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AMD XCVU13P-2FHGA2104E
- Part No.:
- XCVU13P-2FHGA2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-2FHGA2104E.pdf
- Description:
- IC FPGA 832 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,036
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Product details
Overview
XCVU13P-2FHGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces; deployed in AI acceleration, high-end test equipment, and radar signal processing systems.
For engineers reviewing the XCVU13P-2FHGA2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 25G operation, and configuration security options.
Technical Context
The XCVU13P-2FHGA2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency interconnect. It integrates 64 GTY transceivers rated for 25.78125 Gbps operation and supports multi-chip synchronization via dedicated clocking networks.
Configuration occurs via dual-mode (JTAG/SelectMAP) with AES-256 bitstream encryption and HMAC authentication. Power management includes dynamic power gating per SLR (Super Logic Region) and real-time monitoring via on-die sensors reporting junction temperature and supply rail voltages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 7,520 - fixed-point and floating-point arithmetic units with 27×18-bit multipliers and 48-bit accumulators |
| Block RAM | 96.4 Mb - distributed as 3,600 BRAM blocks (36 Kb each), supporting true dual-port access |
| GTY Transceivers | 64 lanes - each supports 25.78125 Gbps line rate, enabling 100G Ethernet and PCIe Gen4 x16 |
| I/O Pins | 832 - user-configurable, supporting LVDS, SSTL, HSTL, and MIPI at up to 1.8 V |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequencies defined in AMD UG578 |
| Package | FHGA2104 - 2104-ball flip-chip BGA, 35 mm × 35 mm, 0.8 mm pitch, with thermal lid |
Pinout & Package
FHGA2104 is a thermally enhanced flip-chip ball grid array package with integrated heat spreader, designed for high-power FPGA applications requiring efficient heat dissipation and signal integrity up to 25 Gbps.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 0.85 V ±3% supply for FPGA fabric and CLB logic; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, SelectIO banks, and transceiver analog circuitry |
| VCCO | I/O bank supply | Configurable per-bank (1.2–1.8 V); sets output voltage level and input threshold for associated pins |
| MGTAVCC | Transceiver analog supply | 0.92 V ±2% supply for GTY transceiver analog front-end; sensitive to ripple & noise |
| CLK_IN | Primary configuration clock | Accepts 30–100 MHz single-ended or differential reference clock for startup and JTAG |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness and error state |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort and ensures compliance without external PHY; supports SR-IOV and ATS |
| UltraScale+ architecture with 3D-on-3D stacking | Enables >2x logic density vs. previous generation while maintaining thermal envelope via silicon interposer |
| AES-256 + HMAC bitstream security | Prevents reverse engineering and unauthorized reprogramming; meets FIPS 140-2 Level 3 requirements |
| Dynamic function exchange (DFX) | Allows partial reconfiguration of logic regions during operation without system reset or interrupt |
| Real-time system monitor | On-die ADC measures die temperature, VCCINT, VCCAUX, and MGTAVCC with ±2°C accuracy |
Applications
| Radar Signal Processing | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes custom FFT, CFAR, and STAP algorithms; GTY transceivers interface with high-speed ADC/DACs. Use Value: 25G transceivers enable direct sampling of IF signals up to 12.5 GHz bandwidth; SLR partitioning isolates timing-critical processing paths. | Use Scenario: Low-latency inference engine for vision-based autonomous systems using sparse CNN models. IC Role / Device Role / Timing Role: Configurable logic implements custom systolic arrays; hardened PCIe Gen4 x16 provides host CPU coherency and DMA bandwidth. Use Value: 7,520 DSP slices deliver >12 TFLOPS INT8 throughput; DFX enables model-swapping without system downtime. |
| High-Speed Test Equipment | 5G Baseband Processing |
Use Scenario: Modular PXIe-based protocol analyzers capturing and decoding 100G Ethernet and PCIe Gen4 traffic. IC Role / Device Role / Timing Role: GTY transceivers act as physical-layer receivers/transmitters; hardened 100G Ethernet MAC handles frame parsing and timestamping. Use Value: Deterministic latency <12 ns between RX and TX paths; on-die system monitor validates thermal stability during burst-mode operation. | Use Scenario: Massive MIMO precoding and channel estimation in 5G NR gNodeB baseband units. IC Role / Device Role / Timing Role: FPGA fabric runs real-time matrix inversion and FFT engines; DDR4 interfaces buffer large antenna array data. Use Value: 96.4 Mb block RAM supports simultaneous storage of 4× 256-QAM symbol streams; -2 speed grade ensures timing closure at 500 MHz system clock. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Same logic capacity and transceiver count, but FLGA2577 package (2577-ball, 40 mm × 40 mm, 0.8 mm pitch) with higher I/O count (1,024 pins) | Better suited for designs requiring >832 I/Os or additional high-speed SerDes lanes routed to edge connectors | Select when board layout allows larger footprint and higher I/O density is required |
| XCVU9P-2FLGA2104E | Same FHGA2104 package, but reduced resources: 920K logic cells, 5,440 DSP slices, 66.5 Mb BRAM, and 48 GTY transceivers | Targeted at cost-optimized 5G fronthaul and mid-tier test instrumentation where full XCVU13P capability is unused | Select when thermal budget or BOM cost constraints preclude full XCVU13P utilization |
Compared with XCVU13P-2FLGA2577E, the XCVU13P-2FHGA2104E trades I/O count and package size for compact board area and lower routing complexity; compared with XCVU9P-2FLGA2104E, it delivers 22% more logic, 38% more DSP, and 45% more transceivers within identical mechanical footprint and thermal solution.
Availability
XCVU13P-2FHGA2104E is available at Aetrix Electronics and suitable for AI acceleration platforms, 5G infrastructure deployments, and defense-grade radar systems requiring stable component supply across extended product lifecycles.
Supply support for XCVU13P-2FHGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, aerospace, and communications markets.
The Virtex UltraScale+ family targets mission-critical applications demanding deterministic latency, hardware security, and scalable compute density-especially in radar, AI inference, and 5G baseband processing.
FAQ
What is the maximum supported transceiver line rate for XCVU13P-2FHGA2104E?
The XCVU13P-2FHGA2104E supports GTY transceivers rated for 25.78125 Gbps per lane, validated per AMD UG578 v1.15. This enables full-rate operation for PCIe Gen4 x16, 100G Ethernet (4×25G), and CPRI/eCPRI interfaces. Operation above 25 Gbps requires special qualification and is not guaranteed by standard speed grade -2 characterization.
Does XCVU13P-2FHGA2104E support partial reconfiguration?
Yes, XCVU13P-2FHGA2104E supports Dynamic Function eXchange (DFX) as defined in AMD UG909. This allows runtime replacement of logic modules within designated reconfigurable partitions without resetting the entire device or disrupting active I/O or transceiver links.
What configuration modes are supported by XCVU13P-2FHGA2104E?
XCVU13P-2FHGA2104E supports primary configuration via JTAG and secondary modes including Master/Slave SelectMAP, Serial/BPI, and QSPI flash boot. Configuration security includes AES-256 bitstream encryption and HMAC authentication, both enabled by default in production devices.
What is the thermal design power (TDP) range for XCVU13P-2FHGA2104E under typical operation?
The XCVU13P-2FHGA2104E has a typical TDP range of 35–55 W depending on resource utilization, transceiver activity, and I/O switching frequency. AMD UG1197 specifies junction temperature limits of 100°C for commercial grade and 110°C for extended temperature variants, with thermal solution design guided by the FHGA2104 package's θJA of 0.38°C/W.
Is XCVU13P-2FHGA2104E pin-compatible with other Virtex UltraScale+ devices in the same package?
No, XCVU13P-2FHGA2104E is not pin-compatible with other Virtex UltraScale+ devices-even those in the FHGA2104 package-due to differences in I/O bank assignment, power pin distribution, and transceiver placement. Pin mapping must be verified against the specific device's pinout file (Xilinx DS923) before PCB layout.
XCVU13P-2FHGA2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 832
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-2FHGA2104E FAQ
1.How can I place an order for XCVU13P-2FHGA2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-2FHGA2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-2FHGA2104E reliable?
The price and inventory of XCVU13P-2FHGA2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-2FHGA2104E is usually 5 days.
3.What payment methods are accepted for XCVU13P-2FHGA2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-2FHGA2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-2FHGA2104E?
XCVU13P-2FHGA2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-2FHGA2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-2FHGA2104E?
For technical support, including XCVU13P-2FHGA2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-2FHGA2104E requirements.
6.How does Aetrix verify that XCVU13P-2FHGA2104E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-2FHGA2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-2FHGA2104E meets industry standards.
7.What is the process for return or replacement of XCVU13P-2FHGA2104E?
All XCVU13P-2FHGA2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-2FHGA2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-2FHGA2104E part is unused and in its original packaging.
Return procedure for XCVU13P-2FHGA2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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