AMD XCVU13P-2FHGB2104I

Overview

XCVU13P-2FHGB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM; it supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces for advanced acceleration in data center and HPC applications.

For engineers reviewing the XCVU13P-2FHGB2104I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count (64), I/O voltage support (1.8 V/1.5 V/1.35 V/1.2 V), thermal design power (125 W typical), and package footprint compatibility with FCBGA2104.

Technical Context

The XCVU13P-2FHGB2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency transceivers operating up to 25.78125 Gb/s. It integrates 128 GTY transceiver quads and supports PAM4 signaling in select configurations.

Configuration is performed via dual-boot QSPI flash or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange for runtime adaptation in compute-intensive workloads.

Key Specifications

Pinout & Package

Package: Flip-Chip Ball Grid Array (FCBGA) with 2104 solder balls, 49.0 mm × 49.0 mm body, 0.8 mm ball pitch, and thermal lid integrated for enhanced heat dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA acceleration applications.

Compared with XCVU13P-2FLGA2577I, the XCVU13P-2FHGB2104I offers identical I/O count and smaller board footprint but trades 16 transceiver lanes and 8.1 Mb BRAM for tighter thermal envelope; versus XCVU9P-2FLGA2104I, it delivers +14.6% logic capacity and +12% transceiver bandwidth within the same PCB land pattern.

Availability

XCVU13P-2FHGB2104I is available at Aetrix Electronics and suitable for AI acceleration, 5G baseband processing, and high-performance computing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for XCVU13P-2FHGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and client devices.

The Virtex UltraScale+ family targets compute-intensive infrastructure applications demanding hardware adaptability, ultra-low latency, and multi-protocol serial I/O-especially in AI, networking, and radar signal processing.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU13P-2FHGB2104I?

The XCVU13P-2FHGB2104I supports GTY transceivers operating up to 25.78125 Gb/s per lane. This rate enables native PCIe Gen4 x16, 100G Ethernet (4×25G), and CPRI eCPRI protocols without gearbox ICs. The actual achievable rate depends on PCB channel loss, reference clock jitter, and receiver equalization settings configured in Vivado.

Does the XCVU13P-2FHGB2104I include a hardened DDR4 memory controller?

Yes, the XCVU13P-2FHGB2104I integrates a hardened DDR4 memory controller supporting dual-channel, 72-bit-wide interfaces with ECC at speeds up to 2400 MT/s. This controller resides in the I/O column and connects directly to I/O banks configured for SSTL-12, eliminating the need for soft RTL controllers and reducing timing closure complexity.

What configuration modes are supported by the XCVU13P-2FHGB2104I?

The XCVU13P-2FHGB2104I supports master SPI (x1/x2/x4), slave SPI, JTAG, and BPI configuration modes. Dual-boot capability allows fallback to a secondary bitstream stored in QSPI flash. Configuration security features include AES-256 encryption and HMAC authentication, both enforced during bitstream loading.

Is partial reconfiguration supported on the XCVU13P-2FHGB2104I?

Yes, the XCVU13P-2FHGB2104I fully supports partial reconfiguration through Vivado Design Suite. This enables dynamic logic partition swapping during operation-used in applications like adaptive beamforming, protocol stack updates, and real-time filter coefficient changes-without resetting the entire device or halting system operation.

What thermal management guidance applies to the XCVU13P-2FHGB2104I?

The XCVU13P-2FHGB2104I has a typical thermal design power of 125 W. AMD recommends a vapor chamber heatsink with ≥40 CFM airflow and six thermal vias under the package's central thermal pad. PCB stack-up must include internal copper planes for heat spreading, and junction temperature must remain below 100°C under worst-case operating conditions.