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AMD XCVU13P-3FIGD2104E
- Part No.:
- XCVU13P-3FIGD2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU13P-3FIGD2104E.pdf
- Description:
- IC FPGA 676 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,155
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Product details
Overview
XCVU13P-3FIGD2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of total on-chip memory. It supports PCIe Gen4 x16, 28 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s, targeting advanced radar signal processing and 5G massive MIMO baseband acceleration.
For engineers reviewing the XCVU13P-3FIGD2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, system logic capacity, embedded memory bandwidth, and thermal design power envelope for air-cooled high-density compute modules.
Technical Context
The XCVU13P-3FIGD2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and ultra-low-latency interconnect. Its 28 Gb/s GTY transceivers support PAM4 and NRZ modulation, while the device integrates dual 64-bit DDR4 controllers with ECC and AXI-HP/ACCP interfaces.
Configured in speed grade -3, the device delivers deterministic timing closure for 500+ MHz system clocks and supports partial reconfiguration via ICAP and PCIe-based dynamic function exchange. Power management includes per-slice VCCINT rail control and real-time thermal monitoring via on-die sensors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - Enables implementation of multi-channel 5G L1 accelerators with full-layer scheduling logic. |
| DSP Slices | 7,520 - Supports concurrent 4×4 massive MIMO matrix inversion and beamforming at 200 MHz clock rate. |
| Transceiver Speed | 28 Gb/s (GTY) - Meets IEEE 802.3bs for 100G/200G optical transport line cards without retiming. |
| On-Chip Memory | 96.4 Mb Block RAM + UltraRAM - Provides >1 TB/s internal memory bandwidth for real-time SAR image reconstruction buffers. |
| Memory Interface | DDR4-2400 (64-bit ×2) - Delivers 38.4 GB/s aggregate bandwidth for radar pulse compression data streaming. |
| PCIe Interface | Gen4 x16 root port - Enables direct host CPU offload with sub-500 ns interrupt latency for adaptive beam control loops. |
Pinout & Package
Package: 2104-pin Flip Chip BGA (FCCSP), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant. Thermal pad exposed on underside for heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank | Configurable as SDIO, UART, SPI, or GPIO; supports 1.8V/3.3V I/O standards with programmable slew rate. |
| GTY_TX/RX[0:31] | High-Speed Transceiver Lane | 28 Gb/s differential pairs supporting CAUI-4, CEI-28G, and CPRI protocols with built-in PRBS generation/checking. |
| DDR4_A[0:15]/BA[0:2]/CK/CK# | DDR4 Address/Command Bus | Hardened interface to two independent 64-bit DDR4-2400 channels with on-die termination and write leveling calibration. |
| PCIE_CLK_P/N | PCIe Reference Clock Input | 250 MHz differential input driving integrated Gen4 PHY; requires external 100 ppm crystal oscillator. |
| VCCINT/VCCAUX/VCCO | Power Supply Rails | Separate 0.85V (core), 1.8V (aux), and 1.2–3.3V (I/O) supplies with dedicated decoupling requirements per UG578. |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous Compute Architecture | Combines programmable logic, hardened 100G Ethernet MAC, PCIe Gen4 controller, and DDR4 PHY to eliminate external glue logic in 5G fronthaul gateways. |
| Partial Reconfiguration Support | Enables runtime swapping of beamforming algorithms or radar waveform engines without system reset or host intervention. |
| UltraScale+ Security Engine | Includes AES-256 bitstream encryption, HMAC-SHA256 authentication, and secure boot with eFUSE key storage for defense-grade platform integrity. |
| Thermal Monitoring & Management | On-die temperature sensors feed real-time data to PMBus interface, enabling closed-loop fan control and dynamic voltage/frequency scaling below 85°C junction. |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time synthetic aperture radar (SAR) image formation on airborne platforms with strict SWaP-C constraints. IC Role / Device Role / Timing Role: Primary compute engine executing range-Doppler processing, motion compensation, and spotlight mode focusing using pipelined FFT and matrix operations. Use Value: 7,520 DSP slices enable 128-point complex FFT every 2.1 µs at 200 MHz, reducing latency by 4.3× versus ASIC alternatives. | Use Scenario: 64T64R massive MIMO baseband unit performing real-time precoding, channel estimation, and layer mapping for 3GPP NR FR1 deployments. IC Role / Device Role / Timing Role: Dual-role accelerator handling both UL MU-MIMO detection and DL beamformed OFDM symbol generation with deterministic 128-cycle latency. Use Value: Hardened 100G Ethernet MAC and 28 Gb/s GTY transceivers eliminate external SerDes, cutting board area by 32% and power by 18 W. |
| High-Performance Computing Accelerator | Defense Electronic Warfare System |
Use Scenario: FPGA-accelerated financial risk modeling cluster requiring low-latency deterministic execution across 16 parallel Monte Carlo simulation streams. IC Role / Device Role / Timing Role: Co-processor interfacing via PCIe Gen4 x16 to host CPU, executing stochastic differential equation solvers with double-precision floating-point emulation. Use Value: 1,122K logic cells support 16 fully independent solver pipelines with zero shared-resource contention, achieving 92% hardware utilization efficiency. | Use Scenario: Wideband electronic support measures (ESM) receiver detecting, identifying, and geolocating pulsed RF threats across 2–18 GHz spectrum. IC Role / Device Role / Timing Role: Real-time digital IF processor implementing polyphase filter banks, pulse descriptor word (PDW) extraction, and emitter fingerprinting logic. Use Value: On-chip 96.4 Mb memory enables 2.3 ms continuous IQ sample buffering at 2.4 GS/s, capturing full threat pulse trains without gap. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA compute acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-2FLGD2104I | Speed grade -2 (vs. -3); 15% lower max system clock frequency; identical logic/DSP/memory resources. | Suitable for non-real-time radar post-processing where 400 MHz clock suffices; not recommended for 5G L1 real-time loop closure. | Select when thermal budget limits require lower VCCINT voltage scaling and deterministic 400 MHz timing closure is sufficient. |
| XCVU9P-3FLGA2104E | Reduced scale: 983K logic cells, 5,440 DSP slices, single DDR4 controller; same package footprint and GTY transceiver count. | Applicable for mid-tier 5G small cell units or UAV-based EW systems with constrained SWaP; lacks dual DDR4 bandwidth for full 64T64R MIMO. | Choose when application fits within 87% of XCVU13P logic capacity and only one DDR4 channel is required. |
Compared with XCVU13P-2FLGD2104I and XCVU9P-3FLGA2104E, the XCVU13P-3FIGD2104E delivers highest deterministic clock performance and dual DDR4 bandwidth-critical for real-time 5G L1 and airborne SAR where latency and memory throughput directly impact system-level detection probability and resolution.
Availability
XCVU13P-3FIGD2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and defense electronic warfare systems requiring stable component supply across extended production lifecycles.
Supply support for XCVU13P-3FIGD2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets with focus on performance-per-watt innovation.
The Virtex UltraScale+ family targets high-throughput, low-latency infrastructure applications including 5G wireless infrastructure, aerospace radar, and high-performance computing acceleration.
FAQ
What is the maximum supported DDR4 data rate for the XCVU13P-3FIGD2104E?
The XCVU13P-3FIGD2104E supports DDR4 memory interfaces operating at up to 2400 MT/s across two independent 64-bit channels. This capability is implemented via hardened DDR4 PHY blocks compliant with JEDEC DDR4-2400 specifications and includes on-die termination, write leveling, and read/write leveling calibration sequences defined in UG576.
Does the XCVU13P-3FIGD2104E include hardened PCIe Gen4 support?
Yes, the XCVU13P-3FIGD2104E integrates a hardened PCIe Gen4 x16 root port controller with full link training, ASPM, and AER capabilities. It complies with PCI Express Base Specification Revision 4.0 and supports Advanced Error Reporting, hot plug, and MSI-X interrupt delivery without external bridge logic.
What thermal management features are implemented in the XCVU13P-3FIGD2104E?
The XCVU13P-3FIGD2104E includes on-die temperature sensors with ±2°C accuracy, PMBus-compatible thermal monitoring interface, and dynamic voltage/frequency scaling (DVFS) control registers accessible via ICAP. These features enable closed-loop thermal management in air-cooled enclosures per UG578 thermal guidelines.
Is partial reconfiguration supported on the XCVU13P-3FIGD2104E?
Yes, the XCVU13P-3FIGD2104E supports runtime partial reconfiguration through both ICAP and PCIe-based configuration access ports. Verified use cases include dynamic beamformer coefficient updates and radar waveform engine swaps while maintaining active transceiver links and memory traffic.
What security features does the XCVU13P-3FIGD2104E provide for bitstream protection?
The XCVU13P-3FIGD2104E implements AES-256 bitstream encryption with HMAC-SHA256 authentication, secure boot using eFUSE key storage, and tamper-resistant configuration memory. These features meet DO-326A/ED-202A and NSA Commercial Solutions for Classified (CSfC) requirements for protected platform integrity.
XCVU13P-3FIGD2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 676
- Number of Gates:
- -
- Voltage - Supply:
- 0.873V ~ 0.927V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (52.5x52.5)
XCVU13P-3FIGD2104E FAQ
1.How can I place an order for XCVU13P-3FIGD2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-3FIGD2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-3FIGD2104E reliable?
The price and inventory of XCVU13P-3FIGD2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-3FIGD2104E is usually 5 days.
3.What payment methods are accepted for XCVU13P-3FIGD2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-3FIGD2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-3FIGD2104E?
XCVU13P-3FIGD2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-3FIGD2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-3FIGD2104E?
For technical support, including XCVU13P-3FIGD2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-3FIGD2104E requirements.
6.How does Aetrix verify that XCVU13P-3FIGD2104E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-3FIGD2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-3FIGD2104E meets industry standards.
7.What is the process for return or replacement of XCVU13P-3FIGD2104E?
All XCVU13P-3FIGD2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-3FIGD2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-3FIGD2104E part is unused and in its original packaging.
Return procedure for XCVU13P-3FIGD2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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