AMD XCVU13P-L2FHGB2104E

Overview

XCVU13P-L2FHGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of total on-chip memory. It supports PCIe Gen4 x16, 25G/28G/56G PAM4 transceivers, and hardened DDR4/LPDDR4 memory controllers. Used in AI acceleration, high-end radar processing, and 5G massive MIMO baseband units.

For engineers reviewing the XCVU13P-L2FHGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade, I/O bank voltage support (0.35–1.8 V), and thermal design power (TDP) of 72 W under typical operation.

Technical Context

The XCVU13P-L2FHGB2104E implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, DDR4 PHY, 100G Ethernet MAC), and ultra-low-latency interconnect. Its HBM2 interface delivers 460 GB/s memory bandwidth via two 128-bit channels.

It uses 16nm FinFET process technology, supports partial reconfiguration, and includes integrated ARM Cortex-R5 dual-core processor subsystem for real-time control. Configuration occurs via quad-SPI, BPI, or JTAG interfaces with AES-256 bitstream encryption.

Key Specifications

Pinout & Package

This device is housed in a 2104-pin FCBGA package (35 mm × 35 mm, 0.8 mm pitch) with 888 user I/Os distributed across 24 selectable I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU13P-L2FHGB2104E, the -L2FSVA2104E offers identical footprint but reduced memory bandwidth and speed, while the -L2FSVA2104E variant of XCVU19P provides scalable logic headroom at higher power and cost-enabling phased upgrades without architectural redesign.

Availability

XCVU13P-L2FHGB2104E is available at Aetrix Electronics and suitable for AI accelerator cards, 5G baseband units, and aerospace radar subsystems requiring stable component supply and long-term lifecycle assurance.

Supply support for XCVU13P-L2FHGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company specializing in adaptive computing, graphics, and AI technologies. It acquired Xilinx in 2022 to expand its leadership in programmable logic and heterogeneous acceleration.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications including defense radar, cloud AI infrastructure, and 5G wireless infrastructure-designed to replace ASICs with field-upgradable flexibility.

FAQ

What is the maximum supported transceiver data rate for XCVU13P-L2FHGB2104E?

The XCVU13P-L2FHGB2104E supports GTY transceivers rated up to 56 Gbps using PAM4 modulation. This enables single-lane 400GbE and 5G fronthaul applications. The device achieves this rate only when configured with appropriate reference clocks, PCB stackup, and termination-verified per AMD UG578 v1.14.2.

Does XCVU13P-L2FHGB2104E include on-chip memory beyond block RAM?

Yes, the XCVU13P-L2FHGB2104E integrates two 128-bit HBM2 memory stacks delivering 460 GB/s aggregate bandwidth and 8 GB total capacity. This is distinct from its 96.4 Mb of UltraRAM and block RAM. HBM2 is accessed via dedicated AXI-HP interfaces and requires specific power sequencing per UG578.

What configuration modes does XCVU13P-L2FHGB2104E support?

XCVU13P-L2FHGB2104E supports master SPI, slave serial, BPI, and JTAG configuration modes. Quad-SPI is most common for fast boot; JTAG is used for debugging and programming. All modes support AES-256 encrypted bitstreams, and configuration security is enforced regardless of mode selected.

Is partial reconfiguration supported on XCVU13P-L2FHGB2104E?

Yes, XCVU13P-L2FHGB2104E fully supports partial reconfiguration through Vivado Design Suite v2023.2+. This allows dynamic swapping of logical partitions during operation-used in radar waveform adaptation and AI model switching. Bitstream validation and CRC checking are enforced per reconfigured region.

What thermal management is required for sustained operation of XCVU13P-L2FHGB2104E?

XCVU13P-L2FHGB2104E has a typical TDP of 72 W and requires a heatsink with ≥0.15°C/W thermal resistance and ≥200 LFM airflow. The FCBGA package includes a thermal slug; mounting pressure must be 25–45 psi. Thermal sensors monitor junction temperature and trigger throttling above 100°C per DS923.