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AMD XCVU160-H1FLGB2104E
- Part No.:
- XCVU160-H1FLGB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU160-H1FLGB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,757
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Product details
Overview
XCVU160-H1FLGB2104E from AMD is a high-performance Virtex UltraScale+ FPGA featuring 1,625K logic cells, 7,225 DSP slices, and 96.4 Mb of block RAM, deployed in high-end radar signal processing, 5G massive MIMO baseband units, and aerospace avionics systems.
For engineers reviewing the XCVU160-H1FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), GTY transceiver count (64), I/O voltage support (0.35–1.8 V), and thermal design power (125 W).
Technical Context
The XCVU160-H1FLGB2104E implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks including PCIe Gen4 x16, 100G Ethernet MAC, and DDR4/DDR5 memory controllers, and adaptive compute acceleration using UltraScale+ routing and clocking infrastructure.
It supports multi-die integration via AMD's 2.5D interposer technology, delivers deterministic latency for real-time control loops, and enables partial reconfiguration for dynamic function swapping in mission-critical embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,625,000 - total configurable LUTs + flip-flops for complex digital logic implementation |
| DSP Slices | 7,225 - fixed-point and floating-point arithmetic units supporting 27×18-bit multiply-accumulate |
| Block RAM | 96.4 Mb - distributed and block-based memory for on-chip data buffering and FIFOs |
| GTY Transceivers | 64 × 32.75 Gb/s - serial I/O supporting PAM4 and NRZ for 100G/400G optical interfaces |
| I/O Standards | Supports LVDS, MIPI D-PHY, SSTL, HSTL, and differential signaling up to 1.8 V |
| Thermal Design Power | 125 W - maximum steady-state power dissipation under worst-case operating conditions |
Pinout & Package
This device is packaged in a 2104-pin Flip-Chip Ball Grid Array (FCBGA) with 35 mm × 35 mm body size, 0.8 mm pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | 1.0 V ±3% dedicated power domain for FPGA fabric and CLBs |
| VCCAUX | Auxiliary supply rail | 1.8 V ±3% for configuration logic, SelectIO, and transceiver analog circuitry |
| VCCO | I/O bank supply | Configurable per-bank (0.35–1.8 V) enabling mixed-voltage interface support |
| MGTAVCC | GTY transceiver analog supply | 0.95 V ±2% low-noise rail for high-speed serial PHY operation |
| CLK_IN | Dedicated clock input | Single-ended or differential reference clock input for MMCM/PLL clock management |
| INIT_B | Configuration status | Open-drain output indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Integrated endpoint/root complex supporting 16 GT/s per lane without soft logic overhead |
| 100G Ethernet MAC | Hardened 100Gbps MAC with IEEE 802.3bj/bs compliance and integrated FEC |
| DDR5 Memory Controller | Up to 5600 MT/s interface with ECC, write leveling, and read DBI support |
| Partial Reconfiguration | Runtime logic partition swapping without system reset or full reconfiguration |
| UltraScale+ Routing | Deterministic timing closure across large designs with predictable interconnect delay |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming, pulse compression, and CFAR detection in AESA radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and matrix operations; GTY transceivers interface with ADC/DAC arrays at 6.4 GSPS. Use Value: 7,225 DSP slices enable simultaneous 1024-point FFTs across 32 channels with sub-microsecond latency. | Use Scenario: Digital pre-distortion (DPD), channel estimation, and layer mapping in 5G NR gNodeB units. IC Role / Device Role / Timing Role: Configurable logic implements adaptive DPD algorithms; PCIe Gen4 x16 connects to host CPU for real-time parameter updates. Use Value: 1,625K logic cells support concurrent execution of 64 DPD coefficient updates per millisecond. |
| Aerospace Avionics | High-Energy Physics DAQ |
Use Scenario: Sensor fusion, flight control law computation, and ARINC 429/664 interface bridging in fly-by-wire systems. IC Role / Device Role / Timing Role: Hardened PCIe and Ethernet IP ensure deterministic communication; partial reconfiguration allows in-flight firmware updates. Use Value: 96.4 Mb block RAM buffers sensor telemetry streams at 200 MB/s while maintaining DO-254 compliance. | Use Scenario: Trigger filtering, zero-suppression, and event building in particle detector readout systems. IC Role / Device Role / Timing Role: GTY transceivers receive 32× 16 Gb/s front-end links; logic fabric performs real-time pattern matching on hit data. Use Value: 64 GTY lanes deliver 524 Gb/s aggregate bandwidth to sustain 10 MHz trigger rates with <100 ns latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-H1FLGB2104E | 2,072K logic cells, 8,520 DSP slices, 112.5 Mb BRAM, same package and pinout | Higher compute density required for AI-accelerated radar imaging or 800G Ethernet aggregation | Select when >1.6M logic cells or >7.2K DSPs are needed; identical PCB layout and thermal profile |
| XCVU13P-H1FLGA2577E | 975K logic cells, 4,320 DSP slices, 64.8 Mb BRAM, 2577-pin FCBGA (larger footprint) | Lower-cost deployment in mid-tier 5G fronthaul or industrial vision systems | Choose for cost-sensitive designs where 30% lower logic capacity and 40% fewer DSPs are acceptable |
Compared with XCVU160-H1FLGB2104E, the XCVU190 offers higher compute headroom within identical mechanical constraints, while the XCVU13P reduces cost and complexity at the expense of DSP throughput and memory bandwidth-critical for real-time signal processing pipelines.
Availability
XCVU160-H1FLGB2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and aerospace avionics requiring stable component supply across long production cycles.
Supply support for XCVU160-H1FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, communications, and embedded markets.
The Virtex UltraScale+ family targets mission-critical infrastructure applications demanding deterministic latency, high-bandwidth I/O, and field-upgradable logic-especially in defense, telecom, and scientific instrumentation.
FAQ
What is the maximum supported line rate for GTY transceivers on the XCVU160-H1FLGB2104E?
The XCVU160-H1FLGB2104E supports a maximum GTY transceiver line rate of 32.75 Gb/s using PAM4 modulation or 16.375 Gb/s with NRZ encoding. This capability enables direct interface with 100G/400G optical modules and high-speed ADC/DAC devices. The XCVU160-H1FLGB2104E achieves this performance across all 64 GTY channels under specified thermal and voltage conditions.
Does the XCVU160-H1FLGB2104E support DDR5 memory interfaces?
Yes, the XCVU160-H1FLGB2104E includes a hardened DDR5 memory controller supporting data rates up to 5600 MT/s with ECC, write leveling, and read DBI. It interfaces directly with standard DDR5 UDIMMs and RDIMMs. The XCVU160-H1FLGB2104E DDR5 controller is validated per JEDEC JESD209-5 specification and operates across industrial temperature ranges.
Is partial reconfiguration supported on the XCVU160-H1FLGB2104E?
Yes, the XCVU160-H1FLGB2104E fully supports partial reconfiguration through Vivado Design Suite, allowing dynamic swapping of logic partitions without resetting the entire device. This feature is used in radar and avionics systems for in-field algorithm updates. The XCVU160-H1FLGB2104E implements PR using frame-based bitstream loading with hardware-enforced isolation between static and reconfigurable regions.
What is the thermal design power (TDP) rating for the XCVU160-H1FLGB2104E?
The XCVU160-H1FLGB2104E has a thermal design power (TDP) rating of 125 W under worst-case operating conditions, defined per AMD's UltraScale+ power methodology. This value assumes full utilization of logic, DSP, and transceivers at maximum junction temperature. The XCVU160-H1FLGB2104E requires active cooling and a 6-layer PCB with thermal vias for reliable operation in continuous-duty applications.
Which PCIe generation and lane count does the XCVU160-H1FLGB2104E support?
The XCVU160-H1FLGB2104E integrates a hardened PCIe Gen4 x16 endpoint/root complex capable of 16 GT/s per lane, delivering 32 GB/s bidirectional bandwidth. It complies with PCI-SIG specifications and supports advanced features including ASPM, AER, and SR-IOV. The XCVU160-H1FLGB2104E PCIe hard IP operates independently of fabric resources, preserving logic utilization for application-specific functions.
XCVU160-H1FLGB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 115800
- Number of Logic Elements/Cells:
- 2026500
- Total RAM Bits:
- 130969600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 1.030V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU160-H1FLGB2104E FAQ
1.How can I place an order for XCVU160-H1FLGB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU160-H1FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU160-H1FLGB2104E reliable?
The price and inventory of XCVU160-H1FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU160-H1FLGB2104E is usually 5 days.
3.What payment methods are accepted for XCVU160-H1FLGB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU160-H1FLGB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU160-H1FLGB2104E?
XCVU160-H1FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU160-H1FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU160-H1FLGB2104E?
For technical support, including XCVU160-H1FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU160-H1FLGB2104E requirements.
6.How does Aetrix verify that XCVU160-H1FLGB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU160-H1FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU160-H1FLGB2104E meets industry standards.
7.What is the process for return or replacement of XCVU160-H1FLGB2104E?
All XCVU160-H1FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU160-H1FLGB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU160-H1FLGB2104E part is unused and in its original packaging.
Return procedure for XCVU160-H1FLGB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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