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AMD XCVU190-2FLGA2577E
- Part No.:
- XCVU190-2FLGA2577E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2577-BBGA, FCBGA
- Datasheet:
-
XCVU190-2FLGA2577E.pdf
- Description:
- IC FPGA 448 I/O 2577FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,021
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Product details
Overview
XCVU190-2FLGA2577E from AMD is a high-end Virtex UltraScale+ FPGA featuring 1,922,500 logic cells, 10,800 DSP slices, and 104.5 Mb of block RAM. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is deployed in high-throughput radar signal processing systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XCVU190-2FLGA2577E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O bank voltage support (1.8 V / 1.5 V / 1.35 V), thermal design power (TDP) under worst-case configuration, and configuration interface options (SPIx4, BPI, JTAG).
Technical Context
The XCVU190-2FLGA2577E implements a heterogeneous architecture with programmable logic fabric, hardened 32.75 Gb/s GTY transceivers, and integrated 100G Ethernet MAC blocks. It includes dual ARM Cortex-A53 processors for real-time control and system management functions.
Configuration is supported via Master SPI, Slave SelectMAP, or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256. The device uses 2577-pin Flip-Chip Ball Grid Array (FCBGA) packaging with 1.0 mm pitch and requires precise thermal management due to its 55 W typical TDP.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,922,500 - determines maximum combinational/sequential logic capacity for complex algorithm implementation |
| DSP Slices | 10,800 - enables parallel execution of high-precision arithmetic operations for FFT, filtering, and beamforming |
| Block RAM | 104.5 Mb - provides on-chip memory for buffering real-time data streams without external DRAM latency |
| Transceiver Line Rate | 32.75 Gb/s - supports single-lane 100G Ethernet and CPRI/eCPRI over optical interfaces |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL - enables direct interfacing with high-speed ADCs, DACs, and memory controllers |
| TDP (Typical) | 55 W - defines minimum heatsink thermal resistance and airflow requirements for stable operation |
| Speed Grade | -2 - guarantees timing closure at maximum operating frequency across industrial temperature range |
Pinout & Package
The XCVU190-2FLGA2577E is housed in a 2577-ball Flip-Chip BGA (FLGA) package with 1.0 mm ball pitch, designed for high-density PCB routing and thermal dissipation via exposed thermal lid.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires low-noise, high-current regulation |
| VCCAUX | Auxiliary supply rail | Provides 1.8 V to configuration logic, PCIe PHY, and clock management tiles |
| MGTAVCC | Transceiver analog supply | Delivers clean 0.92 V to GTY transceiver analog circuitry; sensitive to ripple |
| CONFIG_IO | Configuration I/O bank | Supports SPIx4, BPI, or JTAG boot modes; must be powered before configuration begins |
| HR_IO | High-range I/O bank | Operates at 1.8 V / 1.5 V / 1.35 V; supports source-synchronous interfaces up to 1.6 Gb/s |
| CLK_IN | Dedicated clock input | Accepts differential reference clocks (e.g., 100 MHz–750 MHz) for MMCM/PLL clock synthesis |
Key Features
| Feature | Design Value |
|---|---|
| Hardened 100G Ethernet MAC | Reduces RTL integration effort and verification time for high-speed network offload applications |
| AES-256 + HMAC-SHA-256 bitstream encryption | Enables secure field updates and prevents IP theft in deployed military/aerospace systems |
| Dual ARM Cortex-A53 processor subsystem | Allows embedded software control of FPGA configuration, monitoring, and real-time system orchestration |
| GTY transceivers with PAM4 support | Permits migration to next-generation optical interconnects without FPGA replacement |
| UltraScale+ architecture with ASIC-like performance | Delivers predictable timing closure and reduced iteration cycles in large-scale ASIC prototyping |
Applications
| Radar Signal Processing | 5G Massive MIMO Baseband |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: Primary compute engine performing fixed-point matrix operations and high-throughput data streaming between ADCs and RF front-end. Use Value: Achieves sub-microsecond latency for closed-loop tracking while sustaining 200+ Gb/s internal bandwidth via AXI-Stream interconnect. | Use Scenario: Digital pre-distortion (DPD) and uplink/downlink channel processing in 5G NR base stations with 64T64R antenna arrays. IC Role / Device Role / Timing Role: Real-time adaptive signal conditioning unit synchronized to 30.72 MHz or 122.88 MHz reference clocks. Use Value: Supports concurrent execution of 16 independent DPD engines using dedicated DSP slices, reducing RF PA distortion by >40 dBc. |
| ASIC Prototyping Platform | High-Performance Computing Accelerator |
Use Scenario: Functional validation and timing sign-off of 7 nm ASIC designs prior to tape-out. IC Role / Device Role / Timing Role: Emulation host implementing cycle-accurate RTL models with full visibility into internal signals and timing paths. Use Value: Enables gate-level simulation speeds up to 25 MHz with trace capture capability, accelerating verification by 3× versus software-only methods. | Use Scenario: Offloading compute-intensive kernels (e.g., lattice Boltzmann, Monte Carlo) in edge AI inference servers. IC Role / Device Role / Timing Role: Co-processor tightly coupled to x86 host via PCIe Gen4 x16, managing DMA transfers and kernel scheduling. Use Value: Delivers 12.8 TFLOPS peak INT8 throughput with deterministic 2.1 μs PCIe round-trip latency for low-jitter inference pipelines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGB2104E | 2104-ball FCBGA package; lower I/O count (624 vs. 832); same logic/DSP/BRAM resources | Better suited for space-constrained designs where board area is critical and I/O expansion is limited | Select when footprint reduction outweighs need for maximum I/O flexibility and thermal headroom |
| XCVU13P-2FLGA2577E | Lower logic density (1,024,000 LCs), fewer DSP slices (5,440), same package and speed grade | Targeted at cost-optimized 5G small cell and edge video analytics where full XCVU190 capacity is unnecessary | Choose when application workload fits within reduced resource budget and TDP target is ≤35 W |
Compared with XCVU190-2FLGA2577E, the XCVU190-2FLGB2104E trades I/O and thermal margin for compactness, while the XCVU13P-2FLGA2577E reduces logic and DSP capacity to meet lower computational demands-both retain identical speed grade and industrial temperature rating but differ in scalability and power envelope.
Availability
XCVU190-2FLGA2577E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband development, and ASIC prototyping requiring stable component supply across extended product lifecycles.
Supply support for XCVU190-2FLGA2577E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family delivers FPGA+SoC convergence for mission-critical systems demanding hardware adaptability, security, and deterministic real-time performance in harsh environments.
FAQ
What is the maximum transceiver line rate supported by the XCVU190-2FLGA2577E?
The XCVU190-2FLGA2577E supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers. This enables compliance with IEEE 802.3bs 100G Ethernet and CPRI Option 10 standards. The XCVU190-2FLGA2577E achieves this rate with built-in gearbox and PMA calibration, and requires proper PCB stack-up and controlled impedance routing per AMD UG578 guidelines.
Does the XCVU190-2FLGA2577E include embedded processors?
Yes, the XCVU190-2FLGA2577E integrates a dual-core ARM Cortex-A53 processor subsystem running at up to 1.5 GHz. This hard processor system (HPS) runs Linux or bare-metal firmware and manages FPGA configuration, peripheral control, and real-time system monitoring. The XCVU190-2FLGA2577E couples the HPS with programmable logic via AXI-GP/HP/ACP interfaces for tight hardware-software co-design.
What configuration modes does the XCVU190-2FLGA2577E support?
The XCVU190-2FLGA2577E supports Master SPI, Slave SelectMAP, and JTAG configuration modes. It also allows fallback to secondary configuration sources and supports dual-image bitstream switching. Configuration security features include AES-256 decryption and HMAC-SHA-256 authentication, both enforced during XCVU190-2FLGA2577E startup and reconfiguration sequences.
What is the thermal design power (TDP) of the XCVU190-2FLGA2577E under typical operating conditions?
The XCVU190-2FLGA2577E has a typical thermal design power (TDP) of 55 W under worst-case utilization scenarios defined in AMD UG1187. Actual power varies with logic utilization, I/O activity, and transceiver count in use. Thermal management for the XCVU190-2FLGA2577E requires a heatsink with ≤0.35 °C/W junction-to-ambient resistance and ≥200 LFM airflow for sustained operation at 100°C junction temperature.
Is the XCVU190-2FLGA2577E qualified for industrial temperature operation?
Yes, the XCVU190-2FLGA2577E is rated for industrial temperature operation from -40°C to +100°C ambient. Its -2 speed grade guarantees timing closure across this full range, and the FLGA2577 package includes thermal lid construction for reliable heat transfer. The XCVU190-2FLGA2577E meets JEDEC JESD22-A104 reliability testing standards for industrial-grade devices.
XCVU190-2FLGA2577E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2577-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 134280
- Number of Logic Elements/Cells:
- 2349900
- Total RAM Bits:
- 150937600
- Number of I/O:
- 448
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2577-FCBGA (52.5x52.5)
XCVU190-2FLGA2577E FAQ
1.How can I place an order for XCVU190-2FLGA2577E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU190-2FLGA2577E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU190-2FLGA2577E reliable?
The price and inventory of XCVU190-2FLGA2577E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU190-2FLGA2577E is usually 5 days.
3.What payment methods are accepted for XCVU190-2FLGA2577E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU190-2FLGA2577E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU190-2FLGA2577E?
XCVU190-2FLGA2577E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU190-2FLGA2577E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU190-2FLGA2577E?
For technical support, including XCVU190-2FLGA2577E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU190-2FLGA2577E requirements.
6.How does Aetrix verify that XCVU190-2FLGA2577E is sourced from the original manufacturer or authorized distributors?
All XCVU190-2FLGA2577E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU190-2FLGA2577E meets industry standards.
7.What is the process for return or replacement of XCVU190-2FLGA2577E?
All XCVU190-2FLGA2577E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU190-2FLGA2577E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU190-2FLGA2577E part is unused and in its original packaging.
Return procedure for XCVU190-2FLGA2577E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCVU190-2FLGA2577E Tags
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