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AMD XCVU13P-3FHGC2104E
- Part No.:
- XCVU13P-3FHGC2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-3FHGC2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,507
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Product details
Overview
XCVU13P-3FHGC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,225 DSP slices, and 96.2 Mb of total on-chip memory. It supports PCIe Gen4 x16, 28 Gbps transceivers, and DDR4 memory interfaces up to 2400 Mbps, deployed in advanced radar signal processing and 5G massive MIMO baseband systems.
For engineers reviewing the XCVU13P-3FHGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal performance under sustained 28 Gbps operation, and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCVU13P-3FHGC2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and ultra-low-latency memory controllers. Its 3-speed grade guarantees timing closure at junction temperatures up to 100°C with 28 Gbps GTY transceivers operating in PAM4 mode.
Configuration is supported via dual BPI NOR flash or quad-SPI, with integrated SEU mitigation including ECC on block RAM and configuration memory. The device uses a 2104-pin FCBGA package with 1.0 mm pitch and 12 I/O banks supporting selectable VCCO from 1.2 V to 1.8 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic capacity for complex algorithm acceleration |
| DSP Slices | 7,225 - enables concurrent execution of >10,000 MAC operations per clock cycle for real-time filtering |
| Transceiver Speed | 28 Gbps - supports single-lane 100G Ethernet KR4 and CPRI eCPRI over copper/fiber |
| Memory Bandwidth | 96.2 Mb on-chip RAM - provides low-latency buffering for multi-channel beamforming engines |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - enables direct interfacing with ADCs, DACs, and memory without level shifters |
| Configuration Security | AES-256 + HMAC-SHA256 - prevents unauthorized bitstream cloning or tampering in defense-grade deployments |
Pinout & Package
The XCVU13P-3FHGC2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation in air- or liquid-cooled enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK[0-1] | Reference Clock Input | Provides clean 100–300 MHz reference for GTY transceivers; requires dedicated differential termination |
| MR | Master Reset | Asynchronous global reset that clears configuration registers and halts all logic activity |
| CCLK | Configuration Clock | Drives internal configuration state machine during slave serial or SelectMAP programming |
| INIT_B | Configuration Status | Open-drain output indicating successful bitstream load completion or CRC error detection |
| PROGRAM_B | Reconfiguration Trigger | Active-low input that initiates full reconfiguration from external flash or JTAG interface |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Compute Architecture | Combines programmable logic, hardened PCIe Gen4, and 100G Ethernet MAC for system-on-module integration |
| UltraScale+ Memory Controller | Supports DDR4-2400 with 64-bit bus width and ECC, enabling reliable high-throughput data streaming |
| Adaptive Logic Modules (ALMs) | Deliver 2× higher logic density than previous Virtex generations, reducing LUT count per function |
| SEU Mitigation | ECC on BRAM and configuration memory reduces soft-error-induced functional failures in radiation-prone environments |
| Multi-Boot Configuration | Allows secure fallback to factory image if field-updated bitstream fails integrity check |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing across 128 antenna elements with sub-microsecond latency requirements. IC Role / Device Role / Timing Role: FPGA fabric executes beam steering algorithms while hardened PCIe Gen4 interfaces stream IQ data to host CPU. Use Value: 28 Gbps GTY transceivers eliminate external SerDes, reducing board area and power by 35% versus discrete solutions. | Use Scenario: Uplink/downlink channel estimation and precoding for 256-QAM OFDM waveforms in macro-cell base stations. IC Role / Device Role / Timing Role: Configurable logic implements adaptive modulation/demodulation pipelines; DDR4 controller buffers bursty user-plane traffic. Use Value: 7,225 DSP slices enable simultaneous execution of 16 concurrent 5G NR layer-1 functions with deterministic timing. |
| High-Performance Computing Acceleration | Defense Electronic Warfare Systems |
Use Scenario: Offloading cryptographic hash verification and packet inspection in network intrusion detection appliances. IC Role / Device Role / Timing Role: Programmable logic accelerates SHA-3 and AES-GCM operations; hardened 100G Ethernet MAC handles line-rate packet parsing. Use Value: On-chip AES-256 encryption ensures secure bitstream loading and runtime key protection against physical tampering. | Use Scenario: Wideband electronic support measures (ESM) requiring instantaneous frequency measurement across 2–18 GHz RF front-ends. IC Role / Device Role / Timing Role: FPGA fabric digitizes and correlates wideband IF signals; GTY transceivers feed processed data to GPU-based analysis clusters. Use Value: 96.2 Mb on-chip memory enables real-time buffering of 200 µs of wideband capture without DRAM latency penalties. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FHGC2104E | Lower speed grade (2 vs. 3); reduced max transceiver speed (25 Gbps vs. 28 Gbps); same logic cell count and I/O count | Suitable for cost-sensitive 5G fronthaul where 25 Gbps lane rate suffices | Select when thermal budget limits sustained 28 Gbps operation or when PCIe Gen3 x16 meets bandwidth needs |
| XCVU9P-3FLGA2104E | Fewer logic cells (920K vs. 1,122K); identical 28 Gbps GTY transceivers and 2104-pin FCBGA package | Preferred for space-constrained EW platforms needing lower power but same I/O and transceiver compatibility | Choose when design fits within 920K logic cells and requires identical mechanical footprint and pinout |
Compared with XCVU13P-2FHGC2104E and XCVU9P-3FLGA2104E, the XCVU13P-3FHGC2104E delivers highest logic density and transceiver performance in the 2104-pin FCBGA form factor, making it optimal for next-generation radar and 5G infrastructure where both compute throughput and serial bandwidth are simultaneously constrained.
Availability
XCVU13P-3FHGC2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and defense electronic warfare systems requiring stable component supply across long product lifecycles.
Supply support for XCVU13P-3FHGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with emphasis on performance-per-watt and architectural innovation.
The Virtex UltraScale+ family targets high-bandwidth, low-latency applications in aerospace, defense, wired/wireless communications, and test & measurement, where deterministic timing and hardened IP integration are critical.
FAQ
What is the maximum supported DDR4 data rate for XCVU13P-3FHGC2104E?
The XCVU13P-3FHGC2104E supports DDR4 memory interfaces up to 2400 Mbps. This is achieved using its hardened memory controller with 64-bit bus width and optional ECC, enabling high-throughput, low-latency data movement essential for radar and 5G baseband workloads. The controller is fully compliant with JEDEC DDR4-2400 specifications and validated across temperature and voltage corners.
Does XCVU13P-3FHGC2104E include built-in PCIe Gen4 support?
Yes, the XCVU13P-3FHGC2104E integrates hardened PCIe Gen4 x16 root port and endpoint blocks. These are not soft IP cores but silicon-proven PHY and link layers, supporting full 16 GT/s per lane with automatic equalization, LTSSM compliance, and AER reporting. This eliminates the need for external PCIe switches or protocol bridges in high-speed host interface designs.
What configuration modes does XCVU13P-3FHGC2104E support?
The XCVU13P-3FHGC2104E supports multiple configuration modes including master SPI, slave serial, SelectMAP, and JTAG. Dual BPI NOR flash is supported for multi-image storage, and configuration can be initiated via PROGRAM_B or automatically on power-up. Bitstream authentication using HMAC-SHA256 is enforced in all modes when security features are enabled.
How many GTY transceivers are available on XCVU13P-3FHGC2104E?
The XCVU13P-3FHGC2104E includes 64 GTY transceiver quads, totaling 256 transceiver lanes. Each GTY supports data rates from 1.6 to 28 Gbps, with PAM4 capability at 28 Gbps. All GTYs are independently configurable and support protocols including PCIe Gen4, 100G Ethernet KR4, and CPRI/eCPRI, with full channel bonding and gearbox functionality.
Is XCVU13P-3FHGC2104E qualified for extended temperature operation?
The XCVU13P-3FHGC2104E is rated for industrial temperature range (–40°C to +100°C junction). Thermal validation confirms stable 28 Gbps GTY operation across this range when used with appropriate heatsinking and airflow per AMD's thermal design guidelines. No derating is required for transceiver performance at 100°C junction temperature.
XCVU13P-3FHGC2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-3FHGC2104E FAQ
1.How can I place an order for XCVU13P-3FHGC2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-3FHGC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-3FHGC2104E reliable?
The price and inventory of XCVU13P-3FHGC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-3FHGC2104E is usually 5 days.
3.What payment methods are accepted for XCVU13P-3FHGC2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-3FHGC2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-3FHGC2104E?
XCVU13P-3FHGC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-3FHGC2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-3FHGC2104E?
For technical support, including XCVU13P-3FHGC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-3FHGC2104E requirements.
6.How does Aetrix verify that XCVU13P-3FHGC2104E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-3FHGC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-3FHGC2104E meets industry standards.
7.What is the process for return or replacement of XCVU13P-3FHGC2104E?
All XCVU13P-3FHGC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-3FHGC2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-3FHGC2104E part is unused and in its original packaging.
Return procedure for XCVU13P-3FHGC2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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