AMD XCVU160-2FLGB2104I

Overview

XCVU160-2FLGB2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,225 DSP slices, and 84.2 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing systems.

For engineers reviewing the XCVU160-2FLGB2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, embedded memory capacity, and thermal performance under sustained compute loads.

Technical Context

The XCVU160-2FLGB2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC), and ultra-low-latency AXI interconnect. It integrates 25.6 GT/s GTY transceivers and supports deterministic timing closure via clocking resources including MMCMs and PLLs.

Its configuration relies on dual-boot capability with BPI and QSPI flash, and it supports partial reconfiguration for dynamic function swapping. Power management includes per-slice voltage scaling and real-time thermal monitoring via on-die sensors.

Key Specifications

Pinout & Package

This device is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 1.0 mm pitch, designed for high-density PCB routing and thermal dissipation in conduction-cooled modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-end FPGA applications.

Compared with XCVU160-2FLGB2104I, the XCVU190 offers headroom for future algorithm expansion but increases static power by ~22%; the XCVU9P reduces logic utilization by 50% while maintaining identical board layout and cooling design.

Availability

XCVU160-2FLGB2104I is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and avionics data concentrators requiring stable component supply across long production lifecycles.

Supply support for XCVU160-2FLGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded, and aerospace markets.

The Virtex UltraScale+ family targets high-bandwidth, low-latency, and safety-critical applications including defense radar, 5G infrastructure, and autonomous vehicle perception systems.

FAQ

What is the maximum supported transceiver line rate for XCVU160-2FLGB2104I?

The XCVU160-2FLGB2104I supports GTY transceivers rated up to 25.6 Gb/s. This line rate is validated for protocols including 100G Ethernet (4×25G), CPRI, and proprietary high-speed serial links. Operation at this rate requires proper PCB stackup, controlled impedance routing, and AC-coupled differential signaling per UG578 guidelines. The XCVU160-2FLGB2104I achieves this performance without retiming or gearbox overhead.

Does XCVU160-2FLGB2104I support partial reconfiguration?

Yes, XCVU160-2FLGB2104I fully supports partial reconfiguration through Vivado Design Suite v2022.2+. This capability allows dynamic logic module swapping during runtime without resetting the entire device. Use cases include adaptive radar waveform changes and protocol stack updates in communication systems. The XCVU160-2FLGB2104I implements this using frame-based configuration access and secure bitstream encryption.

What is the core voltage requirement for XCVU160-2FLGB2104I?

XCVU160-2FLGB2104I requires a nominal VCCINT supply of 0.85 V with ±3% tolerance. This voltage powers the FPGA fabric, CLBs, and routing resources. Tight regulation is mandatory: ripple must remain below 15 mV peak-to-peak under all operating conditions. The XCVU160-2FLGB2104I includes dedicated power-good monitoring and brown-out detection on this rail.

Which memory interfaces does XCVU160-2FLGB2104I natively support?

XCVU160-2FLGB2104I includes hardened DDR4, LPDDR4, and RLDRAM3 PHYs supporting data rates up to 2400 MT/s. It also supports QDR-IV SRAM via programmable logic with soft controllers. These interfaces are implemented in dedicated I/O banks with calibrated output drivers and input deskew. The XCVU160-2FLGB2104I achieves sub-100 ps timing margin across temperature and voltage corners.

Is XCVU160-2FLGB2104I qualified for aerospace applications?

XCVU160-2FLGB2104I is available in an industrial temperature grade (–40°C to +100°C) and meets JESD22-A108 reliability testing. While not radiation-hardened, it is widely deployed in non-spaceborne aerospace platforms including airborne radar and UAV flight controllers. The XCVU160-2FLGB2104I supports DO-254 compliance workflows and includes built-in test features for structural coverage analysis.