AMD XCVU13P-2FHGC2104E

Overview

XCVU13P-2FHGC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 72.5 Mb of block RAM, 9,024 DSP slices, and support for PCIe Gen4 x16, DDR4-2400, and 28.3 Gb/s transceivers. It is deployed in AI acceleration, 5G baseband processing, and high-end radar signal conditioning systems.

For engineers reviewing the XCVU13P-2FHGC2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, on-chip memory bandwidth, DSP resource density, and package thermal performance under sustained compute load.

Technical Context

The XCVU13P-2FHGC2104E implements a heterogeneous architecture with programmable logic fabric, hardened ARM Cortex-A53 processor subsystems (in certain variants), and integrated 28.3 Gb/s GTY transceivers. It supports multi-rate serial protocols including CPRI, JESD204B/C, and Ethernet up to 100G.

Its UltraScale+ architecture uses 16nm FinFET process technology, enabling dynamic power gating and clock gating across logic, memory, and I/O banks. The device includes dedicated routing for deterministic latency paths in time-critical signal processing chains.

Key Specifications

Pinout & Package

FHGC2104 is a 2104-ball flip-chip BGA package with thermal lid, designed for high-power FPGA operation and thermal dissipation in air-cooled and conduction-cooled systems. Ball pitch is 0.8 mm; footprint area is 49 mm × 49 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-2FLGA2577E, the XCVU13P-2FHGC2104E offers superior thermal performance in high-sustained-load scenarios; versus XCVU9P-2FLGA2104E, it delivers 14% more logic and 32% more DSP for compute-intensive workloads without changing PCB layout.

Availability

XCVU13P-2FHGC2104E is available at Aetrix Electronics and suitable for AI acceleration, 5G infrastructure, and medical imaging systems requiring stable component supply across long production cycles.

Supply support for XCVU13P-2FHGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing high-performance computing, graphics, and adaptive SoC solutions for data centers, AI, embedded, and communications markets.

The Virtex UltraScale+ family targets high-throughput, low-latency, and thermally demanding applications in aerospace, defense, wired/wireless infrastructure, and scientific instrumentation.

FAQ

What is the maximum supported DDR4 data rate for XCVU13P-2FHGC2104E?

The XCVU13P-2FHGC2104E supports DDR4-2400 (1200 MHz clock, 2400 MT/s data rate) with integrated memory controller and on-die termination. This capability is verified in AMD UG576 v1.14 and applies to all I/O banks configured for DDR4 operation. The XCVU13P-2FHGC2104E achieves this using calibrated delay-locked loops and programmable output drivers optimized for JEDEC-compliant timing windows.

Does XCVU13P-2FHGC2104E include a hard processor system (PS)?

No, the XCVU13P-2FHGC2104E is a pure FPGA device without an integrated hard processor system. Unlike Zynq UltraScale+ MPSoC devices, it contains only programmable logic, transceivers, memory, and DSP resources. The XCVU13P-2FHGC2104E relies on external processors or soft-core implementations for control-plane functions.

What thermal management guidance applies to XCVU13P-2FHGC2104E in continuous operation?

For continuous operation at full utilization, AMD recommends a board-level thermal solution achieving ≤0.9°C/W junction-to-ambient resistance. The XCVU13P-2FHGC2104E's FHGC2104 package includes a copper thermal lid; thermal interface material and heatsink must be selected to maintain junction temperature below 100°C. Thermal guidelines are detailed in AMD UG578 v1.12.

Which transceiver protocol standards are natively supported by XCVU13P-2FHGC2104E?

The XCVU13P-2FHGC2104E natively supports PCIe Gen4, 100G Ethernet (CAUI-4), CPRI, JESD204B/C, and SATA/SAS through its GTY transceivers. These protocols are implemented using hardened logic in the transceiver tile; no external serializer/deserializer is required. The XCVU13P-2FHGC2104E achieves compliance via built-in PRBS generators, eye diagram monitors, and adaptive equalization.

Can XCVU13P-2FHGC2104E be used for partial reconfiguration?

Yes, the XCVU13P-2FHGC2104E supports Dynamic Function eXchange (DFX) for partial reconfiguration. This allows runtime swapping of logical partitions without resetting the entire device. The XCVU13P-2FHGC2104E implements DFX using dedicated configuration access ports and frame-based bitstream loading, as documented in AMD UG909 v1.15.