AMD XCVU13P-L2FHGC2104E

Overview

XCVU13P-L2FHGC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM; it supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces for advanced compute-accelerated workloads in AI inference and 5G baseband processing.

For engineers reviewing the XCVU13P-L2FHGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (64), I/O voltage support (0.35–1.8 V), thermal design power (TDP = 75 W), and package-specific routing constraints for high-speed SerDes and memory subsystems.

Technical Context

The XCVU13P-L2FHGC2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 controller), and ultra-low-latency interconnects. It integrates 64 GTY transceivers operating up to 25.78125 Gbps and supports AMBA AXI4-Stream and AXI4-Lite interfaces for SoC-level integration.

Configuration is performed via dual-mode JTAG or quad-SPI flash, with bitstream encryption using AES-256 and HMAC-SHA256. Partial reconfiguration capability enables dynamic function swapping without system reset, critical for multi-standard radio and adaptive compute platforms.

Key Specifications

Pinout & Package

FHGC2104 is a 2104-ball flip-chip BGA package with 12 power delivery rings, dedicated VCCINT/VCCAUX/VCCO banks per I/O column, and staggered GTY differential pairs routed to edge rows for minimal crosstalk.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA acceleration applications.

Compared with XCVU13P-L2FSVA2104E, the XCVU13P-L2FHGC2104E offers identical logic and I/O capability but differs in thermal pad layout and power ball assignment-requiring distinct PCB stack-up and decoupling. Against XCVU9P-L2FSVA2104E, it provides 14% more logic and 37% more DSP for higher-throughput workloads without changing package size.

Availability

XCVU13P-L2FHGC2104E is available at Aetrix Electronics and suitable for AI inference acceleration, 5G massive MIMO baseband processing, and high-frequency trading systems requiring stable component supply across multi-year production cycles.

Supply support for XCVU13P-L2FHGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and client markets with focus on performance-per-watt and architectural flexibility.

The Virtex UltraScale+ family targets high-bandwidth, low-latency compute-intensive applications including AI acceleration, wireless infrastructure, and financial analytics, leveraging heterogeneous integration of logic, memory, and hardened IP.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU13P-L2FHGC2104E?

The XCVU13P-L2FHGC2104E supports GTY transceivers operating up to 25.78125 Gbps per lane, validated per UG578 and confirmed in AMD's Virtex UltraScale+ DS922 specification. This rate enables 100G Ethernet KR4, PCIe Gen4 x16, and CPRI/eCPRI interfaces. The XCVU13P-L2FHGC2104E achieves this with integrated TX pre-emphasis and RX equalization, requiring proper PCB trace impedance control and reference clock jitter below 500 fs RMS.

Does the XCVU13P-L2FHGC2104E support partial reconfiguration?

Yes, the XCVU13P-L2FHGC2104E fully supports partial reconfiguration as defined in UG909 and enabled via Vivado Design Suite. This capability allows dynamic replacement of logical partitions while the rest of the design remains operational. The XCVU13P-L2FHGC2104E implements frame-based reconfiguration with CRC-protected bitstreams and secure authentication, essential for multi-standard radio and adaptive compute deployments.

What I/O standards are supported by the XCVU13P-L2FHGC2104E?

The XCVU13P-L2FHGC2104E supports 21 I/O standards including LVDS, BLVDS, RSDS, mini-LVDS, TMDS, SSTL, HSTL, POD, DIFF_HSTL, MIPI D-PHY, and sub-1V banks down to 0.35 V. Each I/O bank is independently configurable for voltage and standard. The XCVU13P-L2FHGC2104E's I/O architecture enables direct connection to high-speed ADCs, DDR4 memory, and optical module drivers without level-shifting components.

What is the thermal design power (TDP) of the XCVU13P-L2FHGC2104E?

The XCVU13P-L2FHGC2104E has a specified thermal design power (TDP) of 75 W under typical high-activity conditions per DS922. This value guides heatsink sizing, airflow requirements, and PCB copper layer planning. Actual power consumption varies with logic utilization, transceiver activity, and I/O toggle rate; the XCVU13P-L2FHGC2104E includes on-die temperature sensors and dynamic power gating to optimize real-time thermal behavior.

Is bitstream encryption supported on the XCVU13P-L2FHGC2104E?

Yes, the XCVU13P-L2FHGC2104E supports AES-256 bitstream encryption with HMAC-SHA256 authentication, implemented in hardware per UG570. Encrypted bitstreams prevent unauthorized readback and cloning. Keys are stored in eFUSE or external flash with secure boot enforcement. The XCVU13P-L2FHGC2104E requires no additional security ICs, reducing BOM cost and attack surface for mission-critical deployments.