AMD XCVU13P-2FHGB2104E

Overview

XCVU13P-2FHGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of total on-chip memory (BRAM+URAM), targeted for 5G infrastructure, radar signal processing, and high-throughput data center acceleration.

For engineers reviewing the XCVU13P-2FHGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.8 V / 1.5 V / 1.35 V / 1.2 V), transceiver line rate (up to 32.75 Gb/s), PCIe Gen4 x16 compliance, and thermal design power (TDP) of 75 W under typical configuration.

Technical Context

The XCVU13P-2FHGB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and multi-rate GTY transceivers. It supports partial reconfiguration and AXI-based system integration.

Its -2 speed grade guarantees timing closure at 32.75 Gb/s transceiver operation and 600 MHz system clocking in the FHGB2104 package. The device includes 1,968 user I/Os across 28 banks with selectable I/O standards including LVDS, SSTL, HSTL, and MIPI.

Key Specifications

Pinout & Package

The XCVU13P-2FHGB2104E is housed in a 2104-ball Fine-Pitch Flip-Chip Ball Grid Array (FHGB2104) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via soldered thermal lid.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-2FHGB2104E, the XCVU13P-2FLGA2577E offers identical functionality in a less dense package for thermal prototyping, while the XCVU9P-2FLGA2104E trades logic capacity and URAM for lower cost and power in mid-tier 100G systems.

Availability

XCVU13P-2FHGB2104E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and data center accelerator designs requiring stable component supply and long-term program support.

Supply support for XCVU13P-2FHGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, communications, and embedded markets through its Adaptive SoC and FPGA product lines.

The Virtex UltraScale+ family, including the XCVU13P-2FHGB2104E, was engineered for deterministic, high-bandwidth, low-latency processing in mission-critical infrastructure where software-defined hardware agility meets ASIC-level performance.

FAQ

What is the maximum supported transceiver line rate for the XCVU13P-2FHGB2104E?

The XCVU13P-2FHGB2104E supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers. This enables compliance with PCIe Gen4, 100G Ethernet KR4, and JESD204C standards. The -2 speed grade guarantees this performance under specified thermal and voltage conditions. All transceiver channels on the XCVU13P-2FHGB2104E are rated to this line rate when configured per AMD UG578.

Does the XCVU13P-2FHGB2104E include hardened PCIe Gen4 IP?

Yes, the XCVU13P-2FHGB2104E integrates hardened PCIe Gen4 x16 root port and endpoint blocks compliant with PCI-SIG specifications. These blocks operate at 16 GT/s per lane and include integrated DMA engines, TLP parsing, and error reporting logic. No external PHY or soft-core implementation is required-the XCVU13P-2FHGB2104E delivers full Gen4 functionality out-of-the-box.

What memory resources are available on the XCVU13P-2FHGB2104E?

The XCVU13P-2FHGB2104E provides 96.4 Mb of total on-chip memory, comprising 67.5 Mb of block RAM (BRAM) and 28.9 Mb of ultra RAM (URAM). URAM is organized as 288-bit-wide, true dual-port memory with independent read/write clocks, optimized for large FIFOs and coefficient storage in DSP pipelines. BRAM supports byte-enable and parity for safety-critical applications.

Is partial reconfiguration supported on the XCVU13P-2FHGB2104E?

Yes, the XCVU13P-2FHGB2104E fully supports partial reconfiguration (PR) as defined in AMD UG909. It allows dynamic swapping of logical partitions without resetting the entire device or interrupting active I/O or clock domains. PR is enabled via dedicated configuration logic and AXI-based control interfaces, making the XCVU13P-2FHGB2104E suitable for runtime-adaptable systems such as multi-standard radio base stations.

What is the thermal design power (TDP) of the XCVU13P-2FHGB2104E?

The typical thermal design power (TDP) of the XCVU13P-2FHGB2104E is 75 W under standard operating conditions with moderate logic utilization and transceiver activity. This value is derived from AMD's Power Estimator tool (XPE) v2023.2 using default settings. Actual power consumption varies based on configuration, clock frequency, and I/O loading-designers must perform per-application analysis using XPE before final thermal layout.