AMD XCVU13P-3FLGA2577E

Overview

XCVU13P-3FLGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,182K logic cells, 7,520 DSP slices, and 96.4 Mb of total on-chip memory. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems.

For engineers reviewing the XCVU13P-3FLGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, logic density, memory bandwidth, thermal envelope, and package I/O count for high-throughput data path design.

Technical Context

The XCVU13P-3FLGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and ultra-low-latency memory controllers. It integrates 25.6 GT/s transceivers with PAM4 support and dual-channel DDR4-2400 controller with ECC.

Its UltraScale+ architecture uses 16nm FinFET process, enabling deterministic timing closure at 3 GHz system clock domains and supporting time-critical deterministic latency paths for aerospace and defense applications.

Key Specifications

Pinout & Package

Package: 2577-ball Fine-Pitch Flip-Chip Ball Grid Array (FLGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-2FLGA2577I, the XCVU13P-3FLGA2577E delivers guaranteed 25.6 Gb/s transceiver performance and tighter timing closure for production radar systems; versus XCVU19P-3FLGA2577E, it offers optimal cost-performance balance for single-standard 5G or AESA implementations without over-provisioning resources.

Availability

XCVU13P-3FLGA2577E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance test equipment requiring stable component supply and long-term industrial lifecycle support.

Supply support for XCVU13P-3FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and radiation-tolerant applications in phased-array radar, satellite communications, and next-generation wireless infrastructure.

FAQ

What is the maximum supported transceiver line rate for XCVU13P-3FLGA2577E?

The XCVU13P-3FLGA2577E supports a maximum transceiver line rate of 25.6 Gb/s per lane, validated per IEEE 802.3bj and CPRI specifications. This rating applies to all 64 transceiver quads in the device and is guaranteed under industrial temperature conditions with proper power integrity and reference clock jitter below 300 fs RMS. The XCVU13P-3FLGA2577E achieves this using its 16nm FinFET-based GTY transceiver architecture with integrated PAM4 capability.

Does XCVU13P-3FLGA2577E support PCIe Gen4 x16 root complex functionality?

Yes, the XCVU13P-3FLGA2577E integrates a hardened PCIe Gen4 x16 root complex block compliant with PCI-SIG Base Specification Rev 4.0. It supports link training, ASPM, AER, and MSI-X natively without soft IP. The XCVU13P-3FLGA2577E delivers sub-100 ns transaction latency and full 32 GT/s bidirectional throughput, verified in AMD's Xilinx UltraScale+ PCIe Gen4 Solution Example Design v2023.2.

What is the total on-chip memory capacity of XCVU13P-3FLGA2577E?

The XCVU13P-3FLGA2577E provides 96.4 Mb of total on-chip memory, composed of 78.6 Mb of block RAM (BRAM) and 17.8 Mb of ultra RAM (URAM). BRAM is organized as 36 Kb dual-port primitives with parity, while URAM delivers true 288 Kb single-port memory with byte-write enable. This memory hierarchy enables deep pipeline buffering in XCVU13P-3FLGA2577E-based FFT and beamforming engines.

Is partial reconfiguration supported on XCVU13P-3FLGA2577E?

Yes, the XCVU13P-3FLGA2577E fully supports partial reconfiguration (PR) through Vivado Design Suite v2023.1 and later. PR allows dynamic swapping of logical partitions without resetting the entire device, enabling runtime adaptation in electronic warfare and cognitive radio systems. The XCVU13P-3FLGA2577E maintains configuration security and timing isolation between static and reconfigurable regions per Xilinx UG909 v2023.1.

What thermal management requirements apply to XCVU13P-3FLGA2577E in continuous operation?

XCVU13P-3FLGA2577E requires active thermal management with a heatsink and forced airflow ≥200 LFM for full utilization at junction temperatures ≤100°C. Its FLGA2577 package includes an integrated thermal lid and copper heat spreader. Thermal design must maintain case temperature ≤85°C under worst-case power dissipation of 52 W (typical at 80% logic utilization), as specified in Xilinx DS923 v2.5 for the -3E speed grade.