My Inquiry
My Account
AMD XCVU160-2FLGC2104E
- Part No.:
- XCVU160-2FLGC2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU160-2FLGC2104E.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,713
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCVU160-2FLGC2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,520 DSP slices, and 84.2 Mb of block RAM; supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces; deployed in 5G radio units and AI inference acceleration platforms.
For engineers reviewing the XCVU160-2FLGC2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (25.78125 Gbps), I/O bank voltage support (1.8 V/1.2 V), thermal design power (TDP) at 2FLGC2104 package, and configuration interface (JTAG + Quad-SPI).
Technical Context
The XCVU160-2FLGC2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ADCs for system monitoring. It uses 16nm FinFET process technology and supports partial reconfiguration.
Configuration is performed via Master SPI or JTAG; bitstream encryption and HMAC authentication are supported for secure boot. The device includes 24 GTY transceivers operating up to 25.78125 Gbps with PMA/PMD layers compliant with IEEE 802.3bj and CEI-28G-VSR standards.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| DSP Slices | 7,520 - enables high-throughput fixed/floating-point math for AI/FFT/radar processing |
| Block RAM | 84.2 Mb - supports large on-chip data buffering and lookup table storage without external memory |
| GTY Transceivers | 24 × 25.78125 Gbps - provides native 25G Ethernet, CPRI/eCPRI, and serial RapidIO connectivity |
| I/O Pins | 992 - delivers high-density interface routing across 24 selectable I/O banks with flexible voltage support |
| TDP | 49 W (typical) - defines thermal envelope requiring active heatsink and airflow management |
| Configuration Interface | JTAG + Quad-SPI - enables secure, field-upgradable bitstream loading with AES-256 encryption |
Pinout & Package
The XCVU160-2FLGC2104E is housed in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) package with 35 mm × 35 mm body size, 0.8 mm ball pitch, and thermal lid for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MIO[0:15] | Multiplexed I/O Bank 0 | Configurable as SDIO, UART, SPI, I2C, or GPIO; supports 1.8 V operation |
| HP[0:63] | High-Performance I/O Bank | Supports DDR4, LPDDR4, and 25G transceiver reference clocks; 1.2 V / 1.35 V compatible |
| GTYTXN/GTYTXP | Differential Transmitter Pair | Drives 25.78125 Gbps serial lanes; requires AC-coupling and controlled impedance PCB routing |
| GTYRXN/GTYRXP | Differential Receiver Pair | Receives 25.78125 Gbps serial data; integrates CDR and equalization for signal integrity |
| CONFIG_MODE | Configuration Mode Select | Defines boot source (SPI/JTAG/BPI); asserted during power-on reset sequence |
| INIT_B | Configuration Status | Open-drain output indicating bitstream load readiness; pulled high externally |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces latency and resource usage vs. soft IP; supports SR-IOV and ATS for virtualized workloads |
| UltraScale+ Memory Controller | Manages DDR4-2400 and LPDDR4-4266 with ECC; eliminates need for external memory controller ASIC |
| Secure Boot with AES-256 | Prevents unauthorized bitstream execution; integrates HMAC SHA-256 authentication key storage |
| Partial Reconfiguration Support | Enables dynamic function swapping without full device reset; critical for multi-mode radar and comms systems |
| Integrated System Monitor ADC | Measures on-die temperature, supply voltages (VCCINT/VCCAUX/VCCO), and current draw in real time |
Applications
| 5G Massive MIMO Radio Unit | AI Acceleration Server Card |
|---|---|
Use Scenario: Real-time beamforming and precoding for 64T64R antenna arrays in sub-6 GHz and mmWave base stations. IC Role / Device Role / Timing Role: Primary programmable baseband processor handling Layer 1 PHY processing and digital front-end functions. Use Value: 24 GTY transceivers enable direct fronthaul interface to RU RFICs; 7,520 DSP slices accelerate matrix multiplication for adaptive algorithms. | Use Scenario: Hardware-accelerated inference for vision transformers and LLM token generation in edge data centers. IC Role / Device Role / Timing Role: Co-processor offloading tensor operations from CPU/GPU; synchronized via PCIe Gen4 x16 host interface. Use Value: 1,122K logic cells implement custom systolic arrays; 84.2 Mb block RAM buffers model weights and activation tensors on-chip. |
| Radar Signal Processor | High-Speed Test Equipment |
Use Scenario: FMCW radar processing for automotive ADAS and industrial level sensing with microsecond latency requirements. IC Role / Device Role / Timing Role: Real-time FFT, CFAR detection, and angle estimation engine with deterministic timing behavior. Use Value: Partial reconfiguration allows mode switching between short/long-range profiles; integrated ADC monitors supply stability during burst operation. | Use Scenario: Protocol-aware BERT and jitter tolerance testing for 25G/100G Ethernet and CPRI links. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector with precise clock domain crossing control. Use Value: GTY transceivers operate in PRBS31 loopback mode with <1 ps RMS jitter; HP I/O banks drive differential test fixtures at 1.2 V. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGC2104E | 1,452K logic cells, 9,020 DSP slices, higher TDP (58 W) | Targeted at larger-scale AI training and 400G crypto-acceleration where extra resources justify thermal overhead | Select when >20% additional logic/DSP is required and cooling infrastructure supports higher TDP |
| XCVU9P-2FLGA2104E | 562K logic cells, 3,520 DSP slices, lower transceiver count (16 GTY) | Suitable for cost-sensitive 5G small cells and embedded vision where full XCVU160 capability is unused | Choose for reduced BOM cost and simpler thermal design when application fits within half the resources |
Compared with XCVU160-2FLGC2104E, the XCVU190 offers headroom for scaling compute-intensive workloads but demands stricter thermal management, while the XCVU9P reduces footprint and power at the expense of transceiver bandwidth and on-chip memory capacity-making it viable only for subset applications.
Availability
XCVU160-2FLGC2104E is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator cards, and high-speed test equipment requiring stable component supply across multi-year production cycles.
Supply support for XCVU160-2FLGC2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and client markets with focus on performance-per-watt efficiency.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and security-critical applications including wireless infrastructure, aerospace avionics, and hardware-accelerated AI inference.
FAQ
What is the maximum supported data rate for GTY transceivers on the XCVU160-2FLGC2104E?
The XCVU160-2FLGC2104E supports GTY transceivers operating up to 25.78125 Gbps per lane, compliant with IEEE 802.3bj (100GBASE-KR4) and OIF CEI-28G-VSR specifications. This rate enables native 25G Ethernet, eCPRI, and serial RapidIO implementations without gearbox logic. The XCVU160-2FLGC2104E transceiver PMA includes continuous-time linear equalization (CTLE) and decision feedback equalization (DFE) for robust signal recovery.
Does the XCVU160-2FLGC2104E support partial reconfiguration?
Yes, the XCVU160-2FLGC2104E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic module swapping without resetting the entire device. This capability is used in radar and communications systems to switch between waveform modes or protocol stacks. The XCVU160-2FLGC2104E includes dedicated ICAP and FRAME_ECC interfaces to manage reconfigurable partitions securely and reliably.
What configuration modes are supported by the XCVU160-2FLGC2104E?
The XCVU160-2FLGC2104E supports Master SPI, JTAG, and BPI configuration modes, selected via CONFIG_MODE pins at power-on. Quad-SPI mode enables fast, encrypted bitstream loading with AES-256 decryption. The XCVU160-2FLGC2104E also supports fallback configuration and multi-bitstream selection using external GPIOs for field-upgrade flexibility.
What I/O standards are supported in the HP banks of the XCVU160-2FLGC2104E?
The HP I/O banks of the XCVU160-2FLGC2104E support DDR4, LPDDR4, and MIPI D-PHY signaling with programmable output drive strength and input termination. They operate at 1.2 V and 1.35 V, enabling direct interface to high-speed memory and image sensors. The XCVU160-2FLGC2104E HP banks include dedicated write-leveling and gate-training circuitry for DDR4/DDR5 memory calibration.
Is the XCVU160-2FLGC2104E qualified for automotive applications?
No, the XCVU160-2FLGC2104E is not AEC-Q100 qualified and is intended for industrial, communications, and data center use. It operates over 0°C to 100°C junction temperature and meets RoHS and REACH compliance. For automotive-grade deployment, AMD offers the XCVU13P-2FLGA2104I variant with extended temperature range and qualification documentation. The XCVU160-2FLGC2104E lacks automotive-specific failure-in-time (FIT) reporting and stress-test validation.
XCVU160-2FLGC2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 115800
- Number of Logic Elements/Cells:
- 2026500
- Total RAM Bits:
- 130969600
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU160-2FLGC2104E FAQ
1.How can I place an order for XCVU160-2FLGC2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU160-2FLGC2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU160-2FLGC2104E reliable?
The price and inventory of XCVU160-2FLGC2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU160-2FLGC2104E is usually 5 days.
3.What payment methods are accepted for XCVU160-2FLGC2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU160-2FLGC2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU160-2FLGC2104E?
XCVU160-2FLGC2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU160-2FLGC2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU160-2FLGC2104E?
For technical support, including XCVU160-2FLGC2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU160-2FLGC2104E requirements.
6.How does Aetrix verify that XCVU160-2FLGC2104E is sourced from the original manufacturer or authorized distributors?
All XCVU160-2FLGC2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU160-2FLGC2104E meets industry standards.
7.What is the process for return or replacement of XCVU160-2FLGC2104E?
All XCVU160-2FLGC2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU160-2FLGC2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU160-2FLGC2104E part is unused and in its original packaging.
Return procedure for XCVU160-2FLGC2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU160-2FLGC2104E Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
