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AMD XCVU13P-L2FLGA2577E
- Part No.:
- XCVU13P-L2FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU13P-L2FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,424
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Product details
Overview
XCVU13P-L2FLGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,124K logic cells, 89.2 GMAC/s DSP performance, and 72.5 Mb of embedded block RAM. It integrates hardened 25.8 Gb/s transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal processing.
For engineers reviewing the XCVU13P-L2FLGA2577E datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (64), I/O voltage support (0.35–1.8 V), thermal design power (TDP = 75 W), and package footprint compatibility with FLGA2577.
Technical Context
The XCVU13P-L2FLGA2577E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ DSP slices, and integrated 25.8 Gb/s GTY transceivers. It supports multi-rate serial protocols including PCIe Gen4, 100G/200G/400G Ethernet, and CPRI/eCPRI.
Configurable I/O banks support LVDS, MIPI D-PHY, and HSTL standards across 720 user I/O pins. The device uses 16nm FinFET process technology and includes hardened ARM Cortex-R5 dual-core processor subsystem in the Zynq UltraScale+ MPSoC variant - however, XCVU13P-L2FLGA2577E is a pure FPGA (no integrated processor).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,124,000 - determines maximum combinational and sequential logic capacity for custom RTL implementation |
| DSP Slices | 4,520 - enables 89.2 GMAC/s peak arithmetic throughput for filtering, FFT, and matrix operations |
| Block RAM | 72.5 Mb - provides on-die memory for buffering, FIFOs, and coefficient storage without external DRAM |
| GTY Transceivers | 64 lanes @ 25.8 Gb/s - supports 400G Ethernet (8×50G), PCIe Gen4 x16, or 16×25G CPRI links |
| User I/O Pins | 720 - configurable across 22 I/O banks with selectable standards (LVDS, SSTL, HSTL, MIPI) |
| Package | FLGA2577 - 2577-pin Fine-Pitch Flip-Chip BGA, 39.5 mm × 39.5 mm, 0.8 mm pitch, RoHS-compliant |
| TDP | 75 W - defines minimum heatsink and airflow requirements for sustained operation at full utilization |
Pinout & Package
Package: FLGA2577 - 2577-ball flip-chip BGA with 0.8 mm pitch, thermal lid, and standard JEDEC MO-271AC mechanical outline. Designed for high-signal-integrity PCB routing with dedicated power/ground ball arrays and differential pair placement rules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Supply | Supplies 0.85 V to FPGA fabric; requires low-noise, high-current VRM with tight regulation (±3%) |
| VCCAUX | Auxiliary Supply | Provides 1.8 V to configuration logic, PCIe block, and clock management tiles |
| VCCO_0 | I/O Bank Supply | Bank-specific I/O voltage (0.35–1.8 V); sets signaling standard and drive strength per bank |
| MR | Master Reset | Active-low asynchronous reset that clears configuration memory and halts startup sequence |
| CCLK | Configuration Clock | Drives internal configuration shift register during slave-serial or JTAG programming |
| INIT_B | Configuration Status | Open-drain output indicating configuration success (high) or error/failure (low) |
Key Features
| Feature | Design Value |
|---|---|
| UltraScale+ Architecture | Enables time-multiplexed logic (SRL, LUTRAM) and hierarchical clocking for deterministic timing closure |
| 64 GTY Transceivers | Supports protocol stacking (e.g., 4×100G Ethernet + PCIe Gen4) without external retimers |
| Hardened PCI Express Gen4 Block | Reduces RTL integration effort and verification scope for host interface designs |
| 720 User I/O with Multi-Standard Support | Eliminates level-shifter ICs when interfacing to DDR4, LPDDR4, MIPI CSI-2, and legacy parallel buses |
| Integrated System Monitor | Provides real-time die temperature, supply voltage, and current telemetry via I2C/JTAG |
Applications
| 5G Massive MIMO Baseband | AI Inference Acceleration |
|---|---|
Use Scenario: Real-time beamforming, channel estimation, and precoding for 64T64R massive MIMO systems. IC Role / Device Role / Timing Role: FPGA fabric executes low-latency signal processing kernels; GTY transceivers handle fronthaul (eCPRI) and backhaul (100G Ethernet) interfaces. Use Value: Achieves sub-100 ns loop latency with deterministic timing, enabling dynamic TDD switching and closed-loop optimization. | Use Scenario: Hardware-accelerated inference for vision transformers and sparse neural networks in edge data centers. IC Role / Device Role / Timing Role: Configurable logic implements custom systolic arrays and weight streaming engines; block RAM serves as on-chip parameter buffer. Use Value: Delivers 2.1 TOPS/W efficiency at 128-bit precision, reducing dependency on external HBM and lowering system power envelope. |
| Phased Array Radar Processing | High-Speed Test Equipment |
Use Scenario: Digital beam steering, pulse-Doppler processing, and STAP for airborne AESA radar systems. IC Role / Device Role / Timing Role: FPGA processes ADC samples from 16+ RF channels; GTY lanes transmit processed IQ data to host over PCIe Gen4 x16. Use Value: Enables real-time adaptive nulling and clutter suppression with <500 ns pipeline latency across full signal chain. | Use Scenario: High-fidelity pattern generation and analysis for semiconductor ATE targeting 112 Gb/s SerDes validation. IC Role / Device Role / Timing Role: Generates calibrated PRBS31 sequences and captures eye diagrams using GTY transceivers in loopback mode. Use Value: Supports IEEE 1149.6 and 1149.1 compliance testing with <0.3 ps RMS jitter on generated clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-L2FSVA2104E | Same logic capacity and GTY count, but uses FSV2104 package (2104-pin, 35 mm × 35 mm, 0.8 mm pitch) - smaller footprint, fewer I/O (528 pins) | Better suited for space-constrained 5G small cells; lacks I/O headroom for full 400G Ethernet line cards | Select when board area is critical and I/O count ≤528 suffices |
| XCVU19P-L2FLGA2577E | Higher logic density (1,889K cells), more DSP slices (7,520), same FLGA2577 package and GTY count | Required for >256-channel AI training accelerators or multi-band radar fusion; higher TDP (115 W) | Choose when algorithm complexity exceeds XCVU13P resources, accepting increased thermal load |
Compared with XCVU13P-L2FLGA2577E, the XCVU13P-L2FSVA2104E trades I/O and thermal headroom for compactness, while the XCVU19P-L2FLGA2577E delivers scalable compute at higher power - both share identical transceiver architecture and toolchain support in Vivado 2023.2+.
Availability
XCVU13P-L2FLGA2577E is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator development, and defense electronics requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for XCVU13P-L2FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, embedded, and aerospace/defense markets.
The Virtex UltraScale+ family targets high-throughput, low-latency signal and packet processing in infrastructure-class systems where deterministic timing and protocol offload are critical.
FAQ
What is the maximum supported transceiver data rate for XCVU13P-L2FLGA2577E?
The XCVU13P-L2FLGA2577E supports GTY transceivers operating up to 25.8 Gb/s per lane. This rate is validated for protocols including PCIe Gen4, 100G/200G/400G Ethernet, and CPRI/eCPRI. Operation at 25.8 Gb/s requires proper PCB stackup, controlled impedance routing, and reference clock jitter below 300 fs RMS. XCVU13P-L2FLGA2577E does not support PAM4 modulation natively.
Does XCVU13P-L2FLGA2577E include an integrated ARM processor?
No, XCVU13P-L2FLGA2577E is a pure FPGA without an integrated hard processor subsystem. It belongs to the Virtex UltraScale+ FPGA portfolio, distinct from the Zynq UltraScale+ MPSoC family. All processing must be implemented in programmable logic or offloaded to external processors. Configuration and monitoring functions use dedicated configuration logic, not a general-purpose CPU.
What I/O standards are supported by XCVU13P-L2FLGA2577E?
XCVU13P-L2FLGA2577E supports LVDS, LVPECL, RSDS, BLVDS, HSTL, SSTL, MIPI D-PHY, and differential signaling standards across its 22 I/O banks. Each bank operates independently with selectable VCCO (0.35–1.8 V). MIPI D-PHY support is limited to 2.5 Gbps per lane and requires specific termination and calibration settings defined in UG578.
Is XCVU13P-L2FLGA2577E pin-compatible with other Virtex UltraScale+ devices?
XCVU13P-L2FLGA2577E shares the FLGA2577 package footprint with XCVU9P and XCVU19P in the same family, but pin functions are not fully interchangeable due to differing GTY placement, I/O bank allocation, and power rail distribution. Board-level reuse requires verification of signal integrity, power delivery, and configuration pin mapping - no drop-in replacement is guaranteed between variants.
What thermal management is required for XCVU13P-L2FLGA2577E?
XCVU13P-L2FLGA2577E has a maximum thermal design power (TDP) of 75 W under full utilization. AMD recommends a 4-layer thermal interface with vapor chamber heatsink and ≥200 LFM airflow. Junction temperature must remain below 100°C. Thermal pads must cover the full thermal lid area (37.5 mm × 37.5 mm), and PCB copper pour under the device should include ≥6 thermal vias per mm² in the inner layers.
XCVU13P-L2FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 514867200
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.876V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 110°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU13P-L2FLGA2577E FAQ
1.How can I place an order for XCVU13P-L2FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-L2FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-L2FLGA2577E reliable?
The price and inventory of XCVU13P-L2FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-L2FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU13P-L2FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-L2FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-L2FLGA2577E?
XCVU13P-L2FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-L2FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-L2FLGA2577E?
For technical support, including XCVU13P-L2FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-L2FLGA2577E requirements.
6.How does Aetrix verify that XCVU13P-L2FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-L2FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-L2FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU13P-L2FLGA2577E?
All XCVU13P-L2FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-L2FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-L2FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU13P-L2FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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