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AMD XCVU13P-2FIGD2104I
- Part No.:
- XCVU13P-2FIGD2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-2FIGD2104I.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,823
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Product details
Overview
XCVU13P-2FIGD2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 28 Gbps transceivers, and DDR4 memory interfaces up to 2400 Mbps. Used in high-end radar signal processing and 5G massive MIMO baseband acceleration.
For engineers reviewing the XCVU13P-2FIGD2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count, system logic capacity, embedded memory bandwidth, and thermal envelope for air-cooled 2104-pin FC-BGA deployment.
Technical Context
The XCVU13P-2FIGD2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and ultra-low-latency AXI interconnect. Its transceivers support PAM4 and NRZ modulation with integrated clock data recovery.
It integrates dual 64-bit DDR4 memory controllers with ECC, hardened 100G/200G/400G Ethernet subsystems, and configurable hardened floating-point units for AI inference acceleration at the edge.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 7,520 - dedicated arithmetic units supporting 27×18 multiply-accumulate with 48-bit accumulation |
| Block RAM | 96.4 Mb - distributed and block RAM resources for on-chip data buffering and FIFOs |
| Transceiver Speed | 28.0 Gbps - maximum line rate per GTY transceiver lane, supporting 100G KR4 and CEI-28G |
| Memory Interface | DDR4-2400 - dual 64-bit controllers with on-die termination and write leveling |
| I/O Standards | LVDS, SSTL, HSTL, MIPI D-PHY - supports high-speed serdes and parallel memory interfaces |
| Package | FC-BGA 2104 - 35 mm × 35 mm, 0.8 mm pitch, thermal lid, RoHS-compliant |
Pinout & Package
Package: Flip-Chip Ball Grid Array (FC-BGA) with 2104 I/O balls, thermal lid, and 0.8 mm ball pitch. Designed for conduction-cooled and forced-air thermal management in high-density compute modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 0.85 V ±3% supply for FPGA fabric and CLB logic |
| VCCAUX | Auxiliary power supply | 1.8 V supply for configuration logic, SelectIO, and transceiver analog circuitry |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per I/O bank, enabling mixed-voltage interface support |
| MGTAVCC | Transceiver analog supply | 0.95 V supply for GTY transceiver PLLs and CDR circuits |
| CLK_IN | Dedicated clock input | Differential input for primary system clock feeding MMCM/PLL clock networks |
| INIT_B | Configuration status | Open-drain output indicating configuration completion or error state |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces latency and logic utilization vs. soft IP; supports SR-IOV and ATS for virtualized systems |
| UltraScale+ GTY transceivers | 28 Gbps operation with built-in PRBS generation/analyzer and eye scan for production test |
| Integrated 100G Ethernet subsystem | Includes RS-FEC, CRC, and flow control logic-no external PHY required for IEEE 802.3bj compliance |
| Configurable floating-point units | Enables hardware-accelerated FP16/FP32 matrix operations for low-latency AI inference kernels |
| System Monitor (XADC) | On-die temperature and supply voltage sensing with 1 MSPS sampling rate for real-time thermal throttling |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in AESA radar systems operating at X-band. IC Role / Device Role / Timing Role: Primary compute engine executing FFT, CFAR, and STAP algorithms with deterministic sub-microsecond latency. Use Value: 7,520 DSP slices and 28 Gbps transceivers enable simultaneous multi-channel ADC/DAC streaming and hardware-accelerated filtering. | Use Scenario: Digital pre-distortion (DPD) and channel estimation in 5G NR macro base stations with 64T64R antenna arrays. IC Role / Device Role / Timing Role: Real-time baseband processor handling OFDM symbol generation, MIMO precoding, and feedback loop control. Use Value: Dual DDR4-2400 controllers and hardened 100G Ethernet subsystem support high-throughput fronthaul and midhaul interface aggregation. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: FPGA-accelerated financial risk modeling and Monte Carlo simulation in low-latency trading platforms. IC Role / Device Role / Timing Role: Co-processor offloading compute-intensive kernels from host CPU via PCIe Gen4 x16 interface. Use Value: 1,122K logic cells and 96.4 Mb block RAM allow large-scale parallel state machines and deep pipeline architectures. | Use Scenario: High-resolution oscilloscope front-end with 10 GS/s sampling and real-time protocol decode. IC Role / Device Role / Timing Role: Real-time waveform analysis engine performing jitter measurement, serial protocol parsing (PCIe, USB 3.2), and histogram generation. Use Value: GTY transceivers and System Monitor enable precise timing calibration and thermal drift compensation during extended acquisition runs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | 2577-ball FLGA package, larger footprint (40 mm × 40 mm), higher thermal dissipation capability | Better suited for liquid-cooled or high-power-density systems requiring >40 W TDP headroom | Select when board layout allows larger package and thermal solution supports >45 W sustained power |
| XCVU9P-2FLGA2104I | Reduced logic (920K cells), fewer DSP slices (5,440), same 2104-ball FC-BGA package | Lower-cost option for applications with constrained algorithm complexity or lower channel count | Choose when design fits within 80% of XCVU13P resources and requires identical PCB footprint |
Compared with XCVU13P-2FLGA2577I, the XCVU13P-2FIGD2104I offers identical logic and transceiver performance in a smaller 35 mm × 35 mm FC-BGA package optimized for air-cooled systems; versus XCVU9P-2FLGA2104I, it delivers 22% more logic and 38% more DSP resources while maintaining pin compatibility and board reuse potential.
Availability
XCVU13P-2FIGD2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and high-performance computing applications requiring stable component supply across long product lifecycles.
Supply support for XCVU13P-2FIGD2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt efficiency.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications including aerospace, defense, wired/wireless infrastructure, and AI acceleration.
FAQ
What is the maximum supported transceiver data rate for XCVU13P-2FIGD2104I?
The XCVU13P-2FIGD2104I supports a maximum transceiver line rate of 28.0 Gbps using its GTY transceivers. This enables compliance with IEEE 802.3bj (100GBASE-KR4) and CEI-28G standards. The XCVU13P-2FIGD2104I achieves this rate with full forward error correction and built-in PRBS pattern generation for production validation.
Does XCVU13P-2FIGD2104I include hardened PCIe Gen4 support?
Yes, the XCVU13P-2FIGD2104I integrates a hardened PCIe Gen4 x16 endpoint/root port controller. This eliminates the need for soft IP implementation, reduces latency by up to 40 ns versus synthesizable alternatives, and supports advanced features including SR-IOV, ATS, and ECRC. The XCVU13P-2FIGD2104I uses dedicated routing and clocking resources for deterministic timing closure.
What memory interfaces are supported by XCVU13P-2FIGD2104I?
The XCVU13P-2FIGD2104I supports DDR4-2400 with dual 64-bit controllers, LPDDR4-4266, and RLDRAM3-2133. Each controller includes on-die termination, write leveling, and parity/ECC support. The XCVU13P-2FIGD2104I also provides native AXI4 interface bridging to enable seamless integration with ARM-based processing systems.
Is XCVU13P-2FIGD2104I suitable for automotive applications?
The XCVU13P-2FIGD2104I is rated for industrial temperature range (–40°C to +100°C case temperature) and supports ASIL-B functional safety requirements via its System Monitor, configuration security features, and CRC-based bitstream integrity checking. However, it is not AEC-Q100 qualified; for automotive use, the XCVU13P-2FIGD2104I requires additional system-level safety mechanisms and qualification per ISO 26262.
What configuration modes does XCVU13P-2FIGD2104I support?
The XCVU13P-2FIGD2104I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. It includes dual-boot capability with fallback bitstream storage and secure bitstream encryption using AES-256 and HMAC-SHA-256. Configuration time for the XCVU13P-2FIGD2104I is under 120 ms using compressed bitstream over quad-SPI at 100 MHz.
XCVU13P-2FIGD2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-2FIGD2104I FAQ
1.How can I place an order for XCVU13P-2FIGD2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-2FIGD2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-2FIGD2104I reliable?
The price and inventory of XCVU13P-2FIGD2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-2FIGD2104I is usually 5 days.
3.What payment methods are accepted for XCVU13P-2FIGD2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-2FIGD2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-2FIGD2104I?
XCVU13P-2FIGD2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-2FIGD2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-2FIGD2104I?
For technical support, including XCVU13P-2FIGD2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-2FIGD2104I requirements.
6.How does Aetrix verify that XCVU13P-2FIGD2104I is sourced from the original manufacturer or authorized distributors?
All XCVU13P-2FIGD2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-2FIGD2104I meets industry standards.
7.What is the process for return or replacement of XCVU13P-2FIGD2104I?
All XCVU13P-2FIGD2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-2FIGD2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-2FIGD2104I part is unused and in its original packaging.
Return procedure for XCVU13P-2FIGD2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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