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AMD XCVU160-3FLGB2104E
- Part No.:
- XCVU160-3FLGB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU160-3FLGB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,169
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Product details
Overview
XCVU160-3FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,125,720 logic cells, 8,520 DSP slices, and 96.4 Mb of block RAM. It supports PCIe Gen4 x16, 25G transceivers, and DDR4 memory interfaces, deployed in advanced radar signal processing and 5G massive MIMO baseband systems.
For engineers reviewing the XCVU160-3FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, thermal design power envelope, and configuration interface compatibility with JTAG and SelectMAP.
Technical Context
The XCVU160-3FLGB2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA), and ultra-low-latency memory controllers. It uses 16nm FinFET process technology and supports partial reconfiguration for dynamic function swapping.
Configuration occurs via dual-mode bitstream loading-master SPI or slave SelectMAP-with AES-256 bitstream encryption and HMAC authentication. The device includes dedicated clock management tiles with MMCM and PLL resources supporting jitter < 150 fs RMS over 12 kHz–20 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,125,720 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 8,520 - fixed-point and floating-point arithmetic units with 27×18-bit multipliers and 48-bit accumulators |
| Block RAM | 96.4 Mb - distributed as 3,600 BRAM blocks (36 Kb each), supporting true dual-port operation |
| Transceivers | 64 × 25.78125 Gb/s - compliant with IEEE 802.3bj, supporting PAM4 and NRZ modulation |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, TMDS - up to 1,152 user I/O pins across 32 banks |
| Configuration Interface | Master SPI x4 / Slave SelectMAP x32 - supports encrypted bitstream loading and fallback recovery |
| TDP | 55 W typical - measured at full transceiver and logic utilization under JEDEC JESD51-2 conditions |
Pinout & Package
This device is packaged in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 0.8 mm pitch, thermally enhanced with integrated heat spreader and solder sphere array optimized for high-speed signal integrity and thermal dissipation in dense PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| M0–M3 | Mode Configuration | Selects boot mode (JTAG, SPI, BPI, or SelectMAP) during power-up reset |
| CCLK | Configuration Clock | Input clock for master SPI configuration; frequency up to 100 MHz |
| DIN | Serial Data Input | Primary serial bitstream input for SPI configuration mode |
| INIT_B | Initialization Status | Open-drain output indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts load sequence |
| USERCCLK | User Clock Input | Optional clock source for internal logic, independent of configuration clocks |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 Hard IP | Integrated endpoint/root complex supporting x1/x2/x4/x8/x16 link widths with AXI4 streaming interface |
| UltraScale+ Memory Controller | Hardened DDR4/LPDDR4 controller with 256-bit bus width, 2,400 MT/s data rate, and ECC support |
| Partial Reconfiguration | Runtime logic partition swapping without system reset; verified with Vivado 2023.1 toolflow |
| Security Engine | AES-256 + HMAC-SHA256 bitstream encryption and authentication; secure key storage in eFUSE |
| Transceiver Calibration | Automatic per-lane analog calibration at power-up and runtime for PAM4/NRZ eye stability |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes adaptive filtering and FFT acceleration; transceivers interface with RF ADC/DACs at 4 GSPS. Use Value: 25G transceivers enable direct JESD204B/C interconnect to high-speed data converters, eliminating external serializer/deserializer chips. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G NR macro base stations. IC Role / Device Role / Timing Role: Configurable baseband processor handling OFDM symbol generation, MIMO matrix inversion, and layer mapping. Use Value: 8,520 DSP slices deliver >2.1 TMAC/s for real-time DPD coefficient computation with sub-100 ns latency. |
| High-Performance Computing Acceleration | Test & Measurement Equipment |
Use Scenario: Co-processing engine for financial risk modeling and genomic sequence alignment in data center servers. IC Role / Device Role / Timing Role: PCIe Gen4 x16 host interface connects to CPU; logic fabric accelerates custom algorithms via AXI4-MM/AXI4-Stream. Use Value: 1,125,720 logic cells support concurrent execution of multiple compute kernels with deterministic timing control. | Use Scenario: Real-time protocol analysis and waveform synthesis in high-bandwidth oscilloscopes and arbitrary waveform generators. IC Role / Device Role / Timing Role: Time-critical pattern generator and trigger analyzer using deterministic I/O timing and on-chip delay calibration. Use Value: Sub-10 ps I/O delay resolution enables precise edge placement for 50+ GS/s sampling systems. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-3FLGB2104E | 1,375,200 logic cells, 10,200 DSP slices, higher TDP (65 W) | Targeted for larger-scale compute clusters and AI inference pipelines requiring >20% more logic density | Select when additional logic capacity and DSP throughput justify increased power and cooling requirements |
| XCVU9P-2FLGB2104I | Faster speed grade (-2), industrial temperature range (–40°C to +100°C), reduced logic (562,800 cells) | Suitable for ruggedized avionics and defense electronics where extended temperature operation is mandatory | Choose for mission-critical environments where reliability under thermal stress outweighs raw performance |
Compared with XCVU160-3FLGB2104E, the XCVU190-3FLGB2104E offers greater compute density at higher power cost, while the XCVU9P-2FLGB2104I trades logic scale for guaranteed industrial-grade thermal resilience-enabling selection based on compute-per-watt versus environmental robustness trade-offs.
Availability
XCVU160-3FLGB2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and high-performance computing acceleration requiring stable component supply across long production lifecycles.
Supply support for XCVU160-3FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data centers, AI, embedded systems, and client platforms through its Xilinx product division.
The Virtex UltraScale+ family targets high-throughput, low-latency applications in aerospace, defense, wired/wireless infrastructure, and test equipment-designed for deterministic real-time processing with hardened connectivity IP.
FAQ
What is the maximum supported transceiver line rate for XCVU160-3FLGB2104E?
The XCVU160-3FLGB2104E supports transceiver line rates up to 25.78125 Gb/s per lane, compliant with IEEE 802.3bj and CEI-28G-VSR standards. This enables direct JESD204C interconnect to high-speed ADCs/DACs and 100G/200G Ethernet implementations. The XCVU160-3FLGB2104E transceiver architecture includes built-in gearbox and PRBS pattern generation for link validation.
Does XCVU160-3FLGB2104E support partial reconfiguration?
Yes, the XCVU160-3FLGB2104E fully supports partial reconfiguration through Vivado Design Suite 2023.1 and later. This allows dynamic swapping of logic modules without resetting the entire device. The XCVU160-3FLGB2104E implements frame-based reconfiguration with CRC-protected bitstream segments and hardware-assisted boundary checking.
What configuration modes are supported by XCVU160-3FLGB2104E?
The XCVU160-3FLGB2104E supports four primary configuration modes: Master SPI, Slave SelectMAP, JTAG, and BPI. Mode selection is controlled by M0–M3 pins at power-up. The XCVU160-3FLGB2104E also supports fallback configuration and dual-bitstream redundancy for mission-critical applications.
What is the block RAM capacity of XCVU160-3FLGB2104E?
The XCVU160-3FLGB2104E provides 96.4 Mb of total block RAM, implemented as 3,600 individual 36 Kb BRAM primitives. Each BRAM supports true dual-port operation with independent read/write clocks and optional parity bits. The XCVU160-3FLGB2104E BRAM architecture enables efficient FIFO, cache, and buffer implementations in high-speed data path designs.
Is XCVU160-3FLGB2104E compatible with PCIe Gen4 x16?
Yes, the XCVU160-3FLGB2104E integrates hardened PCIe Gen4 x16 root complex and endpoint IP blocks. It supports LTSSM compliance, ASPM power states, and AXI4 streaming interfaces. The XCVU160-3FLGB2104E PCIe subsystem achieves <100 ns transaction latency and full 16 GT/s link training with standard platform firmware.
XCVU160-3FLGB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 115800
- Number of Logic Elements/Cells:
- 2026500
- Total RAM Bits:
- 130969600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.970V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU160-3FLGB2104E FAQ
1.How can I place an order for XCVU160-3FLGB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU160-3FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU160-3FLGB2104E reliable?
The price and inventory of XCVU160-3FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU160-3FLGB2104E is usually 5 days.
3.What payment methods are accepted for XCVU160-3FLGB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU160-3FLGB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU160-3FLGB2104E?
XCVU160-3FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU160-3FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU160-3FLGB2104E?
For technical support, including XCVU160-3FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU160-3FLGB2104E requirements.
6.How does Aetrix verify that XCVU160-3FLGB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU160-3FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU160-3FLGB2104E meets industry standards.
7.What is the process for return or replacement of XCVU160-3FLGB2104E?
All XCVU160-3FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU160-3FLGB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU160-3FLGB2104E part is unused and in its original packaging.
Return procedure for XCVU160-3FLGB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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