput FIR, FFT, and matrix operations |
| Transceiver Max Rate | 58 Gb/s - supports single-lane 100G KR4/CR4 and 400G DR4 optical interconnects |
| On-Chip Memory | 84.2 Mb - includes URAM, BRAM, and distributed RAM for low-latency buffering and caching |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - enables direct interfacing with ADCs, DACs, and memory without level-shifting |
| Configuration Security | AES-256 + HMAC-SHA-256 - prevents unauthorized bitstream cloning and runtime tampering |
Pinout & Package
This device is housed in a 2577-ball Fine-Pitch Flip-Chip Ball Grid Array (FLGA) package with 0.8 mm pitch, designed for high-density PCB layouts and thermal dissipation via integrated heat spreader.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to programmable logic and routing fabric |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration circuitry, PLLs, and transceiver analog blocks |
| MGTAVCC | Transceiver analog supply | Delivers ultra-low-noise 0.95 V to high-speed serial PHYs |
| CONFIG_IO | Configuration I/O bank | Supports dedicated boot modes (SPI/BPI/JTAG) with internal pull-up/pull-down |
| HP_IO | High-performance I/O bank | Enables 1.8 V/1.5 V/1.35 V/1.2 V I/O standards with adjustable drive strength and slew rate |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute architecture | Combines FPGA fabric, hardened 100G Ethernet MAC, PCIe Gen4 controller, and dual Cortex-A53 for software-defined hardware acceleration |
| Multi-rate transceivers | 128 lanes scalable from 1.25 Gb/s to 58 Gb/s with built-in PRBS generation and error detection |
| UltraScale+ memory hierarchy | Includes 2,048 URAM blocks (288 Kb each), 3,240 BRAM blocks (36 Kb each), and distributed RAM for pipelined dataflow |
| Advanced security framework | Supports bitstream encryption, authentication, secure debug disable, and anti-tamper monitoring via eFUSE |
| Thermal-aware packaging | FLGA2577 package with copper heat slug and thermal interface material compatibility for >25 W sustained power dissipation |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming, pulse compression, and CFAR detection in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine performing low-latency, deterministic signal chain processing using parallelized DSP pipelines. Use Value: 9,024 DSP slices and 58 Gb/s transceivers enable full-bandwidth digitization and sub-microsecond response for adaptive waveform generation. | Use Scenario: Digital pre-distortion (DPD), channel estimation, and massive MIMO precoding in 5G NR base stations operating at 3.5 GHz and 28 GHz bands. IC Role / Device Role / Timing Role: High-throughput baseband processor interfacing directly with RFICs via JESD204B/C and CPRI/eCPRI over 25G+ SerDes lanes. Use Value: 128 transceiver lanes and 1,122K logic cells support concurrent processing of 64+ antenna elements with <100 ns latency. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: FPGA-accelerated financial risk modeling, genomics sequence alignment, and AI inference at datacenter edge nodes. IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, offloading compute-intensive kernels with deterministic timing. Use Value: PCIe Gen4 x16 root port and 84.2 Mb on-chip memory eliminate external DRAM bottlenecks for streaming workloads. | Use Scenario: Real-time protocol analysis, jitter tolerance testing, and high-resolution oscilloscope front-end digitization at ≥10 GS/s. IC Role / Device Role / Timing Role: Timing-critical acquisition engine synchronizing ADC sampling, pattern generation, and deep memory capture using deterministic clock networks. Use Value: Ultra-low-jitter PLLs (<50 fs RMS) and 2577-ball FLGA package minimize skew across 100+ high-speed I/O channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher speed grade (-2): 20% faster timing closure margin and 15% higher transceiver stable operating frequency | Suitable for designs requiring guaranteed 58 Gb/s operation across industrial temperature range (-40°C to +100°C) | Select when design requires worst-case timing margin or extended temperature qualification |
| XCVU9P-1FLGA2104E | Smaller footprint (2104-ball FLGA), 772K logic cells, 5,424 DSP slices, and 64 transceiver lanes | Targeted at cost-optimized 5G small cells and mid-tier test equipment where full XCVU13P capacity is unused | Select when board space, power budget, or logic/DSP resource utilization is below 70% of XCVU13P capability |
Compared with XCVU13P-1FLGA2577E, the -2 speed grade offers tighter timing margins for demanding protocols like 400G-FR4, while the XCVU9P-1FLGA2104E reduces PCB layer count and thermal complexity at the expense of transceiver lane count and DSP throughput.
Availability
XCVU13P-1FLGA2577E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply and long-term program support.
Supply support for XCVU13P-1FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for datacenter, embedded, and client markets with focus on performance-per-watt and architectural innovation.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications including aerospace radar, 5G infrastructure, and AI-accelerated test systems.
FAQ
What is the maximum supported transceiver data rate for XCVU13P-1FLGA2577E?
The XCVU13P-1FLGA2577E supports transceiver data rates up to 58 Gb/s per lane using PAM4 signaling. This enables implementation of 400G DR4 optical interfaces and 100G KR4 electrical backplanes. The actual achievable rate depends on PCB stackup, channel loss, and reference clock stability, but the silicon specification guarantees operation at 58 Gb/s under defined thermal and voltage conditions.
Does XCVU13P-1FLGA2577E include hardened PCIe Gen4 controllers?
Yes, the XCVU13P-1FLGA2577E integrates dual hardened PCIe Gen4 x16 root port and endpoint controllers. These blocks operate at 16 GT/s per lane with full support for ASPM, AER, and SR-IOV. They are implemented in dedicated silicon outside the programmable fabric, ensuring deterministic latency and reduced resource consumption compared to soft IP implementations.
What configuration security features does XCVU13P-1FLGA2577E provide?
XCVU13P-1FLGA2577E provides AES-256 bitstream encryption, HMAC-SHA-256 authentication, secure debug disable, and eFUSE-based anti-tamper monitoring. Configuration can be authenticated before decryption, preventing execution of modified or counterfeit bitstreams. These features are enabled at device power-up and require no user firmware intervention.
What is the I/O voltage range supported by XCVU13P-1FLGA2577E HP banks?
The XCVU13P-1FLGA2577E HP I/O banks support selectable VCCO voltages from 1.2 V to 1.8 V, enabling direct interface with DDR4 (1.2 V), LPDDR4 (1.1 V), and legacy memory (1.5 V/1.8 V). Each bank has independent VCCO and VRP references, allowing mixed-voltage operation across adjacent banks without level shifters.
Is XCVU13P-1FLGA2577E qualified for automotive applications?
No, XCVU13P-1FLGA2577E is not AEC-Q100 qualified and is not intended for automotive safety-critical systems. It is rated for commercial and industrial temperature ranges only (0°C to +100°C for the -1E speed grade). For automotive use, AMD offers the XCVU13P-2FLGA2577I with extended temperature screening and additional reliability testing.
XCVU13P-1FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU13P-1FLGA2577E FAQ
1.How can I place an order for XCVU13P-1FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-1FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-1FLGA2577E reliable?
The price and inventory of XCVU13P-1FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-1FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU13P-1FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-1FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-1FLGA2577E?
XCVU13P-1FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-1FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-1FLGA2577E?
For technical support, including XCVU13P-1FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-1FLGA2577E requirements.
6.How does Aetrix verify that XCVU13P-1FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-1FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-1FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU13P-1FLGA2577E?
All XCVU13P-1FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-1FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-1FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU13P-1FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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