AMD XCVU13P-3FSGA2577E

Overview

XCVU13P-3FSGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,124K logic cells, 7,520 DSP slices, and 96.4 Mb of total on-chip memory. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing and high-throughput data center acceleration systems.

For engineers reviewing the XCVU13P-3FSGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage flexibility, thermal envelope (2577-pin FCBGA, 35×35 mm), and configuration security options including AES-256 bitstream encryption.

Technical Context

The XCVU13P-3FSGA2577E implements a hardened 25 Gb/s transceiver architecture with PMA and PCS layers supporting multiple protocols including CPRI, JESD204B/C, and Ethernet. Its UltraScale+ architecture integrates programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and scalable memory controllers.

It features dual-core ARM Cortex-A53 processor subsystems for embedded control, configurable I/O banks supporting 1.8 V/1.5 V/1.35 V/1.2 V standards, and support for partial reconfiguration across multiple SLRs (Super Logic Regions) for dynamic function swapping.

Key Specifications

Pinout & Package

Package: 2577-pin Flip-Chip Ball Grid Array (FCBGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-3FSGA2577E, the -2I variant trades peak performance for thermal efficiency, while the XCVU9P-3E offers scaled-down resources-both require distinct timing closure and floorplanning but share identical package and pinout compatibility.

Availability

XCVU13P-3FSGA2577E is available at Aetrix Electronics and suitable for radar signal processing, 5G massive MIMO baseband, and high-throughput data center acceleration requiring stable component supply over extended production lifecycles.

Supply support for XCVU13P-3FSGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, networking, and embedded systems through FPGA, adaptive SoC, and CPU/GPU technologies.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and compute-intensive applications including aerospace radar, 5G infrastructure, and AI acceleration, with emphasis on hardened connectivity and security.

FAQ

What is the maximum supported transceiver data rate for XCVU13P-3FSGA2577E?

The XCVU13P-3FSGA2577E supports a maximum transceiver data rate of 25.78125 Gb/s per lane. This rate is validated for CPRI Option 10, JESD204C, and 25G Ethernet applications. The transceiver architecture includes dedicated PMA and PCS layers, and operation at this speed requires proper board-level signal integrity design per AMD UG578 guidelines. XCVU13P-3FSGA2577E achieves this performance in its -3 speed grade under specified thermal conditions.

Does XCVU13P-3FSGA2577E include an embedded processor subsystem?

Yes, XCVU13P-3FSGA2577E integrates a dual-core ARM Cortex-A53 64-bit processor subsystem with NEON and floating-point units. It runs standalone Linux or real-time OSes and communicates with programmable logic via AXI interfaces. The subsystem includes 256 KB of L2 cache and supports secure boot. XCVU13P-3FSGA2577E enables heterogeneous computing where control-plane tasks execute on ARM cores while data-plane acceleration runs in FPGA fabric.

What configuration security features does XCVU13P-3FSGA2577E provide?

XCVU13P-3FSGA2577E provides AES-256 bitstream encryption and HMAC-SHA256 authentication using eFUSE-based key storage. Secure boot validates the bitstream signature before loading, preventing unauthorized or tampered configurations. These features are hardware-enforced and active during both master SPI and JTAG configuration modes. XCVU13P-3FSGA2577E meets DO-254 and Common Criteria EAL4+ requirements for secure FPGA deployment.

Can XCVU13P-3FSGA2577E support DDR4 memory interfaces?

Yes, XCVU13P-3FSGA2577E supports DDR4 memory interfaces up to 2400 MT/s with x72 data bus width per memory controller. It includes hardened memory interface logic with calibration engines for write leveling, read/write leveling, and gate training. XCVU13P-3FSGA2577E supports up to four independent DDR4 controllers, each configurable for different memory topologies and timing parameters per UG576.

Is XCVU13P-3FSGA2577E pin-compatible with other Virtex UltraScale+ devices?

XCVU13P-3FSGA2577E uses a 2577-ball FCBGA package (FSGA2577) shared with other Virtex UltraScale+ devices like XCVU9P and XCVU11P in the same package variant. However, pin functionality is not fully interchangeable due to differing I/O bank allocations, transceiver placement, and power delivery requirements. XCVU13P-3FSGA2577E requires its own specific PCB layout and power delivery network per AMD UG575.