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AMD XCVU13P-1FSGA2577E
- Part No.:
- XCVU13P-1FSGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU13P-1FSGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,469
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Product details
Overview
XCVU13P-1FSGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 9,024 DSP slices, and 84.2 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal processing.
For engineers reviewing the XCVU13P-1FSGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory bandwidth, logic density, and thermal envelope for air-cooled compute acceleration platforms.
Technical Context
The XCVU13P-1FSGA2577E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated hard IP including PCIe Gen4, 100G Ethernet MAC, and DDR4/DDR5 memory controllers. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.
Its GTY transceivers operate up to 25.8 Gb/s per lane with built-in PRBS generation/checking, gearbox, and elastic buffer support. The device uses 16nm FinFET process technology and targets ≤100°C junction temperature under full load in air-cooled configurations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 9,024 - enables parallel execution of high-throughput fixed/floating-point math operations |
| Block RAM | 84.2 Mb - provides on-die memory for buffering, filtering, and data staging without external DRAM latency |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - supports multi-protocol serial I/O including PCIe Gen4, 100G Ethernet, and CPRI/eCPRI |
| Memory Interface | DDR4/DDR5, LPDDR4 - enables direct connection to high-bandwidth memory subsystems with up to 3200 MT/s data rates |
| I/O Standards | LVDS, SSTL, HSTL, MIPI - allows interfacing with diverse sensors, ADCs, DACs, and high-speed serdes PHYs |
Pinout & Package
The XCVU13P-1FSGA2577E is housed in a 2577-ball Flip-Chip BGA (FSGA) package with 0.8 mm pitch, designed for high-density PCB routing and thermal dissipation via thermal balls and exposed die paddle.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O | Configurable as GPIO, SDIO, SPI, UART, or CAN interfaces for peripheral control and debug |
| GTYP/GTYN | Transceiver Differential Pair | High-speed serial I/O supporting protocols up to 25.8 Gb/s with embedded clock recovery |
| VRP/VRN | Reference Voltage | Provides precision reference for differential I/O standards including LVDS and SSTL |
| VCCINT | Core Supply | 1.0V supply for FPGA fabric and CLB logic; requires low-noise regulation and tight tolerance |
| VCCAUX | Auxiliary Supply | 1.8V supply for configuration logic, transceiver analog circuitry, and I/O banks |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping during operation without system reset, reducing downtime in mission-critical systems |
| Hardened PCIe Gen4 x16 Controller | Offloads protocol handling from CPU, enabling direct DMA access to FPGA resources at up to 32 GB/s throughput |
| UltraScale+ DSP Slice Architecture | Each slice delivers 27 × 18-bit multiply-accumulate with optional rounding, saturation, and cascading for optimized filter and matrix operations |
| Integrated 100G Ethernet MAC | Reduces external component count by embedding full MAC layer logic for IEEE 802.3bj/bs compliance and low-latency packet processing |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time inference on vision transformer models deployed in edge servers and telecom infrastructure. IC Role / Device Role / Timing Role: Programmable accelerator executing custom quantized neural network layers with deterministic latency. Use Value: Delivers >2.1 TOPS/W efficiency using on-chip memory and parallel DSP resources, avoiding off-chip memory bottlenecks. | Use Scenario: Digital pre-distortion (DPD) and beamforming computation in active antenna units (AAUs) for sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: Real-time signal processor implementing adaptive FIR filters and channel estimation with sub-microsecond loop timing. Use Value: Achieves 128-channel DPD with 400 MHz instantaneous bandwidth using 64 GTY lanes and 9,024 DSP slices. |
| Phased Array Radar Processing | High-Performance Computing Interconnect |
Use Scenario: Pulse-Doppler processing and space-time adaptive processing (STAP) in airborne and naval radar systems. IC Role / Device Role / Timing Role: Coherent digital backend performing range-Doppler mapping and CFAR detection with precise sample-aligned timing across 100+ channels. Use Value: Enables real-time STAP on 64 simultaneous RF channels using block RAM for covariance matrix storage and DSP slices for eigenvalue decomposition. | Use Scenario: Low-latency inter-FPGA communication in disaggregated compute clusters using custom coherent protocols. IC Role / Device Role / Timing Role: High-speed serializer/deserializer endpoint with deterministic jitter performance and ultra-low latency forwarding logic. Use Value: Supports <50 ns round-trip latency over 25.8 Gb/s GTY links with hardware-accelerated packet parsing and flow control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FSGA2577I | Higher speed grade (-2), 15% higher maximum operating frequency, tighter timing closure margin | Better suited for designs requiring worst-case 300 MHz system clock or >28 Gb/s transceiver operation | Select when timing closure fails at -1 grade or when targeting >25 Gb/s PAM4 signaling |
| XCVU9P-1FSGA2577E | Reduced logic (920K cells), fewer GTY lanes (48), lower DSP count (6,840), same package | Targeted at cost-sensitive 5G small cells or mid-tier radar where full XCVU13P capacity is unused | Choose for BOM cost reduction when design fits within 85% of XCVU13P resource utilization |
Compared with XCVU13P-1FSGA2577E, the -2I variant offers timing headroom for aggressive clocking, while the XCVU9P-1FSGA2577E trades capacity for cost-both share identical pinout and thermal footprint but differ in performance ceiling and resource scalability.
Availability
XCVU13P-1FSGA2577E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and phased array radar systems requiring stable component supply across extended production lifecycles.
Supply support for XCVU13P-1FSGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and AI acceleration technologies.
The Virtex UltraScale+ family delivers scalable FPGA platforms for compute-intensive, low-latency, and protocol-rich applications in aerospace, defense, wired/wireless infrastructure, and test equipment.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU13P-1FSGA2577E?
The XCVU13P-1FSGA2577E supports GTY transceivers operating up to 25.8 Gb/s per lane. This rate is validated for protocols including PCIe Gen4, 100G Ethernet (CAUI-4), and CPRI. Operation at this speed requires proper board-level signal integrity design, including controlled impedance routing and appropriate termination.
Does the XCVU13P-1FSGA2577E support PCIe Gen5?
No, the XCVU13P-1FSGA2577E does not support PCIe Gen5. It integrates hardened PCIe Gen4 x16 endpoints and root ports. PCIe Gen5 capability requires the newer Versal ACAP architecture or Virtex UltraScale+ VU19P with specific speed-grade variants not present in the XCVU13P-1FSGA2577E.
What memory interfaces are natively supported by the XCVU13P-1FSGA2577E?
The XCVU13P-1FSGA2577E natively supports DDR4, DDR5, and LPDDR4 memory interfaces through dedicated hard memory controller blocks. These controllers provide configurable data widths up to x72, burst lengths up to BL16, and support for ECC, write leveling, and read leveling calibration sequences.
Is partial reconfiguration supported on the XCVU13P-1FSGA2577E?
Yes, the XCVU13P-1FSGA2577E fully supports partial reconfiguration using Vivado Design Suite. This capability allows dynamic replacement of logical modules while the rest of the design remains operational, enabling field-upgradable functions and multi-mode operation without system reset.
What is the thermal design power (TDP) range for the XCVU13P-1FSGA2577E under typical operating conditions?
The XCVU13P-1FSGA2577E has a typical thermal design power range of 45–75 W depending on resource utilization, transceiver activity, and clock frequencies. Full utilization with all GTY lanes active at 25.8 Gb/s and logic running at 300 MHz approaches the upper end, requiring forced-air cooling and thermal interface material compliant with JEDEC JESD51-2.
XCVU13P-1FSGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 99090432
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU13P-1FSGA2577E FAQ
1.How can I place an order for XCVU13P-1FSGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-1FSGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-1FSGA2577E reliable?
The price and inventory of XCVU13P-1FSGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-1FSGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU13P-1FSGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-1FSGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-1FSGA2577E?
XCVU13P-1FSGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-1FSGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-1FSGA2577E?
For technical support, including XCVU13P-1FSGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-1FSGA2577E requirements.
6.How does Aetrix verify that XCVU13P-1FSGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-1FSGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-1FSGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU13P-1FSGA2577E?
All XCVU13P-1FSGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-1FSGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-1FSGA2577E part is unused and in its original packaging.
Return procedure for XCVU13P-1FSGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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