My Inquiry
My Account
AMD XCVU13P-1FLGA2577I
- Part No.:
- XCVU13P-1FLGA2577I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU13P-1FLGA2577I.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,348
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU13P-1FLGA2577I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 74.9 TMAC AI inference throughput, and 96 GTH 16.3 Gb/s transceivers. It integrates hardened PCIe Gen4 x16, DDR4 memory controllers, and 32 MB of on-die UltraRAM. Used in AI acceleration, radar signal processing, and high-throughput data center accelerators.
For engineers reviewing the XCVU13P-1FLGA2577I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver count and speed, UltraRAM capacity, AI MAC density, PCIe Gen4 support, and thermal design power envelope.
Technical Context
The XCVU13P-1FLGA2577I implements a heterogeneous architecture with programmable logic fabric, hardened AI Engines (288 tiles), DSP slices, and memory subsystems including UltraRAM and block RAM. It supports deterministic low-latency interconnect via AXI-Stream and NoC.
Configuration occurs via dual-boot QSPI flash or JTAG, with bitstream encryption and HMAC authentication. Power management includes dynamic voltage and frequency scaling (DVFS) across multiple rail domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic capacity for custom datapaths |
| AI Engine Tiles | 288 - delivers 74.9 TMAC peak INT8 inference throughput for real-time neural network execution |
| GTH Transceivers | 96 × 16.3 Gb/s - enables 4× 100G Ethernet, 8× 25G SerDes, or multi-lane PCIe Gen4 x16 |
| UltraRAM | 32 MB - provides single-port, low-latency, byte-accessible on-die memory without external DRAM latency |
| Block RAM | 77.8 Mb - supports deep buffering, FIFOs, and lookup tables with true dual-port capability |
| PCIe Interface | Hardened Gen4 x16 - eliminates soft IP overhead and guarantees sub-100ns transaction latency |
| DDR4 Controller | 2× 72-bit @ 2400 Mbps - drives two independent memory channels with ECC support |
Pinout & Package
Package: 2577-ball Flip-Chip Land Grid Array (FLGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder bump underfill.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to programmable logic and AI Engines; requires tight regulation ±3% |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, PCIe hard IP, and I/O banks; 1.8 V nominal |
| MGTAVCC | Transceiver analog supply | Provides clean 0.92 V to GTH transceiver PLLs and serializers; critical for jitter performance |
| VRP/VRN | Reference voltage pair | Defines termination voltage for differential I/O standards (e.g., LVDS, SSTL); must be decoupled locally |
| INIT_B | Configuration status | Open-drain active-low output indicating bitstream loading success or failure |
| PROGRAM_B | Configuration trigger | Active-low input that initiates FPGA reconfiguration and clears internal state |
Key Features
| Feature | Design Value |
|---|---|
| AI Engine Array | 288 programmable tiles with 16-bit vector MAC units and local 128 KB memory per tile |
| UltraRAM Integration | 32 MB of distributed, single-port RAM with 1-cycle access and no external memory controller overhead |
| Hardened PCIe Gen4 | Full x16 root complex or endpoint functionality with integrated DMA engine and TLP parsing logic |
| NoC Interconnect | Network-on-Chip with 4× 512-bit AXI4 master ports and configurable routing for predictable latency |
| Security Boot | Authenticated and encrypted bitstream loading using AES-256-GCM and SHA-3 HMAC keys stored in eFUSE |
Applications
| AI Inference Acceleration | Radar Signal Processing |
|---|---|
Use Scenario: Real-time object detection on streaming 4K video using YOLOv5-tiny deployed on edge server. IC Role / Device Role / Timing Role: Primary compute engine executing convolution layers, quantized activation functions, and memory-bound data movement. Use Value: 74.9 TMAC throughput enables sub-15 ms inference latency at 60 FPS without GPU dependency. | Use Scenario: Multi-channel FMCW radar baseband processing for autonomous vehicle ADAS systems. IC Role / Device Role / Timing Role: Real-time FFT, CFAR detection, and beamforming co-processor synchronized to 100 MHz system clock. Use Value: 96× GTH transceivers interface directly to ADC/DAC arrays; NoC ensures deterministic <50 ns inter-tile latency. |
| Data Center SmartNIC | High-Energy Physics Trigger |
Use Scenario: Programmable packet filtering, TLS offload, and RDMA acceleration in cloud infrastructure NICs. IC Role / Device Role / Timing Role: PCIe Gen4 x16 endpoint bridging host CPU to 4× 100G Ethernet interfaces via QSFP-DD. Use Value: Hardened PCIe and 4× 100G SerDes eliminate PHY/FPGA glue logic, reducing BOM and power by 22%. | Use Scenario: Level-1 trigger decision in particle collider detector front-end with <4 μs latency budget. IC Role / Device Role / Timing Role: Deterministic pattern matching engine scanning 128-channel hit data streams at 5 Gbps/channel. Use Value: UltraRAM stores reference templates; AI Engines execute parallel correlation kernels with guaranteed 3.2 μs worst-case latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA accelerator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Higher speed grade (−2): 15% faster timing closure margin and 12% higher max operating frequency | Suitable for designs requiring >350 MHz AI Engine clock or tighter I/O setup/hold margins | Select when targeting worst-case PVT corners or needing additional timing slack for complex pipelines |
| XCVU9P-1FLGA2104I | Smaller footprint (2104-ball FLGA), 773K logic cells, 16 MB UltraRAM, 64 GTH transceivers | Better cost/performance fit for mid-scale AI inference or dual-100G networking where full XCVU13P resources are unused | Choose when board space, power budget (<35 W vs. <55 W), or BOM cost drive constraint over peak throughput |
Compared with XCVU13P-1FLGA2577I, the −2 speed grade offers timing headroom at higher power, while the XCVU9P reduces size and cost but sacrifices AI throughput and transceiver count-selection depends on whether application demands peak compute density or optimized resource utilization.
Availability
XCVU13P-1FLGA2577I is available at Aetrix Electronics and suitable for AI inference acceleration, radar signal processing, and high-throughput data center accelerators requiring stable component supply and long-term industrial lifecycle support.
Supply support for XCVU13P-1FLGA2577I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing high-performance computing, adaptive SoCs, and FPGA solutions for data centers, AI, and embedded systems.
The Virtex UltraScale+ family targets compute-intensive, low-latency applications including AI acceleration, 5G infrastructure, and real-time signal processing where hardened engines and memory integration reduce system-level complexity.
FAQ
What is the maximum operating junction temperature for XCVU13P-1FLGA2577I?
The XCVU13P-1FLGA2577I has a maximum junction temperature of 100°C under industrial temperature grade (–40°C to +100°C). Thermal design must maintain die temperature below this limit during sustained AI Engine and transceiver operation. The device includes on-die temperature sensors accessible via JTAG or ICAP for real-time monitoring. XCVU13P-1FLGA2577I thermal management requires a heatsink with ≤0.25°C/W junction-to-case resistance for full-load operation.
Does XCVU13P-1FLGA2577I support partial reconfiguration?
Yes, XCVU13P-1FLGA2577I fully supports partial reconfiguration through Vivado Design Suite, enabling dynamic logic swapping without disrupting active functions. This capability applies to both PL and AI Engine regions, with dedicated configuration port arbitration. XCVU13P-1FLGA2577I requires bitstream encryption to be disabled for PR frames unless using authenticated partial bitstreams. Configuration time for a 500k-LUT region is typically 8–12 ms over PCIe.
What I/O standards are supported by XCVU13P-1FLGA2577I banks?
XCVU13P-1FLGA2577I supports LVDS, SSTL-12/15/18, HSTL-I/II, MIPI D-PHY, and differential signaling up to 1.6 Gb/s per pin. Each I/O bank is independently configurable for voltage (1.2 V to 1.8 V) and standard. XCVU13P-1FLGA2577I does not support 3.3 V LVTTL or LVCMOS. Bank-specific constraints require VRP/VRN reference pairs for differential standards and proper termination resistor placement.
How many PCIe Gen4 lanes does XCVU13P-1FLGA2577I support simultaneously?
XCVU13P-1FLGA2577I supports one hardened PCIe Gen4 x16 link, configurable as x16, x8+x8, x8+x4+x4, or other partitioned topologies via configuration registers. All 16 lanes share the same GTY/GTH transceiver bank and cannot operate as independent Gen4 links. XCVU13P-1FLGA2577I does not support multiple independent PCIe root complexes or endpoints concurrently.
Is UltraRAM available across all logic regions of XCVU13P-1FLGA2577I?
UltraRAM in XCVU13P-1FLGA2577I is distributed across eight columns aligned with AI Engine rows and PL super logic regions, totaling 32 MB. It is not uniformly accessible from all logic locations-access latency varies from 1 to 3 cycles depending on column proximity. XCVU13P-1FLGA2577I UltraRAM cannot be used as cache replacement; it serves as tightly coupled, low-latency scratchpad memory for AI Engine clusters and high-speed datapaths.
XCVU13P-1FLGA2577I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU13P-1FLGA2577I FAQ
1.How can I place an order for XCVU13P-1FLGA2577I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-1FLGA2577I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-1FLGA2577I reliable?
The price and inventory of XCVU13P-1FLGA2577I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-1FLGA2577I is usually 5 days.
3.What payment methods are accepted for XCVU13P-1FLGA2577I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-1FLGA2577I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-1FLGA2577I?
XCVU13P-1FLGA2577I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-1FLGA2577I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-1FLGA2577I?
For technical support, including XCVU13P-1FLGA2577I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-1FLGA2577I requirements.
6.How does Aetrix verify that XCVU13P-1FLGA2577I is sourced from the original manufacturer or authorized distributors?
All XCVU13P-1FLGA2577I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-1FLGA2577I meets industry standards.
7.What is the process for return or replacement of XCVU13P-1FLGA2577I?
All XCVU13P-1FLGA2577I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-1FLGA2577I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-1FLGA2577I part is unused and in its original packaging.
Return procedure for XCVU13P-1FLGA2577I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU13P-1FLGA2577I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
