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AMD XCVU13P-2FLGA2577E
- Part No.:
- XCVU13P-2FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU13P-2FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,141
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Product details
Overview
XCVU13P-2FLGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 84.2 GMAC/s DSP performance, and 96 GB/s transceiver bandwidth with 25.8 Gb/s GTY transceivers. It integrates hardened 100G Ethernet MACs and PCI Express Gen4 x16 root complex endpoints, deployed in 5G wireless infrastructure baseband units and high-throughput data center accelerators.
For engineers reviewing the XCVU13P-2FLGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include GTY transceiver count and speed, PCIe Gen4 endpoint support, hardened Ethernet MAC availability, and package I/O density for high-speed SerDes routing.
Technical Context
The XCVU13P-2FLGA2577E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices, block RAM, and hardened IP including 100G Ethernet MACs and PCIe Gen4 x16 root complex controllers. It supports AXI4-Stream and AXI4-MM interfaces for high-bandwidth data movement between fabric and hardened blocks.
GTY transceivers operate at up to 25.8 Gb/s with PAM4 capability, supporting protocols including CEI-28G-VSR, 100G KR4, and 200G CAUI-4. The device uses a 2577-ball flip-chip BGA (FLGA) package with 0.8 mm pitch and 36 × 36 mm body size.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational and sequential logic capacity for custom datapaths and control state machines |
| DSP Slices | 8,544 - delivers 84.2 GMAC/s at 2.5 GHz for high-precision filtering, FFT, and matrix operations |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - enables 200G/400G optical interface aggregation with PAM4 support |
| Block RAM | 75.9 Mb - provides on-die memory for buffering, FIFOs, and lookup tables without external DRAM |
| PCIe Gen4 x16 | Hardened root complex - reduces latency and CPU overhead in accelerator cards by handling configuration, TLP routing, and error reporting in silicon |
| 100G Ethernet MAC | 4× hardened cores - offloads MAC-layer framing, CRC, and flow control from firmware, enabling line-rate packet processing |
Pinout & Package
Package: Flip-Chip BGA (FLGA), 2577-ball, 0.8 mm pitch, 36 mm × 36 mm body, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V to FPGA fabric and CLBs; requires low-noise, high-current regulation |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, PCIe hard IP, and clock management tiles |
| VCCO | I/O bank power | Configurable per-bank (1.2–1.8 V); sets output swing and input threshold for LVDS/HSTL/SSTL |
| MGTAVCC | GTY analog supply | 1.0 V dedicated supply for GTY transceiver analog circuitry; sensitive to ripple & noise |
| CLK_IN | Dedicated clock input | Accepts differential reference clocks (10–700 MHz) for MMCM/PLL clock synthesis |
| INIT_B | Configuration status | Open-drain active-low signal indicating configuration memory readiness and bitstream validity |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces firmware load and latency in telecom front-haul/back-haul systems by executing MAC-layer functions in hardware |
| PCIe Gen4 x16 Root Complex | Enables direct host-CPU attachment without bridge chips, simplifying board layout and improving DMA efficiency |
| UltraScale+ DSP Slices with 27×18 multipliers | Supports single-cycle 48-bit accumulation and native floating-point approximation for radar and AI inference kernels |
| Integrated System Monitor (XADC) | Monitors on-die temperature, supply voltages, and external analog inputs with ±2% accuracy for thermal and power integrity validation |
| Partial Reconfiguration Support | Allows dynamic swapping of logic partitions during operation-critical for multi-standard radio and adaptive compute workloads |
Applications
| 5G Massive MIMO Baseband Processing | Data Center AI Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding across 64–256 antenna elements in sub-6 GHz and mmWave bands. IC Role / Device Role / Timing Role: FPGA fabric executes custom numerically intensive algorithms; GTY transceivers interface with RFICs via JESD204B/C; hardened MAC handles fronthaul CPRI/eCPRI transport. Use Value: Achieves deterministic <100 ns latency for closed-loop feedback and supports >100 Gbps fronthaul aggregation using 4× 25.8 Gb/s GTY lanes. | Use Scenario: Offloading transformer-based inference and sparse matrix multiplication from CPU/GPU in cloud inference servers. IC Role / Device Role / Timing Role: Configurable logic implements custom quantized arithmetic pipelines; PCIe Gen4 x16 connects directly to host CPU; block RAM buffers activation tensors. Use Value: Delivers 2.1× higher TOPS/W than GPU-based solutions for INT8 workloads while maintaining full PCIe compliance and driver compatibility. |
| High-Frequency Trading Engine | Test & Measurement Instrumentation |
Use Scenario: Sub-microsecond order execution with real-time market data parsing, risk checking, and protocol translation (FIX/OUCH to exchange-specific binary). IC Role / Device Role / Timing Role: Logic fabric processes packet headers and payloads in-line; GTY transceivers connect to 100G Ethernet NICs; hardened MAC performs zero-copy packet classification. Use Value: Enables end-to-end latency under 350 ns from NIC ingress to order wire output, meeting Tier-1 exchange co-location requirements. | Use Scenario: Multi-channel high-resolution oscilloscope with 10 GS/s sampling, real-time FFT, and protocol decode (PCIe, USB, MIPI). IC Role / Device Role / Timing Role: FPGA fabric synchronizes ADCs, manages deep memory capture, and runs real-time analysis engines; GTY transceivers stream captured data to host PC over 100G Ethernet. Use Value: Supports continuous 16-bit, 10 GS/s acquisition across 8 channels with on-device spectral analysis, eliminating bottleneck from PCIe Gen3 host interface. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577I | Industrial temperature grade (–40°C to +100°C) vs. extended grade (–40°C to +115°C); identical logic, transceiver, and IP resources | Targeted for industrial control and avionics where extended thermal margin is not required | Select XCVU13P-2FLGA2577I only when operating ambient does not exceed +100°C and qualification testing aligns with industrial standards |
| XCVU9P-2FLGA2104E | Smaller footprint (2104-ball FLGA), 772K logic cells, 48 GTY transceivers, no hardened 100G MAC; same voltage and thermal specs | Suitable for cost-optimized 100G line cards and mid-tier AI accelerators with lower throughput demands | Choose XCVU9P-2FLGA2104E when system bandwidth and logic capacity requirements are ≤70% of XCVU13P-2FLGA2577E specifications |
Compared with XCVU13P-2FLGA2577I and XCVU9P-2FLGA2104E, the XCVU13P-2FLGA2577E uniquely combines extended-temperature operation, highest GTY lane count, and hardened 100G MACs-making it the only option for thermally demanding 5G macro base stations requiring full 200G fronthaul aggregation and real-time L1 processing.
Availability
XCVU13P-2FLGA2577E is available at Aetrix Electronics and suitable for 5G wireless infrastructure, AI acceleration platforms, and high-frequency trading systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCVU13P-2FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, networking, and embedded systems.
The Virtex UltraScale+ family targets high-throughput, low-latency applications in wired/wireless communications, defense radar, and real-time signal processing where hardened IP and scalable logic resources are critical.
FAQ
What is the maximum operating junction temperature for the XCVU13P-2FLGA2577E?
The XCVU13P-2FLGA2577E has a maximum junction temperature of +115°C, certified under its extended temperature grade (E suffix). This rating is validated per JEDEC JESD22-A104 and applies under specified thermal design conditions with appropriate heatsink and airflow. The XCVU13P-2FLGA2577E must be operated within this limit to ensure timing closure and long-term reliability in high-power 5G baseband deployments.
Does the XCVU13P-2FLGA2577E support partial reconfiguration?
Yes, the XCVU13P-2FLGA2577E fully supports partial reconfiguration through Vivado Design Suite v2022.1 and later. This capability allows dynamic logic module swapping without resetting the entire device, enabling runtime adaptation in multi-standard radios and reconfigurable AI accelerators. The XCVU13P-2FLGA2577E implements dedicated configuration ports and frame-level access control to ensure safe, deterministic reconfiguration sequences.
How many PCIe Gen4 lanes does the XCVU13P-2FLGA2577E support in root complex mode?
The XCVU13P-2FLGA2577E supports one PCIe Gen4 x16 root complex endpoint in hardware, with full support for address translation, completion timeout, and advanced error reporting (AER). It does not support multiple independent root complexes or endpoint-only configurations. The XCVU13P-2FLGA2577E's root complex implementation complies with PCIe Base Spec 4.0 and is validated with Intel and AMD host platforms.
What transceiver protocols are natively supported by the GTY transceivers in the XCVU13P-2FLGA2577E?
The GTY transceivers in the XCVU13P-2FLGA2577E natively support CEI-28G-VSR, IEEE 802.3bj (100GBASE-KR4), IEEE 802.3bs (200GBASE-CR4/DR4), and OIF CEI-25G-LR. PAM4 encoding is supported at 25.8 Gb/s per lane. The XCVU13P-2FLGA2577E does not support OTN or Fibre Channel protocols in hardware; those require soft IP or external PHYs.
Is the XCVU13P-2FLGA2577E pin-compatible with other Virtex UltraScale+ devices in the FLGA2577 package?
No, the XCVU13P-2FLGA2577E is not pin-compatible with other Virtex UltraScale+ devices in the FLGA2577 package, including XCVU11P and XCVU19P. While all share the same 2577-ball FLGA mechanical footprint, ball assignments for power, I/O banks, and GTY quads differ significantly due to distinct internal resource maps and I/O architecture optimizations. Board-level reuse requires full schematic and layout validation for each specific part number.
XCVU13P-2FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU13P-2FLGA2577E FAQ
1.How can I place an order for XCVU13P-2FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-2FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-2FLGA2577E reliable?
The price and inventory of XCVU13P-2FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-2FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU13P-2FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-2FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-2FLGA2577E?
XCVU13P-2FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-2FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-2FLGA2577E?
For technical support, including XCVU13P-2FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-2FLGA2577E requirements.
6.How does Aetrix verify that XCVU13P-2FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-2FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-2FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU13P-2FLGA2577E?
All XCVU13P-2FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-2FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-2FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU13P-2FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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