AMD XCVU160-2FLGB2104E

Overview

XCVU160-2FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,628K logic cells, 7,520 DSP slices, and 96.4 Mb of block RAM. It integrates hardened 25.8 Gb/s GTY transceivers and supports PCIe Gen4 x16, making it suitable for AI acceleration, 5G baseband processing, and high-end radar signal conditioning.

For engineers reviewing the XCVU160-2FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count and speed grade (-2), I/O bank voltage support (1.8 V/1.2 V), and package thermal performance in FLGB2104.

Technical Context

The XCVU160-2FLGB2104E implements a heterogeneous architecture with programmable logic fabric, UltraScale+ memory controllers (DDR4/LPDDR4), and integrated RFSoC analog-to-digital converters in select variants - though this specific part lacks RF-ADC blocks. Its -2 speed grade guarantees timing closure at 25.8 Gb/s on GTY transceivers with ≤100 ps jitter tolerance.

Configuration occurs via quad-SPI or JTAG, with bitstream encryption using AES-256 and HMAC authentication. The device supports partial reconfiguration and dynamic function exchange, enabling runtime hardware adaptation in mission-critical infrastructure.

Key Specifications

Pinout & Package

FLGB2104 is a 2104-ball flip-chip BGA package with 0.8 mm ball pitch, designed for high thermal conductivity and signal integrity in high-density PCB layouts. Ball map includes dedicated configuration, clock, power, and I/O banks distributed across four quadrants.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU190-2FLGB2104E and XCVU13P-2FLGB2104E, the XCVU160-2FLGB2104E delivers optimal balance of DSP density, logic capacity, and thermal envelope for fixed-function acceleration in space-constrained 5G and defense platforms.

Availability

XCVU160-2FLGB2104E is available at Aetrix Electronics and suitable for AI inference accelerators, 5G massive MIMO baseband units, and phased array radar signal processors requiring stable component supply across extended product lifecycles.

Supply support for XCVU160-2FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company designing adaptive computing platforms for data center, AI, embedded, and aerospace applications.

The Virtex UltraScale+ family targets high-throughput, low-latency signal and packet processing in infrastructure-grade systems demanding hardened interfaces and long-term reliability.

FAQ

What is the maximum supported data rate for GTY transceivers on the XCVU160-2FLGB2104E?

The XCVU160-2FLGB2104E supports GTY transceivers rated up to 25.8 Gb/s per lane, validated under -2 speed grade conditions. This enables compliance with 100G Ethernet (4×25G), CPRI Option 10, and PCIe Gen4 x16. Actual achievable rate depends on PCB layout quality, reference clock jitter (<300 fs RMS), and signal integrity margin.

Does the XCVU160-2FLGB2104E include integrated RF analog-to-digital converters?

No, the XCVU160-2FLGB2104E does not include RF-ADC blocks. That capability is exclusive to the Virtex UltraScale+ RFSoC variants (e.g., XQRU200). The XCVU160-2FLGB2104E is a pure digital FPGA with hardened transceivers and memory controllers but no on-die RF sampling circuitry.

What configuration modes are supported by the XCVU160-2FLGB2104E?

The XCVU160-2FLGB2104E supports master SPI (x1/x2/x4), slave parallel (BPI), JTAG, and fallback configuration modes. Mode selection is controlled by M0–M2 pins at power-on reset. Configuration bitstreams can be encrypted using AES-256 and authenticated via HMAC to prevent unauthorized programming.

What is the thermal design power (TDP) range for the XCVU160-2FLGB2104E in typical operation?

The XCVU160-2FLGB2104E has a typical TDP range of 45–75 W depending on utilization, transceiver count active, and I/O switching activity. The FLGB2104 package supports thermal dissipation up to 75 W with appropriate heatsink and airflow. Junction temperature must remain below 100°C for reliable operation per AMD DS924.

Is partial reconfiguration supported on the XCVU160-2FLGB2104E, and what tools enable it?

Yes, partial reconfiguration is fully supported on the XCVU160-2FLGB2104E using Vivado Design Suite 2023.2+. It allows dynamic swapping of predefined logic partitions while maintaining system state and I/O functionality. Implementation requires strict floorplanning, checkpoint-based synthesis, and secure bitstream signing for field updates.