AMD XCVU13P-L2FHGA2104E

Overview

XCVU13P-L2FHGA2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 84.2 Mb of block RAM. It integrates hardened 25.78 Gb/s transceivers and supports PCI Express Gen4 x16, targeting high-bandwidth data center acceleration and 5G wireless infrastructure.

For engineers reviewing the XCVU13P-L2FHGA2104E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, memory bandwidth, thermal envelope (2104-pin FC-BGA, 35×35 mm), and support for DDR4-2400 interfaces.

Technical Context

The XCVU13P-L2FHGA2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP engines, and integrated hard IP including PCIe Gen4, 100G Ethernet MACs, and DDR4 memory controllers. It supports partial reconfiguration and AXI4-Stream interconnects for dynamic system adaptation.

Its transceiver bank supports PAM4 and NRZ signaling up to 25.78 Gb/s per lane with built-in FEC and PRBS generation. The device uses 16nm FinFET process technology and operates across Extended temperature range (–40°C to +100°C junction).

Key Specifications

Pinout & Package

Package: Flip-Chip Ball Grid Array (FC-BGA) with 2104 I/O balls, 35 mm × 35 mm body, 0.8 mm ball pitch, and integrated thermal lid for enhanced heat dissipation in high-power operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA acceleration applications.

Compared with XCVU13P-L2FHGA2104E, the -L2FSVA2104E offers cost savings in thermally controlled environments, while the XCVU19P-L2FHGA2104E provides headroom for future scalability-both share identical 2104-ball FC-BGA mechanical compatibility but differ in speed grade and silicon resources.

Availability

XCVU13P-L2FHGA2104E is available at Aetrix Electronics and suitable for data center acceleration, 5G wireless infrastructure, and high-frequency trading systems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCVU13P-L2FHGA2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company delivering high-performance computing, graphics, and adaptive SoC solutions for data centers, client devices, and embedded systems.

The Virtex UltraScale+ family targets compute-intensive, high-bandwidth applications including AI acceleration, 5G infrastructure, and real-time signal processing-designed for deterministic performance and hardware adaptability.

FAQ

What is the maximum supported DDR4 data rate for XCVU13P-L2FHGA2104E?

The XCVU13P-L2FHGA2104E supports DDR4-2400 (1200 MHz clock) across up to eight 64-bit memory interfaces. This delivers up to 19.2 GB/s per channel with programmable read/write leveling and on-die termination calibration. The hardened DDR4 controller in XCVU13P-L2FHGA2104E eliminates need for external PHY and reduces timing closure effort in memory subsystem design.

Does XCVU13P-L2FHGA2104E support PCIe Gen5?

No, XCVU13P-L2FHGA2104E integrates hardened PCIe Gen4 x16 endpoints-not Gen5. Its transceivers operate up to 25.78 Gb/s, which meets PCIe Gen4 requirements (16 GT/s) but falls short of Gen5's 32 GT/s. For Gen5 support, AMD recommends Versal ACAP devices. XCVU13P-L2FHGA2104E remains optimal for Gen4-based accelerators where bandwidth and latency meet target application specs.

What thermal solution is recommended for XCVU13P-L2FHGA2104E in continuous 100% utilization?

XCVU13P-L2FHGA2104E requires active cooling with a copper-core heatsink and ≥40 CFM airflow when operating at full utilization in extended temperature conditions. Its FC-BGA 2104 package includes a thermal lid rated for 1.5 W/mm² max power density. Thermal simulation using Xilinx Vivado Power Estimator confirms junction temperatures remain within –40°C to +100°C spec under these conditions when paired with Aetrix-recommended thermal interface material and mounting pressure.

Can XCVU13P-L2FHGA2104E implement multiple independent 100G Ethernet interfaces?

Yes, XCVU13P-L2FHGA2104E contains four hardened 100G Ethernet MAC blocks, each supporting IEEE 802.3bj/bs. These can be instantiated simultaneously for up to four independent 100G ports using QSFP28 or OSFP modules. Each MAC connects directly to transceiver lanes and supports full line-rate forwarding, CRC generation/checking, and flow control-all without consuming programmable logic resources. This capability is verified in XCVU13P-L2FHGA2104E production bitstreams.

Is partial reconfiguration supported on XCVU13P-L2FHGA2104E, and what tools enable it?

Yes, partial reconfiguration is fully supported on XCVU13P-L2FHGA2104E using Vivado Design Suite 2023.2 or later. The feature allows dynamic swapping of logical partitions (e.g., protocol engines or filter banks) while keeping the rest of the design operational. XCVU13P-L2FHGA2104E's configuration logic includes dedicated ICAP and PCIe-based configuration access ports, enabling secure, low-latency updates without system reset or downtime.