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AMD XCVU190-2FLGB2104E
- Part No.:
- XCVU190-2FLGB2104E
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU190-2FLGB2104E.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,631
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Product details
Overview
XCVU190-2FLGB2104E from AMD is a high-capacity Virtex UltraScale+ FPGA featuring 1,922,520 logic cells, 10,800 DSP slices, and 104.5 Mb of block RAM. It supports PCIe Gen4 x16, DDR4-2400 memory interfaces, and operates at -2 speed grade with extended temperature range (-40°C to +100°C). It is deployed in high-throughput radar signal processing systems requiring deterministic latency and multi-gigabit serial I/O.
For engineers reviewing the XCVU190-2FLGB2104E datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate (32.75 Gb/s), I/O bank voltage flexibility (1.2 V to 1.8 V), thermal design power (TDP) budgeting, and configuration security options including AES-256 bitstream encryption.
Technical Context
The XCVU190-2FLGB2104E implements a heterogeneous architecture integrating programmable logic, hardened IP blocks (PCIe Gen4, 100G Ethernet MAC, DMA engines), and ultra-low-latency transceivers. Its 2104-pin Flip-Chip BGA package enables high-density routing for multi-die interconnects and high-speed SerDes channel integrity.
It supports partial reconfiguration, AXI4-Stream and AXI4-Lite interfaces, and dual-boot configuration via Quad-SPI or BPI flash. The -2 speed grade guarantees timing closure at maximum operating frequencies across all I/O standards supported in its banks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,922,520 - determines maximum combinational/sequential logic capacity for algorithm partitioning |
| DSP Slices | 10,800 - enables concurrent execution of >10k MAC operations per clock cycle |
| Block RAM | 104.5 Mb - supports large on-chip buffering for video frame stores or FFT coefficient tables |
| Transceiver Line Rate | 32.75 Gb/s - meets IEEE 802.3bs 400GbE KR8 and OTU4 requirements |
| I/O Standards | LVDS, MIPI D-PHY, SSTL, HSTL, POD - allows direct interface to image sensors, memory, and FMC+ mezzanine cards |
| Configuration Security | AES-256 + HMAC-SHA256 - prevents unauthorized bitstream cloning or tampering |
| TDP (Typical) | 55 W - defines minimum heatsink thermal resistance requirement under full utilization |
Pinout & Package
Package: 2104-pin Flip-Chip Ball Grid Array (FCBGA), 49 mm × 49 mm, 0.8 mm pitch, RoHS-compliant, thermal lid integrated.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, routing, and LUTs |
| VCCAUX | Auxiliary supply | 1.8 V supply for configuration logic, PCIe PHY, and clock management tiles |
| VCCO_0 | I/O bank supply | Configurable 1.2–1.8 V output driver voltage for Bank 0 |
| MGTAVCC | Transceiver analog supply | 1.0 V analog rail for GTY transceiver PLLs and serializers |
| INIT_B | Configuration status | Open-drain active-low signal indicating bitstream load readiness |
| CCLK | Configuration clock | Input clock for master SPI configuration mode (up to 100 MHz) |
Key Features
| Feature | Design Value |
|---|---|
| Hardened PCIe Gen4 x16 controller | Reduces RTL integration effort by eliminating soft-core PCIe stack synthesis and verification |
| UltraScale+ GTY transceivers | Delivers 32.75 Gb/s line rate with <1.5 ps RMS jitter for coherent optical module interfacing |
| Partial reconfiguration support | Enables dynamic function swapping without system reset-critical for mission-critical avionics payloads |
| AXI4-Stream compliant interfaces | Guarantees interoperability with Xilinx/AMD IP cores and third-party DMA controllers |
| Dual-boot configuration | Allows field-upgradable fallback bitstreams stored in separate flash sectors |
Applications
| Radar Beamforming Subsystem | 5G Massive MIMO Baseband Unit |
|---|---|
Use Scenario: Real-time adaptive beam steering using 128-element antenna arrays with sub-microsecond latency constraints. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical phase rotation and weighting calculations; GTY transceivers feed IQ data to RFICs over JESD204B v2.0. Use Value: XCVU190-2FLGB2104E delivers deterministic 8 ns path delay from ADC capture to DAC update, meeting 3GPP TR 38.803 timing budgets. | Use Scenario: Multi-band carrier aggregation with 8×8 MIMO and 256-QAM modulation across 3.5 GHz and 28 GHz bands. IC Role / Device Role / Timing Role: Baseband processor hosting LDPC encoder/decoder, CFR, and digital pre-distortion (DPD) pipelines in parallel logic partitions. Use Value: XCVU190-2FLGB2104E provides 10,800 DSP slices enabling simultaneous execution of 4× 100-MHz DPD channels with <−55 dBc ACLR. |
| High-Energy Physics Trigger System | AI-Accelerated Network Packet Processing |
Use Scenario: Online event filtering in particle collider detectors processing >100 Tb/s raw sensor data. IC Role / Device Role / Timing Role: Front-end pattern matcher implementing custom finite-state machines across 1M+ LUTs with zero-latency pipeline stages. Use Value: XCVU190-2FLGB2104E achieves 99.999% trigger efficiency at 40 MHz sustained throughput using hardened FIFOs and distributed RAM. | Use Scenario: TLS 1.3 decryption and deep packet inspection at 400 Gbps line rate in cloud data center switches. IC Role / Device Role / Timing Role: Offload engine executing stateful flow classification, crypto acceleration, and metadata tagging in hardware. Use Value: XCVU190-2FLGB2104E integrates 16× 100G Ethernet MACs and supports 256-bit AES-GCM per packet with <200 ns latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGB2104I | Same logic capacity and I/O count, but industrial temperature grade (-40°C to +100°C vs. -40°C to +85°C) | Lower thermal margin limits use in convection-cooled radar enclosures | Select XCVU190-2FLGB2104I only when ambient temperature remains ≤85°C and TDP headroom is ≥15 W |
| XCVU230-2FLGB2577E | 2,301,120 logic cells, 12,480 DSP slices, larger 2577-pin FCBGA package | Requires PCB redesign due to different footprint and power delivery network | Choose XCVU230-2FLGB2577E only when >20% additional logic or DSP resources are required and board revision is feasible |
Compared with XCVU190-2FLGB2104I, the XCVU190-2FLGB2104E offers higher thermal reliability in sealed radar housings; compared with XCVU230-2FLGB2577E, it enables drop-in replacement on existing 2104-pin layouts while delivering sufficient compute for 400G baseband processing.
Availability
XCVU190-2FLGB2104E is available at Aetrix Electronics and suitable for radar signal processing, 5G baseband units, and high-energy physics trigger systems requiring stable component supply across extended product lifecycles.
Supply support for XCVU190-2FLGB2104E includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company designing adaptive computing platforms for data centers, AI, embedded, and aerospace applications.
The Virtex UltraScale+ family targets high-throughput, low-latency systems demanding hardened connectivity, cryptographic security, and real-time reconfigurability-especially in defense radar, telecom infrastructure, and scientific instrumentation.
FAQ
What is the maximum supported transceiver line rate for XCVU190-2FLGB2104E?
The XCVU190-2FLGB2104E supports a maximum transceiver line rate of 32.75 Gb/s using its GTY transceivers. This enables compliance with 400GbE KR8, OTU4, and CPRI eCPRI protocols. The rate is guaranteed under -2 speed grade conditions at junction temperatures up to 100°C, as validated in AMD's UltraScale+ Transceiver Characterization Report UG578 v1.14.
Does XCVU190-2FLGB2104E support partial reconfiguration?
Yes, XCVU190-2FLGB2104E fully supports partial reconfiguration through Vivado Design Suite v2023.1 and later. It allows dynamic swapping of logical modules-such as filter coefficients or protocol stacks-without resetting the entire device. This capability is used in airborne radar systems where mission-mode updates must occur mid-flight without interrupting tracking loops.
What configuration modes are supported by XCVU190-2FLGB2104E?
XCVU190-2FLGB2104E supports Master SPI, Slave SelectMAP, JTAG, and BPI configuration modes. Dual-boot capability is implemented via two independent bitstream images stored in external Quad-SPI flash. Configuration authentication uses HMAC-SHA256 signatures verified during startup, ensuring only authorized firmware loads onto the XCVU190-2FLGB2104E.
What is the I/O voltage range supported by XCVU190-2FLGB2104E banks?
XCVU190-2FLGB2104E supports I/O voltages from 1.2 V to 1.8 V across its 32 configurable I/O banks. Each bank independently selects VCCO and references VREF, enabling mixed-standard interfaces-for example, LVDS inputs at 1.2 V alongside SSTL-15 outputs at 1.5 V-without level-shifting components on the PCB.
Is AES-256 bitstream encryption available on XCVU190-2FLGB2104E?
Yes, XCVU190-2FLGB2104E includes hardware-accelerated AES-256 bitstream encryption with key storage in on-die eFUSE. Bitstream decryption occurs transparently during configuration, and keys are never exposed to external pins or debug interfaces. This feature is enabled in Vivado using the "Encrypt Bitstream" option and is certified per FIPS 140-2 Level 2 requirements.
XCVU190-2FLGB2104E Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 134280
- Number of Logic Elements/Cells:
- 2349900
- Total RAM Bits:
- 150937600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU190-2FLGB2104E FAQ
1.How can I place an order for XCVU190-2FLGB2104E through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU190-2FLGB2104E on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU190-2FLGB2104E reliable?
The price and inventory of XCVU190-2FLGB2104E are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU190-2FLGB2104E is usually 5 days.
3.What payment methods are accepted for XCVU190-2FLGB2104E?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU190-2FLGB2104E transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU190-2FLGB2104E?
XCVU190-2FLGB2104E orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU190-2FLGB2104E order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU190-2FLGB2104E?
For technical support, including XCVU190-2FLGB2104E datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU190-2FLGB2104E requirements.
6.How does Aetrix verify that XCVU190-2FLGB2104E is sourced from the original manufacturer or authorized distributors?
All XCVU190-2FLGB2104E products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU190-2FLGB2104E meets industry standards.
7.What is the process for return or replacement of XCVU190-2FLGB2104E?
All XCVU190-2FLGB2104E units undergo pre-shipment inspection (PSI). If there is an issue with XCVU190-2FLGB2104E, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU190-2FLGB2104E part is unused and in its original packaging.
Return procedure for XCVU190-2FLGB2104E:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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