AMD XCVU13P-2FIGD2104E

Overview

XCVU13P-2FIGD2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25G/28G/58G transceivers, and DDR4 memory interfaces up to 2400 MT/s. Used in AI acceleration, radar signal processing, and high-throughput data center accelerators.

For engineers reviewing the XCVU13P-2FIGD2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, DSP slice count, I/O voltage support (1.8V/1.2V), and thermal design power (TDP) for cooling validation.

Technical Context

The XCVU13P-2FIGD2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and ultra-low-latency memory controllers. It integrates 58 Gb/s GTY transceivers with built-in PRBS generators and error detectors.

Its configuration relies on dual-boot capability via Quad-SPI flash or JTAG, supporting partial reconfiguration and bitstream encryption using AES-256 and HMAC-SHA-256. The device operates across Industrial temperature grade (-40°C to +100°C junction).

Key Specifications

Pinout & Package

The XCVU13P-2FIGD2104E is housed in a 2104-pin Flip-Chip BGA (FCBGA) package with 35×35 mm body size and 0.8 mm pitch. Thermal and mechanical data comply with AMD specification DS929.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-2FLGA2577E, the XCVU13P-2FIGD2104E offers identical logic and transceiver specs but in a smaller 2104-pin footprint-ideal for space-constrained accelerator cards. Versus XCVU9P-2FLGA2104E, it delivers 22% more logic and 38% more DSP slices while maintaining pin compatibility, enabling scalable performance upgrades without PCB redesign.

Availability

XCVU13P-2FIGD2104E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and high-resolution radar beamforming systems requiring stable component supply across multi-year production cycles.

Supply support for XCVU13P-2FIGD2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through its Adaptive SoC and FPGA product lines.

The Virtex UltraScale+ family targets high-throughput, low-latency applications including 5G infrastructure, aerospace radar, and AI hardware acceleration-designed to replace ASICs with field-programmable flexibility and hardened IP.

FAQ

What is the maximum supported data rate for transceivers on the XCVU13P-2FIGD2104E?

The XCVU13P-2FIGD2104E integrates GTY transceivers rated for up to 58 Gb/s per lane using PAM4 signaling. This specification is validated per AMD DS929 and supports direct connection to 100G/400G optical modules without external retimers. The XCVU13P-2FIGD2104E transceiver banks are configurable for protocols including PCIe Gen4, 100G Ethernet, and JESD204C.

Does the XCVU13P-2FIGD2104E support partial reconfiguration?

Yes, the XCVU13P-2FIGD2104E fully supports partial reconfiguration as defined in UG908. This capability allows dynamic replacement of logic modules during operation without resetting the entire device or disrupting active I/O channels. The XCVU13P-2FIGD2104E uses frame-based bitstream loading and CRC-protected configuration memory to ensure safe runtime updates.

What I/O standards are supported by the HP I/O banks of the XCVU13P-2FIGD2104E?

The HP I/O banks of the XCVU13P-2FIGD2104E support only 1.2V signaling standards including SSTL12, POD12, and differential standards such as LVDS and BLVDS. These banks are specifically optimized for DDR4 memory interfaces and high-speed serial links. The XCVU13P-2FIGD2104E does not support 1.8V or higher voltages on HP banks per DS929 Table 2-3.

Is bitstream encryption available on the XCVU13P-2FIGD2104E?

Yes, the XCVU13P-2FIGD2104E implements AES-256 encryption for bitstream confidentiality and HMAC-SHA-256 authentication for integrity verification. Keys are stored in eFUSE and protected by battery-backed SRAM. This security feature is enabled during bitstream generation in Vivado and enforced at configuration time-ensuring that only authorized bitstreams execute on the XCVU13P-2FIGD2104E.

What is the industrial temperature range for the XCVU13P-2FIGD2104E?

The XCVU13P-2FIGD2104E is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This rating is specified in AMD DS929 and verified under steady-state thermal conditions with appropriate board-level thermal management. The XCVU13P-2FIGD2104E maintains full timing compliance and functional correctness across this range.