AMD XCVU13P-2FSGA2577E

Overview

XCVU13P-2FSGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 84.2 GMAC/s DSP performance, and 96 GB/s transceiver bandwidth with 32 GTY transceivers operating up to 32.75 Gb/s. It integrates hardened PCIe Gen4 x16, 100G Ethernet MAC, and DDR4 memory controller, deployed in AI acceleration and high-throughput data center compute blades.

For engineers reviewing the XCVU13P-2FSGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed, on-chip memory block capacity, I/O voltage support (1.8 V / 1.2 V / 1.0 V), and thermal envelope for air-cooled rack-mounted systems.

Technical Context

The XCVU13P-2FSGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet, DDR4 PHY), and UltraScale+ routing interconnect. It supports partial reconfiguration and dynamic function exchange for runtime adaptation.

Its 32 GTY transceivers are organized in 8 banks of 4 lanes each, with independent reference clock inputs per bank and support for PAM4 signaling in specific configurations. The device includes 1,440 UltraRAM blocks (288 Mb total) and 1,248 Block RAMs (32 Mb total).

Key Specifications

Pinout & Package

The XCVU13P-2FSGA2577E is housed in a 2577-ball Fine-Pitch Flip-Chip BGA (FSGA) package with 0.8 mm pitch, designed for high-density PCB layouts and thermal dissipation via solder bumps and thermal lid contact.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA accelerator applications.

Compared with XCVU13P-2FSGA2577E, the FLGA variant offers identical logic and I/O capability but different mechanical and thermal mounting behavior, while the XCVU19P delivers measurable headroom in transceiver count and DSP throughput - both require separate PCB layout and thermal validation.

Availability

XCVU13P-2FSGA2577E is available at Aetrix Electronics and suitable for AI inference accelerators, data center SmartNICs, and 5G vDU platforms requiring stable component supply across multi-year production cycles.

Supply support for XCVU13P-2FSGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, and high-performance computing.

The Virtex UltraScale+ family targets high-bandwidth, low-latency acceleration in infrastructure applications where hardened IP, transceiver density, and memory bandwidth are decisive.

FAQ

What is the maximum supported data rate per GTY transceiver lane in XCVU13P-2FSGA2577E?

The XCVU13P-2FSGA2577E supports GTY transceiver data rates up to 32.75 Gb/s per lane. This is confirmed in AMD's UG578 v1.14.1, Table 1-2, and applies to all 32 GTY lanes under specified temperature and voltage conditions. The XCVU13P-2FSGA2577E achieves this rate using PAM4 encoding in select protocols and NRZ in others, with full support for 100G/200G/400G Ethernet and CPRI.

Does XCVU13P-2FSGA2577E include a hard ARM processor subsystem?

No, the XCVU13P-2FSGA2577E does not integrate a hard ARM processor subsystem. It belongs to the Virtex UltraScale+ FPGA portfolio, which provides only programmable logic fabric and hardened non-processor IP (e.g., PCIe Gen4, 100G Ethernet MAC). The XCVU13P-2FSGA2577E relies on external processors or soft-core implementations for control-plane functions.

What I/O voltage standards are supported by the HP I/O banks in XCVU13P-2FSGA2577E?

The HP (High-Performance) I/O banks in XCVU13P-2FSGA2577E support 1.0 V, 1.2 V, and 1.8 V I/O standards including SSTL12, SSTL15, and HSTL_I_18. These banks are optimized for memory interfaces like DDR4 and high-speed serial links, and do not support 2.5 V or 3.3 V signaling. The XCVU13P-2FSGA2577E documentation specifies strict voltage tolerance limits for reliable operation.

Can XCVU13P-2FSGA2577E be used for partial reconfiguration in production systems?

Yes, the XCVU13P-2FSGA2577E fully supports partial reconfiguration (PR) in production deployments. AMD's Vivado design suite provides certified PR flows, and the XCVU13P-2FSGA2577E includes dedicated configuration logic, frame-based bitstream loading, and CRC-protected configuration memory. Field-proven use cases include dynamic accelerator partition swapping in AI inference servers running the XCVU13P-2FSGA2577E.

What is the total on-chip memory capacity of XCVU13P-2FSGA2577E, excluding external DRAM?

The XCVU13P-2FSGA2577E provides 288 Mb of UltraRAM and 32 Mb of Block RAM, totaling 320 Mb of on-chip memory. All memory is accessible within the FPGA fabric without external bus arbitration. This capacity is fixed per XCVU13P-2FSGA2577E silicon and cannot be increased via configuration. The XCVU13P-2FSGA2577E uses these resources for deep buffering, coefficient storage, and state retention in real-time signal processing.