AMD XCVU13P-3FHGA2104E

Overview

XCVU13P-3FHGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 84.2 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data center acceleration and radar signal processing.

For engineers reviewing the XCVU13P-3FHGA2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, on-chip memory bandwidth, thermal envelope (2104-pin FC-BGA, 0.8 mm pitch), and PCIe Gen4 compliance.

Technical Context

The XCVU13P-3FHGA2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated 25.8 Gb/s GTY transceivers. It supports deterministic low-latency routing and AXI4-Stream interfaces for real-time data flow.

It delivers 1.9 TMAC/s peak DSP performance and sustains 1.2 TB/s on-chip memory bandwidth via 84.2 Mb of distributed and block RAM. Configuration occurs through dual-boot QSPI or JTAG, with AES-256 bitstream encryption enabled.

Key Specifications

Pinout & Package

Package: 2104-pin Flip-Chip Ball Grid Array (FC-BGA), 35 mm × 35 mm, 0.8 mm ball pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-3FHGA2104E, the -2 speed grade offers lower power and cost at the expense of timing closure margin, while the XCVU9P reduces logic and memory capacity but retains identical transceiver performance-enabling scalable platform design across performance tiers.

Availability

XCVU13P-3FHGA2104E is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, AI accelerator cards, and high-end test equipment requiring stable component supply and long-term program support.

Supply support for XCVU13P-3FHGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, embedded systems, and intelligent edge devices.

The Virtex UltraScale+ family targets compute-intensive, low-latency applications including wireless infrastructure, defense radar, and AI acceleration-designed for deterministic timing, hardened interfaces, and system-level security.

FAQ

What is the maximum supported transceiver line rate for XCVU13P-3FHGA2104E?

The XCVU13P-3FHGA2104E supports GTY transceivers rated up to 25.8 Gb/s per lane. This line rate is validated across temperature and voltage corners per AMD's DS923 specification and enables JESD204C, 100G Ethernet, and CPRI protocols without external retiming. The XCVU13P-3FHGA2104E achieves this using calibrated analog front-ends and adaptive equalization.

Does XCVU13P-3FHGA2104E include a hardened PCIe Gen4 controller?

Yes, the XCVU13P-3FHGA2104E integrates a fully compliant, hardware-hardened PCIe Gen4 x16 endpoint controller. It supports ASPM L1 substates, SR-IOV, and AER reporting without soft IP. The XCVU13P-3FHGA2104E's controller meets PCI-SIG compliance test requirements and operates at 16 GT/s per lane with end-to-end error detection.

What package type and thermal characteristics apply to XCVU13P-3FHGA2104E?

XCVU13P-3FHGA2104E uses a 2104-ball FC-BGA package with 0.8 mm pitch and integrated thermal lid. Its thermal resistance (θJA) is 0.65 °C/W under JEDEC JESD51-2 conditions. The XCVU13P-3FHGA2104E requires a 6-layer PCB with ≥6 thermal vias per power ball and copper pour on inner layers for reliable operation at 25 W typical power.

How much block RAM does XCVU13P-3FHGA2104E provide, and what is its access bandwidth?

The XCVU13P-3FHGA2104E provides 84.2 Mb of total block RAM, configurable as true dual-port, simple dual-port, or single-port memory. Its peak theoretical bandwidth exceeds 1.2 TB/s when all RAM blocks operate concurrently at maximum clock rates. The XCVU13P-3FHGA2104E allocates RAM across 1,280 BRAM primitives, each supporting independent read/write clocks.

Is AES-256 bitstream encryption supported on XCVU13P-3FHGA2104E?

Yes, XCVU13P-3FHGA2104E supports hardware-accelerated AES-256 encryption for configuration bitstreams. Keys are stored in eFUSE and protected by HMAC authentication. The XCVU13P-3FHGA2104E enforces secure boot with tamper-resistant key provisioning and prevents unauthorized bitstream loading or readback.