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AMD XCVU160-2FLGC2104I
- Part No.:
- XCVU160-2FLGC2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU160-2FLGC2104I.pdf
- Description:
- IC FPGA 416 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,558
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Product details
Overview
XCVU160-2FLGC2104I from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,122K logic cells, 7,225 DSP slices, and 84.2 Mb of block RAM. It supports PCIe Gen4 x16, 28.3 Gb/s transceivers, and DDR4 memory interfaces up to 2400 MT/s. Used in high-end radar signal processing and 5G massive MIMO baseband units.
For engineers reviewing the XCVU160-2FLGC2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic capacity, embedded memory depth, and thermal envelope for air-cooled 5G infrastructure deployments.
Technical Context
The XCVU160-2FLGC2104I implements a heterogeneous architecture with programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and multi-rate transceivers supporting protocols from 600 Mb/s to 28.3 Gb/s. It integrates dual ARM Cortex-A53 processors for real-time control and system management.
Configurable I/O banks support SSTL, HSTL, LVCMOS, and differential standards including MIPI D-PHY and LPDDR4. The device uses 16nm FinFET process technology and operates across industrial temperature range (–40°C to +100°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,122,000 - determines maximum combinational/sequential logic density for complex algorithm acceleration |
| DSP Slices | 7,225 - enables parallel fixed/floating-point computation for beamforming and channel estimation |
| Block RAM | 84.2 Mb - provides on-die memory for frame buffering and coefficient storage without external DRAM |
| Transceiver Max Rate | 28.3 Gb/s - supports 100G/200G Ethernet and CPRI/eCPRI fronthaul interfaces |
| PCIe Interface | Gen4 x16 - delivers 32 GB/s bidirectional bandwidth for host-FPGA data streaming |
| Memory Support | DDR4-2400 - enables high-throughput data movement between FPGA fabric and external memory |
| Operating Temp | –40°C to +100°C - qualified for deployment in outdoor 5G base stations and avionics systems |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder spheres optimized for industrial thermal cycling reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Supplies 0.85 V ±3% to FPGA fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power rail | Provides 1.8 V to configuration logic, PCIe block, and transceiver reference circuits |
| MGTAVCC | Transceiver analog supply | Delivers 0.95 V ±2% to high-speed serial PHY; sensitive to ripple and noise |
| CONFIG_M[2:0] | Configuration mode select | Determines boot source (JTAG, BPI, QSPI, SD card) during power-up initialization |
| CLK_IN_0 | Primary clock input | Accepts single-ended or differential reference clock for MMCM/PLL locking and system timing |
| PCIE_RX[15:0] | PCIe Gen4 receiver lanes | 16 dedicated differential pairs for PCIe root complex or endpoint operation at 16 GT/s |
Key Features
| Feature | Design Value |
|---|---|
| Heterogeneous compute architecture | Combines programmable logic, hardened 100G Ethernet MAC, and dual Cortex-A53 for control-plane offload |
| UltraScale+ transceiver technology | 28.3 Gb/s PAM4-ready serial I/O with built-in PRBS generation and error detection |
| Integrated PCIe Gen4 controller | Reduces external interface complexity and latency for host-FPGA co-processing applications |
| System Monitor (XADC) | On-chip analog monitoring of voltage, temperature, and current for thermal and power integrity validation |
| Partial reconfiguration support | Enables dynamic function swapping in deployed systems without full bitstream reload |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and STAP for airborne AESA radar systems. IC Role / Device Role / Timing Role: Primary compute engine executing adaptive filtering, FFT, and CFAR algorithms with deterministic latency. Use Value: 7,225 DSP slices enable concurrent wideband channel processing; 28.3 Gb/s transceivers feed ADC/DAC data directly into fabric. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink beamforming for 64T64R active antenna systems. IC Role / Device Role / Timing Role: Real-time baseband processor handling OFDM modulation, MIMO matrix inversion, and precoding. Use Value: 1,122K logic cells accommodate multiple concurrent DPD engines; DDR4-2400 interface sustains >100 GB/s memory bandwidth. |
| High-Performance Computing Acceleration | Avionics Data Concentrator |
Use Scenario: FPGA-accelerated financial risk modeling and Monte Carlo simulation in low-latency trading platforms. IC Role / Device Role / Timing Role: Co-processor tightly coupled to x86 host via PCIe Gen4 x16 for burst data offload. Use Value: 32 GB/s PCIe bandwidth eliminates I/O bottleneck; partial reconfiguration allows runtime algorithm updates. | Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B protocol bridging in fly-by-wire flight control systems. IC Role / Device Role / Timing Role: Deterministic network switch and protocol converter with time-triggered scheduling. Use Value: –40°C to +100°C operating range meets DO-160E environmental requirements; hardened Ethernet MAC ensures packet integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGC2104I | 1,375K logic cells, 8,520 DSP slices, same package and pinout | Higher compute density required for 400G crypto acceleration or AI inference pipelines | Select when additional logic/DSP resources justify cost premium and thermal margin permits |
| XCVU9P-2FLGA2104I | 560K logic cells, 3,520 DSP slices, identical 2104-pin FCBGA footprint | Suitable for mid-tier 5G small cells or test equipment where full XCVU160 capacity is unused | Choose for cost-sensitive deployments with relaxed throughput or latency targets |
Compared with XCVU160-2FLGC2104I, the XCVU190 offers headroom for future feature expansion while the XCVU9P reduces BOM cost and power draw-both retain identical mechanical mounting and PCB layout, enabling scalable design reuse across product tiers.
Availability
XCVU160-2FLGC2104I is available at Aetrix Electronics and suitable for 5G infrastructure, aerospace radar, and high-performance computing applications requiring stable component supply and long-term lifecycle assurance.
Supply support for XCVU160-2FLGC2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company delivering adaptive computing solutions for data centers, AI, embedded systems, and client devices through FPGA, adaptive SoC, and GPU technologies.
The Virtex UltraScale+ family targets high-bandwidth, low-latency, and thermally constrained applications such as 5G wireless infrastructure, military radar, and cloud acceleration-designed for deterministic real-time processing with hardened connectivity.
FAQ
What is the maximum supported transceiver data rate for XCVU160-2FLGC2104I?
The XCVU160-2FLGC2104I supports transceiver line rates up to 28.3 Gb/s per lane using its UltraScale+ GTY transceivers. This enables compliance with 100G/200G Ethernet, CPRI, and proprietary high-speed serial protocols. The XCVU160-2FLGC2104I transceiver architecture includes built-in equalization, clock data recovery, and PRBS pattern generation for link validation.
Does XCVU160-2FLGC2104I include a hard processor system?
Yes, the XCVU160-2FLGC2104I integrates a dual-core ARM Cortex-A53 processor subsystem with 32 KB L1 cache per core and 1 MB shared L2 cache. This hard processor system runs Linux or real-time OS and manages configuration, PCIe enumeration, and system monitoring-separate from the programmable logic fabric. The XCVU160-2FLGC2104I supports AXI interconnect for seamless logic-to-processor communication.
What memory interfaces does XCVU160-2FLGC2104I support?
The XCVU160-2FLGC2104I supports DDR4-2400, LPDDR4-4266, and RLDRAM3-2133 memory interfaces via dedicated memory controller IP. It includes 16 memory interface ports with configurable widths up to 72 bits per port. The XCVU160-2FLGC2104I memory controllers implement calibration, refresh, and error correction to meet industrial reliability requirements.
Is XCVU160-2FLGC2104I qualified for automotive applications?
No, the XCVU160-2FLGC2104I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It is intended for 5G base stations, radar, and HPC-not automotive ECUs. For automotive-grade FPGAs, AMD offers the Zynq UltraScale+ MPSoC family with AEC-Q100 Grade 2 qualification. The XCVU160-2FLGC2104I remains suitable for avionics and industrial environments meeting DO-160 or IEC 61000-6-2.
What configuration modes are supported by XCVU160-2FLGC2104I?
The XCVU160-2FLGC2104I supports JTAG, Quad-SPI, BPI, and SD card configuration modes. Mode selection is controlled by CONFIG_M[2:0] pins at power-up. Bitstream encryption and HMAC authentication are supported for secure boot. The XCVU160-2FLGC2104I also enables fallback configuration and multi-boot for field-upgradable designs.
XCVU160-2FLGC2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 115800
- Number of Logic Elements/Cells:
- 2026500
- Total RAM Bits:
- 130969600
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU160-2FLGC2104I FAQ
1.How can I place an order for XCVU160-2FLGC2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU160-2FLGC2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU160-2FLGC2104I reliable?
The price and inventory of XCVU160-2FLGC2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU160-2FLGC2104I is usually 5 days.
3.What payment methods are accepted for XCVU160-2FLGC2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU160-2FLGC2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU160-2FLGC2104I?
XCVU160-2FLGC2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU160-2FLGC2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU160-2FLGC2104I?
For technical support, including XCVU160-2FLGC2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU160-2FLGC2104I requirements.
6.How does Aetrix verify that XCVU160-2FLGC2104I is sourced from the original manufacturer or authorized distributors?
All XCVU160-2FLGC2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU160-2FLGC2104I meets industry standards.
7.What is the process for return or replacement of XCVU160-2FLGC2104I?
All XCVU160-2FLGC2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU160-2FLGC2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU160-2FLGC2104I part is unused and in its original packaging.
Return procedure for XCVU160-2FLGC2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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