AMD XCVU13P-2FSGA2577I

Overview

XCVU13P-2FSGA2577I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 74.9 Mb of block RAM, 100 GTH/GTY transceivers supporting up to 32.75 Gb/s, and integrated hardened PCIe Gen4 x16 controller. It targets advanced radar processing, 5G massive MIMO baseband, and high-throughput data center acceleration.

For engineers reviewing the XCVU13P-2FSGA2577I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count and speed grade, system-level PCIe integration, deterministic timing closure for 500+ MHz fabric clocks, and thermal management in air-cooled 2577-pin FCBGA packages.

Technical Context

The XCVU13P-2FSGA2577I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers. Its -2 speed grade guarantees timing closure at 500 MHz for synchronous logic paths and supports 32.75 Gb/s PAM4 operation in GTY lanes.

It integrates dual 64-bit DDR4 memory controllers running at 2400 MT/s, 100G RS-FEC engines, and AXI4-Stream interfaces for high-bandwidth data movement. The device uses 16nm FinFET process and supports partial reconfiguration for dynamic function swapping.

Key Specifications

Pinout & Package

The XCVU13P-2FSGA2577I is housed in a 2577-ball Fine-Pitch Flip-Chip Ball Grid Array (FSGA2577) package with 1.0 mm ball pitch, thermal lid, and integrated voltage regulation telemetry.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-2FSGA2577I, the XCVU13P-2FLGA2577I offers identical electrical performance with enhanced thermal dissipation, while the XCVU9P-2FSGA2577I trades 18% logic and 36% transceiver capacity for lower power and BOM cost-both require no PCB redesign but differ in thermal and bandwidth headroom.

Availability

XCVU13P-2FSGA2577I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and data center smartNIC applications requiring stable component supply across extended product lifecycles.

Supply support for XCVU13P-2FSGA2577I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA solutions for data center, communications, and aerospace markets.

The Virtex UltraScale+ family delivers heterogeneous compute architectures with hardened interfaces and scalable logic density for mission-critical infrastructure requiring deterministic latency and long-term obsolescence protection.

FAQ

What is the maximum supported data rate per GTY transceiver lane in XCVU13P-2FSGA2577I?

The XCVU13P-2FSGA2577I supports up to 32.75 Gb/s per GTY transceiver lane using PAM4 signaling. This rating is guaranteed under -2 speed grade conditions with proper reference clock jitter (<0.3 ps RMS) and board-level signal integrity compliance. The XCVU13P-2FSGA2577I datasheet specifies this value in Table 5-2 of DS922, and it applies to all 100 GTY lanes in the device.

Does XCVU13P-2FSGA2577I include a hardened DDR4 memory controller?

Yes, the XCVU13P-2FSGA2577I integrates two independent hardened DDR4 memory controllers, each supporting 64-bit width and data rates up to 2400 MT/s. These controllers include built-in write leveling, read leveling, and periodic self-refresh logic. The XCVU13P-2FSGA2577I implements them as part of the UltraScale+ memory subsystem, eliminating the need for soft IP implementation.

Is XCVU13P-2FSGA2577I pin-compatible with other Virtex UltraScale+ devices in the FSGA2577 package?

No, XCVU13P-2FSGA2577I is not fully pin-compatible with other Virtex UltraScale+ devices in the FSGA2577 package. While the ball map aligns mechanically, power delivery requirements (VCCINT current, decoupling layout), transceiver bank assignments, and configuration pin behavior differ significantly between variants. The XCVU13P-2FSGA2577I requires its own validated power and signal integrity layout per UG578.

What PCIe generation and lane count does XCVU13P-2FSGA2577I support natively?

The XCVU13P-2FSGA2577I includes a hardened PCIe Gen4 x16 endpoint block compliant with PCI Express Base Specification Revision 4.0. It supports root complex and endpoint modes, ASPM L0s/L1, and SR-IOV. The XCVU13P-2FSGA2577I implements this as a dedicated hard macro, not synthesizable RTL, ensuring sub-100 ns latency and deterministic timing.

Can XCVU13P-2FSGA2577I perform partial reconfiguration in the field?

Yes, the XCVU13P-2FSGA2577I supports dynamic partial reconfiguration (PR) through JTAG or PCIe-based configuration interfaces. Up to 40% of the fabric can be reloaded while I/O banks and memory controllers remain operational. The XCVU13P-2FSGA2577I requires bitstream partitioning and checkpointing tools from Vivado 2022.2 or later, and PR regions must be constrained using Pblock directives.