AMD XCVU13P-2FHGA2104I

Overview

XCVU13P-2FHGA2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of total on-chip memory (BRAM + URAM), designed for advanced radar signal processing, 5G massive MIMO baseband acceleration, and AI inference at the edge.

For engineers reviewing the XCVU13P-2FHGA2104I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (0.6–1.8 V), transceiver line rates up to 32.75 Gb/s (24 GTY transceivers), and -2 speed grade timing performance under industrial temperature range (-40°C to +100°C).

Technical Context

The XCVU13P-2FHGA2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4 x16, 100G Ethernet MAC, DDR4/DDR5 controller), and adaptive compute resources including INT8-capable DSP slices and UltraRAM for large coefficient storage. It supports partial reconfiguration and dynamic function exchange.

Its 2104-pin FCBGA package enables high-density interconnects with 832 user I/Os (including 480 HR and 352 HP bank pins), configurable I/O standards (LVDS, SSTL, HSTL, MIPI), and dedicated clock routing networks supporting low-jitter global and regional clock distribution.

Key Specifications

Pinout & Package

The XCVU13P-2FHGA2104I is housed in a 2104-ball Fine-Pitch Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-2FLGA2577I and XCVU9P-2FLGA2104I, the XCVU13P-2FHGA2104I delivers optimal density-to-footprint ratio for space-constrained high-throughput systems-offering full Virtex UltraScale+ capability in the smallest 2104-ball form factor with industrial-grade reliability.

Availability

XCVU13P-2FHGA2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and AI edge inference applications requiring stable component supply across long product lifecycles.

Supply support for XCVU13P-2FHGA2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and high-performance computing.

The Virtex UltraScale+ family targets demanding infrastructure applications requiring hardware adaptability, deterministic latency, and multi-protocol I/O integration-especially in aerospace, defense, and telecom equipment.

FAQ

What is the maximum transceiver line rate supported by the XCVU13P-2FHGA2104I?

The XCVU13P-2FHGA2104I supports GTY transceivers with a maximum line rate of 32.75 Gb/s. This capability enables direct interfacing with 100G/400G Ethernet, JESD204C ADC/DACs, and CPRI/eCPRI fronthaul links. The XCVU13P-2FHGA2104I achieves this performance across all 24 GTY quads under industrial temperature conditions with appropriate reference clock jitter specifications.

Does the XCVU13P-2FHGA2104I include hardened PCIe Gen4 support?

Yes, the XCVU13P-2FHGA2104I integrates a hardened PCIe Gen4 x16 endpoint/root port block. This eliminates the need for soft IP implementation, guarantees timing closure, and supports full-duplex 16-lane operation at 16 GT/s per lane. The XCVU13P-2FHGA2104I's PCIe block is compliant with PCI-SIG specification rev 4.0 and supports advanced features including ASPM L1 substates and SR-IOV.

What memory resources are available on the XCVU13P-2FHGA2104I?

The XCVU13P-2FHGA2104I provides 96.4 Mb of total on-chip memory, comprising 14.2 Mb of Block RAM (BRAM) and 82.2 Mb of UltraRAM (URAM). BRAM supports dual-port synchronous access up to 720 MHz, while URAM offers true dual-port 288 Kb blocks optimized for large coefficient storage and deep buffering. The XCVU13P-2FHGA2104I allocates these resources across 288 URAM blocks and 1,440 BRAM primitives.

Is the XCVU13P-2FHGA2104I qualified for industrial temperature operation?

Yes, the XCVU13P-2FHGA2104I is rated for industrial temperature operation from -40°C to +100°C (junction temperature). It undergoes extended burn-in and characterization across this range, with timing models validated at both extremes. The XCVU13P-2FHGA2104I's -2 speed grade guarantees functional operation and timing closure under worst-case voltage, temperature, and process corners within this envelope.

What configuration modes does the XCVU13P-2FHGA2104I support?

The XCVU13P-2FHGA2104I supports multiple configuration modes including Master SPI (QSPI flash), Slave Parallel (BPI flash), JTAG, and SelectMAP. Mode selection is controlled via CONFIG_M[2:0] pins during power-up. The XCVU13P-2FHGA2104I also supports fallback configuration, secure boot with AES-GCM decryption, and partial reconfiguration through ICAP interface.