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AMD XCVU13P-L2FSGA2577E
- Part No.:
- XCVU13P-L2FSGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU13P-L2FSGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,197
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Product details
Overview
XCVU13P-L2FSGA2577E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,240 DSP slices, and 92.4 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems.
For engineers reviewing the XCVU13P-L2FSGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, on-chip memory bandwidth, I/O voltage flexibility, and thermal envelope for conduction-cooled modules.
Technical Context
The XCVU13P-L2FSGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DDR4 PHY), and multi-rate transceivers operating up to 25.78125 Gb/s. It integrates UltraScale+ SelectIO technology supporting 1.8 V, 1.5 V, 1.35 V, and 1.2 V I/O standards.
Its configuration uses dual-boot capability with fallback support via quad-SPI or BPI flash, and secure bitstream encryption with AES-256 and HMAC authentication. The device targets deterministic low-latency processing in aerospace and defense avionics where reconfiguration integrity is critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic capacity for algorithm partitioning |
| DSP Slices | 7,240 - enables concurrent multiply-accumulate operations for real-time FFT and beamforming |
| Block RAM | 92.4 Mb - provides on-die memory for frame buffering and coefficient storage without external DRAM |
| Transceiver Max Rate | 25.78125 Gb/s - supports JESD204B/C ADC/DAC interfacing at full lane count |
| I/O Standards | LVCMOS, SSTL, HSTL, MIPI - allows direct connection to diverse sensors, memory, and SerDes peripherals |
| Configuration Interface | Quad-SPI/BPI - enables fast, secure, and field-upgradable bitstream loading |
| Encryption Support | AES-256 + HMAC - ensures bitstream confidentiality and authenticity against tampering |
Pinout & Package
Package: 2577-ball Flip-Chip Staggered Grid Array (FSGA), 35 mm × 35 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to programmable logic and CLB fabric |
| VCCAUX | Auxiliary power | Provides 1.8 V to configuration circuitry, PCIe block, and clock management tiles |
| VCCO_0 | I/O bank power | Configurable 1.2–1.8 V per bank for mixed-voltage interface support |
| MGTAVCC | Transceiver analog supply | Delivers ultra-low-noise 0.92 V to high-speed serial lanes |
| CLK_IN | Dedicated clock input | Accepts single-ended or differential reference clocks up to 1.2 GHz for MMCM/PLL locking |
| INIT_B | Configuration status | Open-drain output indicating bitstream load success/failure during startup |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute fabric | Combines programmable logic, hardened PCIe Gen4, and 100G Ethernet for system-on-module integration |
| UltraScale+ SelectIO | Supports simultaneous 1.2 V and 1.8 V I/O banks enabling legacy and next-gen peripheral coexistence |
| 25G multi-rate transceivers | Each lane configurable from 1.25 to 25.78125 Gb/s, eliminating need for external retimers in JESD204C links |
| Secure configuration | AES-256 encryption with HMAC authentication prevents unauthorized bitstream cloning or replay attacks |
| Thermal-aware packaging | FSGA package with integrated lid enables >25 W sustained power dissipation under conduction cooling |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and digital beamforming across 128-element antenna arrays. IC Role / Device Role / Timing Role: Primary baseband processor implementing adaptive filtering, channel estimation, and precoding in L-band phased array radar. Use Value: On-chip 92.4 Mb RAM eliminates off-chip memory latency; 25G transceivers directly interface with RFICs using JESD204C. | Use Scenario: Distributed unit (DU) baseband acceleration for sub-6 GHz 5G NR with 100 MHz bandwidth and 64-QAM modulation. IC Role / Device Role / Timing Role: Hardware accelerator for Layer 1 physical layer functions including FFT/iFFT, LDPC encoding/decoding, and resource mapping. Use Value: 7,240 DSP slices deliver >2.1 TOPS fixed-point throughput; PCIe Gen4 x16 enables low-latency fronthaul data transfer to host CPU. |
| Aerospace Avionics | High-Energy Physics DAQ |
Use Scenario: Radiation-tolerant flight control computer executing DO-254 Level A deterministic tasks with dual-redundant paths. IC Role / Device Role / Timing Role: Reconfigurable safety-critical controller with lockstep monitoring and error-correcting memory controllers. Use Value: Dual-boot configuration with AES-256/HMAC ensures authenticated firmware rollback upon detected corruption; ECC on all block RAM meets EDAC requirements. | Use Scenario: Front-end digitization and trigger preprocessing for particle detector readout at CERN's HL-LHC upgrade. IC Role / Device Role / Timing Role: Real-time zero-suppression engine synchronizing >10k channels via deterministic 25G optical links. Use Value: 25.78125 Gb/s transceivers handle 400 Gb/s aggregate sensor bandwidth; hardened 100G Ethernet MAC supports precise timestamp distribution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU13P-L2FSVA2104E | Same logic resources but 2104-ball FSV package; lower I/O count (588 vs 720); no thermal lid | Suitable for air-cooled, space-constrained embedded systems with reduced interconnect needs | Select when board area and cost are prioritized over thermal headroom and maximum I/O density |
| XCVU9P-L2FSGA2104E | Reduced scale: 983K logic cells, 5,440 DSP slices, 67.8 Mb BRAM, same 2577-ball FSGA package | Targeted at mid-tier radar and comms systems requiring lower power and cost with partial feature retention | Choose for applications needing identical mechanical footprint but relaxed compute/memory bandwidth |
Compared with XCVU13P-L2FSGA2577E, the XCVU13P-L2FSVA2104E trades I/O and thermal performance for compactness, while the XCVU9P-L2FSGA2104E retains the same package but scales down logic, DSP, and memory-enabling drop-in mechanical replacement with functional de-rating.
Availability
XCVU13P-L2FSGA2577E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband acceleration, and aerospace avionics requiring stable component supply across extended product lifecycles.
Supply support for XCVU13P-L2FSGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data center, AI, embedded, and client markets with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.
The Virtex UltraScale+ family delivers high-performance, radiation-tolerant, and secure reconfigurable platforms for mission-critical infrastructure in defense, communications, and scientific instrumentation.
FAQ
What is the maximum transceiver line rate supported by the XCVU13P-L2FSGA2577E?
The XCVU13P-L2FSGA2577E supports a maximum transceiver line rate of 25.78125 Gb/s per lane. This enables compliance with JESD204C and 100G Ethernet standards. All transceivers on the XCVU13P-L2FSGA2577E are multi-rate and can be configured down to 1.25 Gb/s. The 25.78125 Gb/s rate is validated under specified temperature and voltage conditions per AMD's UltraScale+ transceiver specifications.
Does the XCVU13P-L2FSGA2577E include hardened PCIe Gen4 IP?
Yes, the XCVU13P-L2FSGA2577E integrates hardened PCIe Gen4 x16 root port and endpoint blocks. These blocks operate at 16 GT/s per lane with full link training, ASPM, and AER support. The hardened IP reduces logic utilization and timing closure effort compared to soft-core implementations. This capability is natively supported in the XCVU13P-L2FSGA2577E without additional licensing or configuration overhead.
What I/O voltage standards does the XCVU13P-L2FSGA2577E support?
The XCVU13P-L2FSGA2577E supports LVCMOS (1.2 V, 1.35 V, 1.5 V, 1.8 V), SSTL (I and II), HSTL (I and III), and MIPI D-PHY standards across its 720 user I/O pins. Each I/O bank is independently powered, allowing mixed-voltage operation. This flexibility enables direct interfacing with DDR4 memory, image sensors, ADCs, and legacy parallel buses without level-shifting components.
Is the XCVU13P-L2FSGA2577E suitable for radiation-hardened applications?
The XCVU13P-L2FSGA2577E is not radiation-hardened but is radiation-tolerant and widely deployed in aerospace avionics with mitigation strategies. It features SEU-hardened configuration memory, ECC on block RAM, and lockstep monitoring capabilities. System-level radiation hardening requires external shielding, TMR implementation, and watchdog supervision - all supported by the XCVU13P-L2FSGA2577E's architectural features.
What configuration security features are implemented in the XCVU13P-L2FSGA2577E?
The XCVU13P-L2FSGA2577E implements AES-256 bitstream encryption and HMAC-SHA256 authentication for secure configuration. Bitstream decryption occurs on-chip using dedicated hardware engines, and HMAC verification ensures integrity before configuration. Keys are stored in battery-backed SRAM or eFUSE, and dual-boot with fallback prevents bricking during field updates. These features are active and verified for the XCVU13P-L2FSGA2577E in production configurations.
XCVU13P-L2FSGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale+™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 216000
- Number of Logic Elements/Cells:
- 3780000
- Total RAM Bits:
- 99090432
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.698V ~ 0.742V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU13P-L2FSGA2577E FAQ
1.How can I place an order for XCVU13P-L2FSGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU13P-L2FSGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU13P-L2FSGA2577E reliable?
The price and inventory of XCVU13P-L2FSGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU13P-L2FSGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU13P-L2FSGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU13P-L2FSGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU13P-L2FSGA2577E?
XCVU13P-L2FSGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU13P-L2FSGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU13P-L2FSGA2577E?
For technical support, including XCVU13P-L2FSGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU13P-L2FSGA2577E requirements.
6.How does Aetrix verify that XCVU13P-L2FSGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU13P-L2FSGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU13P-L2FSGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU13P-L2FSGA2577E?
All XCVU13P-L2FSGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU13P-L2FSGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU13P-L2FSGA2577E part is unused and in its original packaging.
Return procedure for XCVU13P-L2FSGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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