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AMD XCVU13P-3FHGB2104E
- Part No.:
- XCVU13P-3FHGB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-3FHGB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,061
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Product details
Overview
XCVU13P-3FHGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 92.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.
For engineers reviewing the XCVU13P-3FHGB2104E datasheet, pinout, applications, or equivalent options, key selection considerations include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal envelope (2104-pin FC-BGA, 0.8 mm pitch), and configuration interface options (e.g., dual-boot QSPI, BPI, JTAG).
Technical Context
The XCVU13P-3FHGB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency memory interfaces. Its -3 speed grade guarantees timing closure at 25.8 Gb/s on GTY transceivers and supports 1.2 V core voltage operation.
It features 24 GTY transceiver quads (96 lanes), 32 I/O banks supporting LVDS, SSTL, HSTL, and MIPI signaling, and dual 64-bit DDR4 interfaces with ECC support up to 2400 MT/s. Configuration is supported via Master SPI, Slave SelectMAP, or JTAG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - Enables large-scale algorithm acceleration and multi-channel protocol stacks in single device. |
| DSP Slices | 7,520 - Supports concurrent high-throughput FIR filtering, FFTs, and matrix operations for real-time signal processing. |
| Block RAM | 92.4 Mb - Provides on-chip buffering for streaming data pipelines without external memory latency. |
| GTY Transceivers | 96 lanes @ 25.8 Gb/s - Meets IEEE 802.3bj/802.3by for 100G KR4/KR2 and CPRI/eCPRI fronthaul links. |
| I/O Banks | 32 banks - Allows mixed-voltage I/O (1.0–1.8 V) and simultaneous interface standards (e.g., DDR4 + MIPI CSI-2 + PCIe). |
| DDR4 Interface | Dual 64-bit w/ ECC - Delivers 38.4 GB/s aggregate bandwidth with error correction for mission-critical memory access. |
| Package | FC-BGA 2104, 0.8 mm pitch - Requires 10-layer PCB with controlled impedance routing and thermal vias under die. |
Pinout & Package
The XCVU13P-3FHGB2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FC-BGA) package with 0.8 mm ball pitch, designed for high-density interconnect and thermal dissipation in compute-accelerated systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 1.2 V to programmable logic and CLB resources; requires low-noise regulation and local decoupling. |
| VCCAUX | Auxiliary power supply | Provides 1.8 V to configuration logic, clocking, and transceiver reference circuits. |
| MGTAVCC | GTY analog supply | Delivers clean 0.92 V to GTY transceiver analog circuitry; sensitive to ripple and noise coupling. |
| CONFIG_IO | Configuration I/O bank | Supports Master SPI or JTAG configuration; must be powered before configuration begins. |
| CLK_IN | Primary clock input | Accepts differential LVDS or single-ended CMOS clocks up to 800 MHz for system timing reference. |
| INIT_B | Configuration status | Open-drain output indicating configuration status; pulled high during valid bitstream load. |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort and ensures compliance with PCIe Base Spec 4.0, including LTSSM and AER handling. |
| UltraScale+ architecture with ASIC-like performance | Enables 500+ MHz system clocking in critical paths without custom cell libraries or PDK dependencies. |
| Integrated 100G Ethernet MAC + RS-FEC | Offloads line-rate 100GbE framing, scrambling, and forward error correction from soft logic, saving >200K LUTs. |
| Multi-tenancy security features | Supports bitstream encryption (AES-256), HMAC authentication, and secure boot to protect intellectual property and firmware integrity. |
| Dynamic function exchange (DFX) | Allows partial reconfiguration of logic regions while system remains operational-critical for adaptive radio and runtime protocol switching. |
Applications
| AI Inference Acceleration | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time inference on vision transformer models using quantized INT8 weights and sparse activation patterns. IC Role / Device Role / Timing Role: Programmable accelerator executing custom systolic array logic, synchronized to 300 MHz clock domain with deterministic latency. Use Value: Delivers 12.4 TOPS/W at 25W TDP using on-die memory hierarchy and parallel DSP resource mapping. | Use Scenario: Uplink/downlink precoding and channel estimation across 64 antenna elements in sub-6 GHz 5G NR deployments. IC Role / Device Role / Timing Role: Real-time digital baseband processor implementing 3GPP Release 16 numerologies and LDPC decoding pipelines. Use Value: Achieves 2.1 μs end-to-end latency for Type 1 PDSCH processing with 96 GTY lanes feeding distributed RU units. |
| Phased Array Radar Processing | High-Fidelity Test Equipment |
Use Scenario: Pulse-Doppler beamforming and CFAR detection across 128 receive channels in airborne AESA radar systems. IC Role / Device Role / Timing Role: Coherent signal processor managing time-aligned ADC sampling, digital down-conversion, and STAP filtering. Use Value: Supports 16-bit ADC interface at 2.4 GSPS per channel with deterministic jitter < 120 fs RMS via GTY receiver calibration. | Use Scenario: High-resolution arbitrary waveform generation and real-time spectral analysis in 6 GHz vector signal analyzers. IC Role / Device Role / Timing Role: Timing and pattern generator controlling DAC/ADC sampling clocks, triggering, and data capture sequencing. Use Value: Enables sub-picosecond trigger skew control and 12 ns worst-case latency between analog input and display update. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGB2104I | Slower -2 speed grade; max GTY rate 22.5 Gb/s; lower static power (18% less at idle) | Suitable for cost-sensitive 100G Ethernet switch line cards where full 25.8 Gb/s is unused | Select when thermal budget is constrained and 25.8 Gb/s transceiver performance is not required. |
| XCVU9P-3FLGB2104E | Smaller logic capacity (975K LC), fewer GTY quads (16 vs. 24), same -3 speed grade and package footprint | Fits in space-constrained 5G small cell radios requiring PCIe Gen4 but not full 100G MAC integration | Choose for footprint-compatible migration path when design scales down in complexity or I/O count. |
Compared with XCVU13P-2FHGB2104I and XCVU9P-3FLGB2104E, the XCVU13P-3FHGB2104E delivers highest logic density and transceiver bandwidth in the 2104-pin FC-BGA form factor-enabling consolidation of multiple ASIC functions into one device without sacrificing timing margin or signal integrity.
Availability
XCVU13P-3FHGB2104E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and phased array radar systems requiring stable component supply across multi-year production cycles.
Supply support for XCVU13P-3FHGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family targets demanding infrastructure applications requiring hardened connectivity, deterministic latency, and field-upgradable logic-especially in 5G, defense radar, and cloud-native acceleration.
FAQ
What is the maximum guaranteed GTY transceiver data rate for XCVU13P-3FHGB2104E?
The XCVU13P-3FHGB2104E is rated for 25.8 Gb/s per GTY transceiver lane under the -3 speed grade, meeting IEEE 802.3bj specifications for 100GBASE-KR4. This rate is guaranteed across commercial temperature range (0°C to 85°C) with proper power delivery and board-level signal integrity design. The XCVU13P-3FHGB2104E supports this performance without derating when used with AMD's recommended reference designs and IBIS-AMI models.
Does XCVU13P-3FHGB2104E support PCIe Gen5?
No, the XCVU13P-3FHGB2104E integrates hardened PCIe Gen4 x16 controllers only-not Gen5. Its GTY transceivers operate up to 25.8 Gb/s, which falls short of the 32 GT/s required for PCIe Gen5. For Gen5 support, AMD recommends the Versal ACAP portfolio. The XCVU13P-3FHGB2104E remains optimal for Gen4-based applications such as smart NICs and storage accelerators where backward compatibility and mature ecosystem support are critical.
What configuration modes does XCVU13P-3FHGB2104E support?
The XCVU13P-3FHGB2104E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Dual-boot capability allows fallback to secondary bitstream stored in QSPI flash. Configuration is initiated via dedicated CONFIG_IO bank powered at 1.8 V, and the XCVU13P-3FHGB2104E validates bitstream CRC before releasing DONE. All modes are documented in UG570 and supported by Vivado 2023.2 toolchain.
Is XCVU13P-3FHGB2104E pin-compatible with other Virtex UltraScale+ devices in the 2104-pin package?
The XCVU13P-3FHGB2104E shares the same 2104-pin FC-BGA mechanical footprint with XCVU9P-3FLGB2104E and XCVU13P-2FHGB2104I, but pin functions differ across variants due to I/O bank allocation and hardened IP placement. While PCB layout can be reused, signal mapping and power delivery must be verified per device-specific pinout files (e.g., UG571). The XCVU13P-3FHGB2104E requires distinct VCCINT and MGTAVCC rail sequencing not identical to smaller variants.
What thermal management guidance applies to XCVU13P-3FHGB2104E?
The XCVU13P-3FHGB2104E has a maximum junction temperature of 100°C and requires active cooling in sustained 25W+ operation. AMD recommends a 40 mm² copper thermal pad under the package, ≥6 thermal vias per mm², and airflow ≥2.5 m/s. Thermal simulation using the XCVU13P-3FHGB2104E's detailed thermal model (in UG570 Appendix D) is mandatory for conduction-cooled enclosures. The XCVU13P-3FHGB2104E includes on-die temperature sensors accessible via JTAG for closed-loop fan control.
XCVU13P-3FHGB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-3FHGB2104E FAQ
1.How can I place an order for XCVU13P-3FHGB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-3FHGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-3FHGB2104E reliable?
The price and inventory of XCVU13P-3FHGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-3FHGB2104E is usually 5 days.
3.What payment methods are accepted for XCVU13P-3FHGB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-3FHGB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-3FHGB2104E?
XCVU13P-3FHGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-3FHGB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-3FHGB2104E?
For technical support, including XCVU13P-3FHGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-3FHGB2104E requirements.
6.How does Aetrix verify that XCVU13P-3FHGB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-3FHGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-3FHGB2104E meets industry standards.
7.What is the process for return or replacement of XCVU13P-3FHGB2104E?
All XCVU13P-3FHGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-3FHGB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-3FHGB2104E part is unused and in its original packaging.
Return procedure for XCVU13P-3FHGB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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