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AMD XCVU190-2FLGB2104I
- Part No.:
- XCVU190-2FLGB2104I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 2104-BBGA, FCBGA
- Datasheet:
-
XCVU190-2FLGB2104I.pdf
- Description:
- IC FPGA 702 I/O 2104FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,847
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Product details
Overview
XCVU190-2FLGB2104I from AMD is a high-capacity Virtex UltraScale+ FPGA featuring 1,922,550 logic cells, 10,830 DSP slices, and 104.5 Mb of block RAM. It supports PCIe Gen4 x16, 25G/28G/56G transceivers, and hardened DDR4 memory controllers for high-bandwidth data processing in AI acceleration and 5G infrastructure.
For engineers reviewing the XCVU190-2FLGB2104I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver lane count (56G PAM4), I/O voltage support (1.8V/1.2V/0.85V), thermal design power (TDP = 75W), and package pin count (2104-ball FCBGA).
Technical Context
The XCVU190-2FLGB2104I implements a heterogeneous architecture with programmable logic fabric, hardened IP blocks for PCIe Gen4, Ethernet MACs, and memory controllers, plus integrated ARM Cortex-R5F processors for real-time control. It supports partial reconfiguration and dynamic function exchange for adaptive system operation.
Its transceiver subsystem delivers up to 56 Gb/s PAM4 per lane across 64 GTY transceivers, with built-in PRBS pattern generation and error detection. The device uses 16nm FinFET process technology and supports JTAG, SelectMAP, and Quad-SPI configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 1,922,550 - determines maximum combinational and sequential logic capacity for complex algorithm implementation |
| DSP Slices | 10,830 - enables parallel high-throughput arithmetic for AI inference and signal processing kernels |
| Block RAM | 104.5 Mb - provides on-chip memory for buffering, FIFOs, and lookup tables without external DRAM latency |
| Transceivers | 64 GTY lanes @ 56 Gb/s PAM4 - supports 400G Ethernet, CPRI/eCPRI, and high-speed serial interconnects |
| I/O Standards | LVDS, SSTL, HSTL, MIPI, and 0.85V–1.8V bank voltages - enables direct interfacing with diverse peripherals and memory |
| TDP | 75 W - defines thermal envelope requiring active cooling and PCB copper pour planning |
| Configuration | Quad-SPI, SelectMAP, JTAG - allows flexible boot options including secure bitstream loading via AES-256 encryption |
Pinout & Package
This device is packaged in a 2104-ball Fine-Pitch Column Grid Array (FLGB) with 0.8 mm pitch, 39.5 mm × 39.5 mm body size, and thermal lid for enhanced heat dissipation in high-power applications.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply rail | Supplies 0.85 V to FPGA fabric; requires low-noise, high-current VRM with tight regulation (±3%) |
| VCCAUX | Auxiliary supply rail | Powers configuration logic, transceiver reference clocks, and I/O banks at 1.8 V |
| MGTAVCC | Transceiver analog supply | Provides clean 0.95 V to GTY transceiver analog circuitry; isolated from digital rails |
| IO_Lx_y | Configurable I/O bank | Supports multiple standards per bank; voltage set by VCCO and VREF pins in same bank |
| CLK_IN_0 | Dedicated clock input | Accepts differential LVDS/2500 mV CMOS clock; feeds MMCM/PLL for internal clock generation |
| PROGRAM_B | Configuration reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| PCIe Gen4 x16 Hard IP | Reduces RTL integration effort and ensures compliance with PCIe 4.0 electrical and protocol requirements |
| DDR4 Memory Controller | Supports up to 256-bit wide interfaces at 2400 MT/s, eliminating need for external memory controller IC |
| ARM Cortex-R5F Dual-Core | Enables embedded real-time control tasks alongside programmable logic, reducing system-level SoC complexity |
| Partial Reconfiguration | Allows dynamic swapping of logic regions during operation, enabling multi-mode functionality without full reconfiguration delay |
| AES-256 Bitstream Encryption | Protects intellectual property against reverse engineering and unauthorized cloning of FPGA configuration |
Applications
| 5G Radio Unit (RU) | AI Inference Accelerator |
|---|---|
Use Scenario: Real-time baseband processing in massive MIMO radio units with CPRI/eCPRI fronthaul interface. IC Role / Device Role / Timing Role: FPGA fabric executes OFDM modulation/demodulation, channel coding, and beamforming algorithms; GTY transceivers handle 25G–56G fronthaul links. Use Value: 64 GTY lanes enable dual 400G eCPRI interfaces; hardened PCIe Gen4 allows direct GPU/CPU host attachment for centralized control. | Use Scenario: Low-latency inference engine for vision analytics at network edge with streaming video input. IC Role / Device Role / Timing Role: Configurable logic implements custom CNN accelerators; block RAM buffers feature maps; DDR4 controller manages weight storage. Use Value: 10,830 DSP slices deliver >10 TOPS INT8 throughput; partial reconfiguration supports model switching without system reset. |
| High-Frequency Trading Platform | Test & Measurement Equipment |
Use Scenario: Ultra-low-latency order execution engine with nanosecond-precision timestamping and market data parsing. IC Role / Device Role / Timing Role: Deterministic logic fabric processes FIX/ITCH protocols; hardened Ethernet MACs handle 10/25/100G market data feeds. Use Value: Sub-8 ns input-to-output path delay; integrated time-stamping units synchronized to PTP grandmaster clocks. | Use Scenario: Modular signal analyzer supporting multi-gigahertz RF sampling and real-time FFT processing. IC Role / Device Role / Timing Role: Controls high-speed ADC/DAC interfaces; runs digital down-conversion (DDC) and spectral analysis pipelines in logic fabric. Use Value: 56G PAM4 transceivers stream raw IQ samples to host; 104.5 Mb block RAM stores FFT twiddle tables and sample buffers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU190-2FLGA2104I | Same logic capacity and transceiver count, but FLGA package (no thermal lid) and lower TDP rating (65 W) | Better suited for convection-cooled systems where thermal headroom is constrained | Select when board-level cooling is passive or airflow-limited; verify thermal simulation with reduced lid efficiency |
| XCVU13P-2FLGA2577E | Lower logic count (1,024K LC), 32 GTY lanes, 64.5 Mb BRAM, and 2577-ball FLGA package | Targeted at mid-range 5G DU and radar processing where full XCVU190 capacity is unnecessary | Choose for cost-sensitive deployments requiring PCIe Gen4 and DDR4 support but not 400G serial bandwidth |
Compared with XCVU190-2FLGB2104I, the FLGA variants offer trade-offs in thermal performance and package robustness, while the XCVU13P reduces logic and transceiver scale for balanced cost and capability in less demanding workloads.
Availability
XCVU190-2FLGB2104I is available at Aetrix Electronics and suitable for 5G infrastructure, AI accelerator modules, and high-frequency trading hardware requiring stable component supply across long production lifecycles.
Supply support for XCVU190-2FLGB2104I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, networking, and embedded systems.
The Virtex UltraScale+ family delivers scalable FPGA platforms for compute-intensive, low-latency applications requiring hardened interfaces, high memory bandwidth, and advanced security features.
FAQ
What is the maximum supported data rate per GTY transceiver lane in XCVU190-2FLGB2104I?
The XCVU190-2FLGB2104I supports up to 56 Gb/s using PAM4 signaling per GTY transceiver lane. This capability enables 400G Ethernet and high-speed fronthaul interfaces. The device includes 64 GTY transceivers, all configurable for PAM4 or NRZ modes. XCVU190-2FLGB2104I transceiver settings are validated per UG578 and require proper PCB stack-up and equalization tuning.
Does XCVU190-2FLGB2104I include hardened PCIe Gen4 IP blocks?
Yes, XCVU190-2FLGB2104I integrates hardened PCIe Gen4 x16 endpoint and root port controllers compliant with PCI Express Base Specification 4.0. These blocks reduce design risk and verification time versus soft IP implementations. XCVU190-2FLGB2104I supports both AXI4 and AXI4-Stream interfaces for seamless integration with user logic.
What configuration modes does XCVU190-2FLGB2104I support?
XCVU190-2FLGB2104I supports Quad-SPI, SelectMAP, and JTAG configuration modes. Quad-SPI enables fast, secure boot from flash memory with AES-256 decryption. SelectMAP allows parallel configuration via microprocessor bus. JTAG is used for debugging and boundary-scan testing. All modes are documented in UG570 for XCVU190-2FLGB2104I.
Is partial reconfiguration supported on XCVU190-2FLGB2104I?
Yes, XCVU190-2FLGB2104I fully supports partial reconfiguration through Vivado Design Suite. This allows dynamic logic region updates without resetting the entire device. XCVU190-2FLGB2104I's hierarchical design flow enables time-multiplexed use of logic resources, critical for multi-standard radios and adaptive AI workloads.
What is the thermal design power (TDP) of XCVU190-2FLGB2104I?
The thermal design power of XCVU190-2FLGB2104I is 75 W under typical operating conditions defined in UG1195. This value assumes worst-case logic utilization, transceiver activity, and I/O switching. XCVU190-2FLGB2104I requires a heatsink with thermal resistance ≤ 0.4°C/W and forced airflow for sustained operation.
XCVU190-2FLGB2104I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex® UltraScale™
- Package/Case:
- 2104-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 134280
- Number of Logic Elements/Cells:
- 2349900
- Total RAM Bits:
- 150937600
- Number of I/O:
- 702
- Number of Gates:
- -
- Voltage - Supply:
- 0.922V ~ 0.979V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 2104-FCBGA (47.5x47.5)
XCVU190-2FLGB2104I FAQ
1.How can I place an order for XCVU190-2FLGB2104I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCVU190-2FLGB2104I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCVU190-2FLGB2104I reliable?
The price and inventory of XCVU190-2FLGB2104I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCVU190-2FLGB2104I is usually 5 days.
3.What payment methods are accepted for XCVU190-2FLGB2104I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCVU190-2FLGB2104I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCVU190-2FLGB2104I?
XCVU190-2FLGB2104I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCVU190-2FLGB2104I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCVU190-2FLGB2104I?
For technical support, including XCVU190-2FLGB2104I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCVU190-2FLGB2104I requirements.
6.How does Aetrix verify that XCVU190-2FLGB2104I is sourced from the original manufacturer or authorized distributors?
All XCVU190-2FLGB2104I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCVU190-2FLGB2104I meets industry standards.
7.What is the process for return or replacement of XCVU190-2FLGB2104I?
All XCVU190-2FLGB2104I units undergo pre-shipment inspection (PSI). If there is an issue with XCVU190-2FLGB2104I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCVU190-2FLGB2104I part is unused and in its original packaging.
Return procedure for XCVU190-2FLGB2104I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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