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AMD XCVU13P-2FLGA2577I
- Part No.:
- XCVU13P-2FLGA2577I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU13P-2FLGA2577I.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,308
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Product details
Overview
XCVU13P-2FLGA2577I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,124K logic cells, 7,245 DSP slices, and 96.4 Mb of block RAM; it supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces for advanced acceleration in data center and AI inference applications.
For engineers reviewing the XCVU13P-2FLGA2577I datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count (64 GTY), I/O voltage support (1.8 V / 1.2 V / 1.0 V), thermal design power (TDP = 75 W), and package-specific routing constraints for FLGA2577.
Technical Context
The XCVU13P-2FLGA2577I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and adaptive compute resources. It integrates 64 GTY transceivers operating up to 25.78125 Gb/s and supports AMBA AXI4-Stream and AXI4-Lite interconnect protocols.
Configuration is performed via quad-SPI or BPI flash, JTAG, or SelectMAP interface; bitstream encryption and HMAC authentication are supported for secure boot. The device targets high-throughput, low-latency workloads requiring deterministic timing closure and multi-die integration capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,124,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 7,245 - dedicated arithmetic units supporting 27×18 multiply-accumulate at 500+ MHz |
| Block RAM | 96.4 Mb - distributed as 36 Kb BRAM primitives for on-chip data buffering and FIFOs |
| GTY Transceivers | 64 lanes - each supports 25.78125 Gb/s line rate for 100G Ethernet, CPRI, or custom serial protocols |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, and differential signaling up to 1.6 Gb/s per pin |
| Package | FLGA2577 - 2577-ball fine-pitch flip-chip BGA, 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant |
| TDP | 75 W - maximum thermal design power under worst-case switching activity and junction temperature of 100°C |
Pinout & Package
FLGA2577 is a 2577-ball flip-chip BGA package with 1.0 mm central die pad, thermal vias under die, and controlled impedance routing support. Ball map includes dedicated configuration pins (INIT_B, PROGRAM_B, CCLK), dual-purpose I/O banks (HR and HP), and dedicated transceiver power/ground pairs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Status indicator | Open-drain output indicating configuration status: low during initialization, high when complete |
| CCLK | Configuration clock | Input clock for master SPI configuration mode; frequency ≤ 50 MHz for reliable bitstream loading |
| MGTAVCC | Analog supply | 1.0 V ±3% dedicated analog power for GTY transceiver PLL and receiver front-end circuitry |
| VRP/VRN | Reference voltage | Differential reference pair for SSTL/HSTL I/O banks; must be externally biased to VCCO/2 |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 block | Reduces RTL integration effort and guarantees timing closure for host interface without soft-core overhead |
| UltraScale+ architecture with ASIC-like performance | Enables 500+ MHz system clocks and sub-ns timing margins in critical datapaths |
| Secure boot with AES-256 + HMAC-SHA256 | Prevents unauthorized bitstream execution and ensures firmware integrity across power cycles |
| Multi-die integration support | Allows stacking of FPGA dies with silicon interposer for scalable logic capacity beyond monolithic limits |
| Dynamic function exchange (DFX) | Enables partial reconfiguration of logic regions while maintaining system operation and I/O continuity |
Applications
| AI Acceleration Engine | Data Center SmartNIC |
|---|---|
Use Scenario: Real-time inference on vision transformer models with streaming video input. IC Role / Device Role / Timing Role: Programmable accelerator executing custom tensor operators and managing DDR4/HLBM2 memory coherency. Use Value: Delivers 128 TOPS INT8 throughput with deterministic latency under 10 µs per frame using 64 GTY lanes for sensor interface aggregation. | Use Scenario: Offloading TCP/IP stack, RDMA, and packet filtering in cloud server NICs. IC Role / Device Role / Timing Role: PCIe Gen4 endpoint implementing hardware-accelerated networking functions with zero-copy DMA to host memory. Use Value: Reduces CPU utilization by 40% and achieves 100 Gb/s line-rate processing using hardened 100G Ethernet MAC and 64 GTY transceivers. |
| 5G Radio Unit (RU) | High-Frequency Trading Platform |
Use Scenario: Massive MIMO beamforming and real-time channel estimation in O-RAN compliant RU. IC Role / Device Role / Timing Role: Baseband processor handling 256-QAM OFDM symbol generation, CFR, and DPD with ultra-low jitter clocking. Use Value: Supports 8×8 MIMO with 2×25 Gb/s fronthaul via CPRI-e over GTY transceivers and meets 3GPP TS 38.104 EVM < 2.5%. | Use Scenario: Latency-critical order matching engine with nanosecond timestamping and market data parsing. IC Role / Device Role / Timing Role: Deterministic timing core synchronizing multiple FPGA-based trading modules via PTPv2 over 25G Ethernet. Use Value: Achieves sub-5 ns time synchronization accuracy and 20 ns end-to-end latency using hardened 25G transceivers and AXI4-Stream interconnect. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGA2577E | Same logic capacity and transceiver count, but commercial-grade (-40°C to +100°C vs industrial -40°C to +100°C); lower TDP rating (65 W) | Suitable for lab validation and non-industrial deployments where extended temperature range is not required | Select XCVU13P-2FLGA2577E only if ambient operating temperature remains within 0–85°C and thermal headroom is constrained. |
| XCVU9P-2FLGA2104I | Smaller footprint (2104-ball), reduced logic (920K cells), fewer GTY lanes (48), and lower block RAM (64.8 Mb) | Targeted at cost-optimized edge AI inference and mid-tier 5G RU where full XCVU13P capacity is unnecessary | Choose XCVU9P-2FLGA2104I when system-level bandwidth and compute density requirements are ~25% lower than XCVU13P-2FLGA2577I. |
Compared with XCVU13P-2FLGA2577E and XCVU9P-2FLGA2104I, the XCVU13P-2FLGA2577I delivers highest transceiver count and logic density in the Virtex UltraScale+ family, enabling single-device implementation of full 100G+ systems without inter-FPGA interconnect overhead.
Availability
XCVU13P-2FLGA2577I is available at Aetrix Electronics and suitable for AI acceleration engines, data center SmartNICs, 5G radio units, and high-frequency trading platforms requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU13P-2FLGA2577I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI acceleration technologies with leadership in FPGA, GPU, and CPU architectures.
The Virtex UltraScale+ family is designed for high-bandwidth, low-latency infrastructure applications including cloud data centers, wired/wireless communications, and real-time signal processing systems.
FAQ
What is the maximum supported transceiver data rate for XCVU13P-2FLGA2577I?
The XCVU13P-2FLGA2577I supports GTY transceivers with a maximum line rate of 25.78125 Gb/s per lane. This enables compliance with 100G Ethernet (4×25G), CPRI-e, and custom high-speed serial protocols. All 64 GTY lanes meet this specification under industrial temperature conditions when powered with specified MGTAVCC and properly terminated.
Does XCVU13P-2FLGA2577I include a hardened PCIe Gen4 controller?
Yes, the XCVU13P-2FLGA2577I integrates a hardened PCIe Gen4 x16 endpoint block. It supports link training, LTSSM, and TLP processing without consuming programmable logic resources. The controller is fully compliant with PCI Express Base Specification Revision 4.0 and operates at 16 GT/s per lane.
What configuration modes are supported by XCVU13P-2FLGA2577I?
The XCVU13P-2FLGA2577I supports multiple configuration modes: master SPI (via quad-SPI flash), slave SelectMAP, JTAG boundary-scan, and BPI parallel flash. Configuration can be initiated by external processor or through internal fallback mechanisms triggered by PROGRAM_B assertion.
Is XCVU13P-2FLGA2577I qualified for industrial temperature operation?
Yes, the XCVU13P-2FLGA2577I is rated for industrial temperature range (-40°C to +100°C) and carries the 'I' suffix designation. Thermal management must maintain junction temperature ≤100°C under full load, requiring appropriate heatsink and airflow per AMD UG578 guidelines.
What security features are implemented in XCVU13P-2FLGA2577I?
The XCVU13P-2FLGA2577I provides AES-256 bitstream encryption, HMAC-SHA256 authentication, and secure key storage in eFUSE. These features enable secure boot, prevent cloning, and ensure runtime integrity verification. Bitstream decryption occurs in hardware before configuration logic loading.
XCVU13P-2FLGA2577I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.825V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU13P-2FLGA2577I FAQ
1.How can I place an order for XCVU13P-2FLGA2577I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-2FLGA2577I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-2FLGA2577I reliable?
The price and inventory of XCVU13P-2FLGA2577I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-2FLGA2577I is usually 5 days.
3.What payment methods are accepted for XCVU13P-2FLGA2577I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-2FLGA2577I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-2FLGA2577I?
XCVU13P-2FLGA2577I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-2FLGA2577I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-2FLGA2577I?
For technical support, including XCVU13P-2FLGA2577I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-2FLGA2577I requirements.
6.How does Aetrix verify that XCVU13P-2FLGA2577I is sourced from the original manufacturer or authorized distributors?
All XCVU13P-2FLGA2577I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-2FLGA2577I meets industry standards.
7.What is the process for return or replacement of XCVU13P-2FLGA2577I?
All XCVU13P-2FLGA2577I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-2FLGA2577I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-2FLGA2577I part is unused and in its original packaging.
Return procedure for XCVU13P-2FLGA2577I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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