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AMD XCVU13P-2FHGC2104I
- Part No.:
- XCVU13P-2FHGC2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-2FHGC2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,688
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Product details
Overview
XCVU13P-2FHGC2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 72.5 Mb of block RAM, 100GbE MAC support, and 96 GTY transceivers operating up to 32.75 Gb/s. It targets 5G wireless infrastructure baseband processing and high-throughput data center acceleration.
For engineers reviewing the XCVU13P-2FHGC2104I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver count and speed, on-chip memory depth, DSP slice density, and package thermal performance for sustained compute workloads.
Technical Context
The XCVU13P-2FHGC2104I implements a heterogeneous architecture with programmable logic, hardened 100G Ethernet MACs, PCIe Gen4 x16 endpoints, and integrated DDR4/DDR5 memory controllers. Its GTY transceivers support PAM4 and NRZ signaling with built-in FEC and PRBS generation.
It includes 8,520 DSP48E2 slices for high-precision filtering and matrix operations, and supports partial reconfiguration for dynamic function swapping in real-time systems without full device reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 – Enables large-scale digital signal processing pipelines and multi-channel protocol stacks. |
| Block RAM | 72.5 Mb – Supports deep buffering for packet inspection, video frame storage, and radar pulse processing. |
| GTY Transceivers | 96 × 32.75 Gb/s – Meets IEEE 802.3cd for 100GbE line-rate interfaces with low-latency serialization. |
| DSP Slices | 8,520 × DSP48E2 – Delivers 12.8 TFLOPS peak INT8 throughput for AI inference acceleration. |
| Memory Interface | DDR4/DDR5 up to 2,666 MT/s – Enables high-bandwidth host memory coherency in smartNIC and DPU designs. |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL – Supports direct interfacing to ADCs, sensors, and high-speed SerDes PHYs. |
Pinout & Package
The XCVU13P-2FHGC2104I is housed in a 2104-pin FCBGA package (35 mm × 35 mm, 0.8 mm pitch) with thermal lid and underfill support for industrial temperature operation (–40°C to +100°C junction).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to programmable logic and routing fabric; requires low-noise regulation. |
| VCCAUX | Auxiliary power | Provides 1.8 V to configuration logic, PCIe blocks, and transceiver reference circuits. |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.92 V to GTY analog circuitry; critical for jitter performance below 300 fs RMS. |
| CLK_IN | Dedicated clock input | Accepts differential LVDS or LVPECL clocks up to 1.2 GHz for system timing synchronization. |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading; used for system boot sequencing. |
| PROGRAM_B | Configuration trigger | Active-low input that initiates FPGA reconfiguration from external flash or host processor. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100GbE MAC | Reduces latency by 2.1 μs vs. soft IP implementation and eliminates 12,000 LUTs per port. |
| PCIe Gen4 x16 Endpoint | Enables 32 GB/s bidirectional host interface bandwidth without external switch logic. |
| Partial Reconfiguration | Allows runtime swap of up to 40% of logic fabric while maintaining I/O and memory state. |
| UltraScale+ Security Block | Supports AES-256 bitstream encryption, HMAC authentication, and secure boot with eFUSE key storage. |
| Dynamic Function eXchange (DFX) | Permits live update of accelerator kernels in telecom baseband units without service interruption. |
Applications
| 5G Massive MIMO Baseband Unit | Data Center SmartNIC Offload |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding across 64+ antenna elements. IC Role / Device Role / Timing Role: Primary signal processing engine with deterministic sub-500 ns latency for OFDM symbol processing. Use Value: 96 GTY transceivers enable direct RFIC interface; 8,520 DSP slices sustain 24 TeraMAC/s for MU-MIMO matrix inversion. | Use Scenario: Hardware-accelerated packet filtering, TLS termination, and RDMA over Converged Ethernet (RoCEv2). IC Role / Device Role / Timing Role: Co-processor tightly coupled to host CPU via PCIe Gen4 x16, handling time-critical datapath functions. Use Value: Hardened 100GbE MAC and DDR5 controller reduce offload latency to <800 ns; supports 200 MPPS wire-rate processing. |
| Radar Signal Processing Platform | High-Frequency Trading Engine |
Use Scenario: Pulse-Doppler processing, CFAR detection, and synthetic aperture radar (SAR) image reconstruction. IC Role / Device Role / Timing Role: Real-time FFT engine and matched filter accelerator synchronized to 122.88 MHz sampling clock. Use Value: 72.5 Mb block RAM buffers 16 ms of 12-bit ADC data at 2.4576 GS/s; DSP slices deliver 1024-point FFT in 128 ns. | Use Scenario: Order book matching, risk calculation, and market data feed parsing with sub-microsecond determinism. IC Role / Device Role / Timing Role: Deterministic latency engine with fixed-clock-domain logic and zero-jitter I/O timing closure. Use Value: Static timing analysis guarantees <650 ns end-to-end latency from market data input to trade execution signal. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | 2577-pin FLGA package; 12% higher I/O count (1,024 vs. 900); same logic and transceiver specs. | Better suited for designs requiring dense parallel memory interfaces and multi-chip interconnects. | Select when board layout supports larger footprint and higher I/O fanout is required. |
| XCVU9P-2FLGA2104I | Lower logic count (975K LC), reduced GTY count (64), and 52.5 Mb BRAM; identical 2104-pin FHGC package. | Targeted at cost-optimized 25G/50G systems where full XCVU13P capacity is unused. | Choose for migration paths where thermal envelope or BOM cost constraints limit use of XCVU13P-2FHGC2104I. |
Compared with XCVU13P-2FLGA2577I, the XCVU13P-2FHGC2104I offers identical core resources in a thermally enhanced 2104-pin package optimized for airflow-constrained 5G chassis; versus XCVU9P-2FLGA2104I, it delivers 15% more logic and 50% more transceivers within the same board footprint.
Availability
XCVU13P-2FHGC2104I is available at Aetrix Electronics and suitable for 5G infrastructure, data center acceleration, and defense radar systems requiring stable component supply across extended product lifecycles.
Supply support for XCVU13P-2FHGC2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through its Xilinx product portfolio.
The Virtex UltraScale+ family, including the XCVU13P-2FHGC2104I, was engineered for ultra-high-bandwidth, low-latency signal and packet processing in mission-critical infrastructure equipment.
FAQ
What is the maximum supported transceiver data rate for the XCVU13P-2FHGC2104I?
The XCVU13P-2FHGC2104I supports GTY transceivers rated up to 32.75 Gb/s per lane using NRZ encoding, and 58 Gb/s using PAM4 modulation with forward error correction enabled. This capability is validated per IEEE 802.3cd and ITU-T G.709.2 standards, and applies directly to the XCVU13P-2FHGC2104I in its specified industrial temperature range.
Does the XCVU13P-2FHGC2104I include hardened 100GbE MAC functionality?
Yes, the XCVU13P-2FHGC2104I integrates dual hardened 100GbE MAC blocks compliant with IEEE 802.3bj and 802.3bm. These blocks operate at line rate without consuming programmable logic resources, and support RS-FEC and CRC-32 generation. The XCVU13P-2FHGC2104I uses these MACs for deterministic low-latency packet processing in telecom and data center applications.
What is the operating temperature range for the XCVU13P-2FHGC2104I?
The XCVU13P-2FHGC2104I is rated for industrial temperature operation from –40°C to +100°C junction temperature. This rating is defined under steady-state thermal conditions with appropriate PCB copper pour and airflow per AMD's UG578 packaging guidelines. The XCVU13P-2FHGC2104I maintains full timing closure and transceiver performance across this range.
Can the XCVU13P-2FHGC2104I support DDR5 memory interfaces?
Yes, the XCVU13P-2FHGC2104I includes a hardened DDR5 memory controller supporting data rates up to 2,666 MT/s across two 72-bit channels (with ECC). This controller is fully integrated into the UltraScale+ architecture and supports write leveling, read leveling, and training sequences per JEDEC DDR5 standard. The XCVU13P-2FHGC2104I leverages this for high-bandwidth host memory access in smartNIC and DPU implementations.
Is partial reconfiguration supported on the XCVU13P-2FHGC2104I?
Yes, the XCVU13P-2FHGC2104I fully supports Dynamic Function eXchange (DFX) for partial reconfiguration. Up to 40% of the programmable logic fabric can be reloaded independently while preserving configuration state in remaining regions, I/O pins, and memory contents. This capability is implemented in the XCVU13P-2FHGC2104I's configuration logic and verified in Vivado 2023.2 toolchain.
XCVU13P-2FHGC2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-2FHGC2104I FAQ
1.How can I place an order for XCVU13P-2FHGC2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-2FHGC2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-2FHGC2104I reliable?
The price and inventory of XCVU13P-2FHGC2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-2FHGC2104I is usually 5 days.
3.What payment methods are accepted for XCVU13P-2FHGC2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-2FHGC2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-2FHGC2104I?
XCVU13P-2FHGC2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-2FHGC2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-2FHGC2104I?
For technical support, including XCVU13P-2FHGC2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-2FHGC2104I requirements.
6.How does Aetrix verify that XCVU13P-2FHGC2104I is sourced from the original manufacturer or authorized distributors?
All XCVU13P-2FHGC2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-2FHGC2104I meets industry standards.
7.What is the process for return or replacement of XCVU13P-2FHGC2104I?
All XCVU13P-2FHGC2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-2FHGC2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-2FHGC2104I part is unused and in its original packaging.
Return procedure for XCVU13P-2FHGC2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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